DE2652294C2 - Verfahren zum Herstellen eingelegter Oxidbereiche in Halbleitersubstraten - Google Patents

Verfahren zum Herstellen eingelegter Oxidbereiche in Halbleitersubstraten

Info

Publication number
DE2652294C2
DE2652294C2 DE2652294A DE2652294A DE2652294C2 DE 2652294 C2 DE2652294 C2 DE 2652294C2 DE 2652294 A DE2652294 A DE 2652294A DE 2652294 A DE2652294 A DE 2652294A DE 2652294 C2 DE2652294 C2 DE 2652294C2
Authority
DE
Germany
Prior art keywords
silicon
areas
porous
oxidized
steam
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE2652294A
Other languages
German (de)
English (en)
Other versions
DE2652294A1 (de
Inventor
Joseph Adam Peekskill N.Y. Aboaf
Robert Wallace Hopewell Junction N.Y. Broadie
William Aaron Poughkeepsie N.Y. Pliskin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of DE2652294A1 publication Critical patent/DE2652294A1/de
Application granted granted Critical
Publication of DE2652294C2 publication Critical patent/DE2652294C2/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
    • H01L21/02203—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being porous
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
    • H01L21/02227—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process
    • H01L21/02255—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02296—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
    • H01L21/02318—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment
    • H01L21/02337—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment treatment by exposure to a gas or vapour
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
    • H01L21/76245—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using full isolation by porous oxide silicon, i.e. FIPOS techniques
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
    • H01L21/02227—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process
    • H01L21/0223—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by oxidation, e.g. oxidation of the substrate
    • H01L21/02233—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by oxidation, e.g. oxidation of the substrate of the semiconductor substrate or a semiconductor layer
    • H01L21/02236—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by oxidation, e.g. oxidation of the substrate of the semiconductor substrate or a semiconductor layer group IV semiconductor
    • H01L21/02238—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by oxidation, e.g. oxidation of the substrate of the semiconductor substrate or a semiconductor layer group IV semiconductor silicon in uncombined form, i.e. pure silicon
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/003—Anneal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/085—Isolated-integrated
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/117—Oxidation, selective
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/118—Oxide films

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Element Separation (AREA)
  • Formation Of Insulating Films (AREA)
  • Bipolar Transistors (AREA)
DE2652294A 1975-11-28 1976-11-17 Verfahren zum Herstellen eingelegter Oxidbereiche in Halbleitersubstraten Expired DE2652294C2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/636,243 US4016017A (en) 1975-11-28 1975-11-28 Integrated circuit isolation structure and method for producing the isolation structure

Publications (2)

Publication Number Publication Date
DE2652294A1 DE2652294A1 (de) 1977-10-13
DE2652294C2 true DE2652294C2 (de) 1983-08-18

Family

ID=24551058

Family Applications (1)

Application Number Title Priority Date Filing Date
DE2652294A Expired DE2652294C2 (de) 1975-11-28 1976-11-17 Verfahren zum Herstellen eingelegter Oxidbereiche in Halbleitersubstraten

Country Status (15)

Country Link
US (1) US4016017A (enExample)
JP (1) JPS5267582A (enExample)
AU (1) AU498236B2 (enExample)
BE (1) BE847183A (enExample)
BR (1) BR7607985A (enExample)
CA (1) CA1066815A (enExample)
CH (1) CH597691A5 (enExample)
DE (1) DE2652294C2 (enExample)
ES (1) ES453591A1 (enExample)
FR (1) FR2333349A1 (enExample)
GB (1) GB1497499A (enExample)
IT (1) IT1072608B (enExample)
NL (1) NL7611938A (enExample)
SE (1) SE407719B (enExample)
ZA (1) ZA766145B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19810825A1 (de) * 1998-03-12 1999-09-16 Siemens Ag Integrierte elektronische Schaltungsanordnung und Verfahren zu ihrer Herstellung

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2038548B (en) * 1978-10-27 1983-03-23 Nippon Telegraph & Telephone Isolating semiconductor device by porous silicon oxide
FR2472268A1 (fr) * 1979-12-21 1981-06-26 Thomson Csf Procede de formation de caisson dans des circuits integres
EP0055521B1 (en) * 1980-11-29 1985-05-22 Kabushiki Kaisha Toshiba Method of filling a groove in a semiconductor substrate
US4532700A (en) * 1984-04-27 1985-08-06 International Business Machines Corporation Method of manufacturing semiconductor structures having an oxidized porous silicon isolation layer
US4628591A (en) * 1984-10-31 1986-12-16 Texas Instruments Incorporated Method for obtaining full oxide isolation of epitaxial islands in silicon utilizing selective oxidation of porous silicon
US4627883A (en) * 1985-04-01 1986-12-09 Gte Laboratories Incorporated Method of forming an isolated semiconductor structure
US4665010A (en) * 1985-04-29 1987-05-12 International Business Machines Corporation Method of fabricating photopolymer isolation trenches in the surface of a semiconductor wafer
GB2210728B (en) * 1987-10-07 1991-11-13 Stc Plc Isolation trenches for semiconductors
US4910165A (en) * 1988-11-04 1990-03-20 Ncr Corporation Method for forming epitaxial silicon on insulator structures using oxidized porous silicon
US5023200A (en) * 1988-11-22 1991-06-11 The United States Of America As Represented By The United States Department Of Energy Formation of multiple levels of porous silicon for buried insulators and conductors in silicon device technologies
US5110755A (en) * 1990-01-04 1992-05-05 Westinghouse Electric Corp. Process for forming a component insulator on a silicon substrate
JPH04120732A (ja) * 1990-09-12 1992-04-21 Hitachi Ltd 固体素子及びその製造方法
US5217920A (en) * 1992-06-18 1993-06-08 Motorola, Inc. Method of forming substrate contact trenches and isolation trenches using anodization for isolation
JP2945221B2 (ja) * 1992-11-19 1999-09-06 ワイケイケイ株式会社 高靭性アルミナ系複合焼結体の製造方法
US5421958A (en) * 1993-06-07 1995-06-06 The United States Of America As Represented By The Administrator Of The United States National Aeronautics And Space Administration Selective formation of porous silicon
US5707888A (en) * 1995-05-04 1998-01-13 Lsi Logic Corporation Oxide formed in semiconductor substrate by implantation of substrate with a noble gas prior to oxidation
CA2182442C (en) * 1995-08-02 2000-10-24 Kiyofumi Sakaguchi Semiconductor substrate and fabrication method for the same
US5863826A (en) * 1996-08-02 1999-01-26 Micron Technology, Inc. CMOS isolation utilizing enhanced oxidation of recessed porous silicon formed by light ion implantation
US5877069A (en) * 1996-09-16 1999-03-02 Micron Technology, Inc. Method for electrochemical local oxidation of silicon
FR2766012B1 (fr) * 1997-07-08 2001-01-19 France Telecom Procede de minimisation de l'effet de coin par densification de la couche isolante
US6710538B1 (en) * 1998-08-26 2004-03-23 Micron Technology, Inc. Field emission display having reduced power requirements and method
US6387777B1 (en) 1998-09-02 2002-05-14 Kelly T. Hurley Variable temperature LOCOS process
US5950094A (en) * 1999-02-18 1999-09-07 Taiwan Semiconductor Manufacturing Company, Ltd. Method for fabricating fully dielectric isolated silicon (FDIS)
US6277662B1 (en) * 1999-06-03 2001-08-21 Seiichi Nagata Silicon substrate and forming method thereof
US6312581B1 (en) * 1999-11-30 2001-11-06 Agere Systems Optoelectronics Guardian Corp. Process for fabricating an optical device
US6348706B1 (en) * 2000-03-20 2002-02-19 Micron Technology, Inc. Method to form etch and/or CMP stop layers
DE10065026A1 (de) * 2000-12-23 2002-07-04 Bosch Gmbh Robert Mikromechanisches Bauelement und entsprechendes Herstellungsverfahren
TW556311B (en) * 2001-07-31 2003-10-01 Infineon Technologies Ag Method for filling trenches in integrated semiconductor circuits
US7465642B2 (en) * 2005-10-28 2008-12-16 International Business Machines Corporation Methods for forming semiconductor structures with buried isolation collars
FR3011124A1 (fr) * 2013-09-26 2015-03-27 St Microelectronics Tours Sas Composant scr a caracteristiques stables en temperature

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4919030B1 (enExample) * 1969-01-29 1974-05-14
US3640806A (en) * 1970-01-05 1972-02-08 Nippon Telegraph & Telephone Semiconductor device and method of producing the same
US3919060A (en) * 1974-06-14 1975-11-11 Ibm Method of fabricating semiconductor device embodying dielectric isolation

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19810825A1 (de) * 1998-03-12 1999-09-16 Siemens Ag Integrierte elektronische Schaltungsanordnung und Verfahren zu ihrer Herstellung

Also Published As

Publication number Publication date
SE407719B (sv) 1979-04-09
NL7611938A (nl) 1977-06-01
BE847183A (fr) 1977-01-31
US4016017A (en) 1977-04-05
FR2333349A1 (fr) 1977-06-24
CA1066815A (en) 1979-11-20
GB1497499A (en) 1978-01-12
DE2652294A1 (de) 1977-10-13
SE7613281L (sv) 1977-05-29
IT1072608B (it) 1985-04-10
BR7607985A (pt) 1977-11-08
CH597691A5 (enExample) 1978-04-14
ZA766145B (en) 1978-05-30
ES453591A1 (es) 1977-12-01
AU2029176A (en) 1978-06-15
FR2333349B1 (enExample) 1980-04-30
AU498236B2 (en) 1979-02-22
JPS5267582A (en) 1977-06-04
JPS5751939B2 (enExample) 1982-11-05

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Legal Events

Date Code Title Description
8181 Inventor (new situation)

Free format text: ABOAF, JOSEPH ADAM, PEEKSKILL, N.Y., US BROADIE, ROBERT WALLACE, HOPEWELL JUNCTION, N.Y., US PLISKIN, WILLIAM AARON, POUGHKEEPSIE, N.Y., US

D2 Grant after examination
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee