DE2704471C2 - Verfahren zur Isolation von Halbleitergebieten - Google Patents
Verfahren zur Isolation von HalbleitergebietenInfo
- Publication number
- DE2704471C2 DE2704471C2 DE2704471A DE2704471A DE2704471C2 DE 2704471 C2 DE2704471 C2 DE 2704471C2 DE 2704471 A DE2704471 A DE 2704471A DE 2704471 A DE2704471 A DE 2704471A DE 2704471 C2 DE2704471 C2 DE 2704471C2
- Authority
- DE
- Germany
- Prior art keywords
- layer
- semiconductor
- conductivity type
- substrate
- epitaxial
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 title claims description 38
- 238000000034 method Methods 0.000 title claims description 25
- 238000002955 isolation Methods 0.000 title claims description 5
- 239000010410 layer Substances 0.000 claims description 60
- 239000000758 substrate Substances 0.000 claims description 27
- 239000002344 surface layer Substances 0.000 claims description 20
- 230000003647 oxidation Effects 0.000 claims description 13
- 238000007254 oxidation reaction Methods 0.000 claims description 13
- 238000005468 ion implantation Methods 0.000 claims description 6
- 239000012777 electrically insulating material Substances 0.000 claims 1
- 150000002500 ions Chemical class 0.000 description 10
- 238000011282 treatment Methods 0.000 description 9
- 238000002513 implantation Methods 0.000 description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 6
- 229910052710 silicon Inorganic materials 0.000 description 6
- 239000010703 silicon Substances 0.000 description 6
- 239000011810 insulating material Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 238000009792 diffusion process Methods 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 229910052814 silicon oxide Inorganic materials 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 230000000873 masking effect Effects 0.000 description 3
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- 238000000137 annealing Methods 0.000 description 2
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical group [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 239000002019 doping agent Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229910000040 hydrogen fluoride Inorganic materials 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- DDFHBQSCUXNBSA-UHFFFAOYSA-N 5-(5-carboxythiophen-2-yl)thiophene-2-carboxylic acid Chemical compound S1C(C(=O)O)=CC=C1C1=CC=C(C(O)=O)S1 DDFHBQSCUXNBSA-UHFFFAOYSA-N 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical group [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- -1 boron ions Chemical class 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- PNDPGZBMCMUPRI-UHFFFAOYSA-N iodine Chemical compound II PNDPGZBMCMUPRI-UHFFFAOYSA-N 0.000 description 1
- 230000004807 localization Effects 0.000 description 1
- 210000004072 lung Anatomy 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/74—Making of localized buried regions, e.g. buried collector layers, internal connections substrate contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/76202—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using a local oxidation of silicon, e.g. LOCOS, SWAMI, SILO
- H01L21/76205—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using a local oxidation of silicon, e.g. LOCOS, SWAMI, SILO in a region being recessed from the surface, e.g. in a recess, groove, tub or trench region
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Element Separation (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR7604169A FR2341201A1 (fr) | 1976-02-16 | 1976-02-16 | Procede d'isolement entre regions d'un dispositif semiconducteur et dispositif ainsi obtenu |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE2704471A1 DE2704471A1 (de) | 1977-08-18 |
| DE2704471C2 true DE2704471C2 (de) | 1983-08-11 |
Family
ID=9169154
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE2704471A Expired DE2704471C2 (de) | 1976-02-16 | 1977-02-03 | Verfahren zur Isolation von Halbleitergebieten |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US4113513A (enExample) |
| JP (1) | JPS5299767A (enExample) |
| AU (1) | AU505245B2 (enExample) |
| CA (1) | CA1075374A (enExample) |
| DE (1) | DE2704471C2 (enExample) |
| FR (1) | FR2341201A1 (enExample) |
| GB (1) | GB1572854A (enExample) |
| IT (1) | IT1076585B (enExample) |
| NL (1) | NL176622C (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4247862B1 (en) * | 1977-08-26 | 1995-12-26 | Intel Corp | Ionzation resistant mos structure |
| JPS56150135A (en) * | 1980-01-18 | 1981-11-20 | British Steel Corp | Binary steel |
| US4362574A (en) * | 1980-07-09 | 1982-12-07 | Raytheon Company | Integrated circuit and manufacturing method |
| US4381956A (en) * | 1981-04-06 | 1983-05-03 | Motorola, Inc. | Self-aligned buried channel fabrication process |
| US9941353B2 (en) * | 2016-05-20 | 2018-04-10 | Newport Fab, Llc | Structure and method for mitigating substrate parasitics in bulk high resistivity substrate technology |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3386865A (en) * | 1965-05-10 | 1968-06-04 | Ibm | Process of making planar semiconductor devices isolated by encapsulating oxide filled channels |
| NL7010208A (enExample) * | 1966-10-05 | 1972-01-12 | Philips Nv | |
| JPS4836598B1 (enExample) * | 1969-09-05 | 1973-11-06 | ||
| NL169121C (nl) * | 1970-07-10 | 1982-06-01 | Philips Nv | Werkwijze voor het vervaardigen van een halfgeleiderinrichting met een halfgeleiderlichaam, dat aan een oppervlak is voorzien van een althans ten dele in het halfgeleiderlichaam verzonken, door thermische oxydatie gevormd oxydepatroon. |
| US3748187A (en) * | 1971-08-03 | 1973-07-24 | Hughes Aircraft Co | Self-registered doped layer for preventing field inversion in mis circuits |
| JPS5228550B2 (enExample) * | 1972-10-04 | 1977-07-27 | ||
| US3886000A (en) * | 1973-11-05 | 1975-05-27 | Ibm | Method for controlling dielectric isolation of a semiconductor device |
| JPS5546059B2 (enExample) * | 1973-12-22 | 1980-11-21 | ||
| US4023195A (en) * | 1974-10-23 | 1977-05-10 | Smc Microsystems Corporation | MOS field-effect transistor structure with mesa-like contact and gate areas and selectively deeper junctions |
| US4011105A (en) * | 1975-09-15 | 1977-03-08 | Mos Technology, Inc. | Field inversion control for n-channel device integrated circuits |
-
1976
- 1976-02-16 FR FR7604169A patent/FR2341201A1/fr active Granted
-
1977
- 1977-02-01 US US05/764,587 patent/US4113513A/en not_active Expired - Lifetime
- 1977-02-03 DE DE2704471A patent/DE2704471C2/de not_active Expired
- 1977-02-10 CA CA271,539A patent/CA1075374A/en not_active Expired
- 1977-02-11 IT IT20241/77A patent/IT1076585B/it active
- 1977-02-11 GB GB5706/77A patent/GB1572854A/en not_active Expired
- 1977-02-12 JP JP1454677A patent/JPS5299767A/ja active Granted
- 1977-02-14 NL NLAANVRAGE7701511,A patent/NL176622C/xx not_active Application Discontinuation
- 1977-02-14 AU AU22241/77A patent/AU505245B2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| NL7701511A (nl) | 1977-08-18 |
| GB1572854A (en) | 1980-08-06 |
| US4113513A (en) | 1978-09-12 |
| AU2224177A (en) | 1978-08-24 |
| FR2341201B1 (enExample) | 1980-05-09 |
| NL176622C (nl) | 1985-05-01 |
| NL176622B (nl) | 1984-12-03 |
| IT1076585B (it) | 1985-04-27 |
| AU505245B2 (en) | 1979-11-15 |
| DE2704471A1 (de) | 1977-08-18 |
| CA1075374A (en) | 1980-04-08 |
| JPS5299767A (en) | 1977-08-22 |
| FR2341201A1 (fr) | 1977-09-09 |
| JPS5439708B2 (enExample) | 1979-11-29 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| OD | Request for examination | ||
| 8126 | Change of the secondary classification |
Ipc: H01L 21/76 |
|
| D2 | Grant after examination | ||
| 8364 | No opposition during term of opposition | ||
| 8339 | Ceased/non-payment of the annual fee |