DE2648274A1 - Verfahren zum selektiven elektroplattieren eines bereiches einer oberflaeche - Google Patents

Verfahren zum selektiven elektroplattieren eines bereiches einer oberflaeche

Info

Publication number
DE2648274A1
DE2648274A1 DE19762648274 DE2648274A DE2648274A1 DE 2648274 A1 DE2648274 A1 DE 2648274A1 DE 19762648274 DE19762648274 DE 19762648274 DE 2648274 A DE2648274 A DE 2648274A DE 2648274 A1 DE2648274 A1 DE 2648274A1
Authority
DE
Germany
Prior art keywords
electrolyte
area
dielectric
electroplated
electroplating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE19762648274
Other languages
German (de)
English (en)
Inventor
John Louis Bestel
Richard Haynes
Venkataraman Sprinivasan
N J Township
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
Western Electric Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Western Electric Co Inc filed Critical Western Electric Co Inc
Publication of DE2648274A1 publication Critical patent/DE2648274A1/de
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/243—Reinforcing the conductive pattern characterised by selective plating, e.g. for finish plating of pads
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S204/00—Chemistry: electrical and wave energy
    • Y10S204/07—Current distribution within the bath

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
DE19762648274 1975-10-30 1976-10-25 Verfahren zum selektiven elektroplattieren eines bereiches einer oberflaeche Pending DE2648274A1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US62731775A 1975-10-30 1975-10-30
US05/703,326 US4033833A (en) 1975-10-30 1976-07-08 Method of selectively electroplating an area of a surface

Publications (1)

Publication Number Publication Date
DE2648274A1 true DE2648274A1 (de) 1977-05-05

Family

ID=27090403

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19762648274 Pending DE2648274A1 (de) 1975-10-30 1976-10-25 Verfahren zum selektiven elektroplattieren eines bereiches einer oberflaeche

Country Status (11)

Country Link
US (1) US4033833A (enExample)
JP (1) JPS5254626A (enExample)
AU (1) AU502981B2 (enExample)
CA (1) CA1070635A (enExample)
CH (1) CH610356A5 (enExample)
DE (1) DE2648274A1 (enExample)
ES (1) ES452841A1 (enExample)
FR (1) FR2329774A1 (enExample)
GB (1) GB1556226A (enExample)
NL (1) NL7611952A (enExample)
SE (1) SE7611709L (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004034078B4 (de) * 2004-07-15 2014-02-13 Robert Bosch Gmbh Verfahren zur Erzeugung einer lokalen Beschichtung

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US4340449A (en) * 1977-10-11 1982-07-20 Texas Instruments Incorporated Method for selectively electroplating portions of articles
US4224117A (en) * 1979-04-18 1980-09-23 Western Electric Company, Inc. Methods of and apparatus for selective plating
US4229269A (en) * 1979-10-01 1980-10-21 Bell Telephone Laboratories, Incorporated Spray cell for selective metal deposition or removal
DE3015282C2 (de) * 1980-04-21 1986-07-17 Siemens AG, 1000 Berlin und 8000 München Vorrichtung zum partiellen Galvanisieren von leitenden oder leitend gemachten Oberflächen
US4367123A (en) * 1980-07-09 1983-01-04 Olin Corporation Precision spot plating process and apparatus
US4437943A (en) 1980-07-09 1984-03-20 Olin Corporation Method and apparatus for bonding metal wire to a base metal substrate
JPS60130151A (ja) * 1983-12-16 1985-07-11 Toppan Printing Co Ltd リ−ドフレ−ムの製造方法
US4870272A (en) * 1988-10-24 1989-09-26 International Business Machines Corporation Transducer adjustment apparatus for shaft encoder
US5018645A (en) * 1990-01-30 1991-05-28 Zinsmeyer Herbert G Automotive fluids dispensing and blending system
US5545429A (en) * 1994-07-01 1996-08-13 International Business Machines Corporation Fabrication of double side fully metallized plated thru-holes, in polymer structures, without seeding or photoprocess
GB2336161B (en) 1998-04-06 2003-03-26 John Michael Lowe Method of providing conductive tracks on a printed circuit and apparatus for use in carrying out the method
US6939447B2 (en) 1998-04-06 2005-09-06 Tdao Limited Method of providing conductive tracks on a printed circuit and apparatus for use in carrying out the method
US6919010B1 (en) 2001-06-28 2005-07-19 Novellus Systems, Inc. Uniform electroplating of thin metal seeded wafers using rotationally asymmetric variable anode correction
US6576113B1 (en) * 1999-10-29 2003-06-10 California Institute Of Technology Method of electroplating of high aspect ratio metal structures into semiconductors
US8308931B2 (en) * 2006-08-16 2012-11-13 Novellus Systems, Inc. Method and apparatus for electroplating
US8475636B2 (en) 2008-11-07 2013-07-02 Novellus Systems, Inc. Method and apparatus for electroplating
JP2002016181A (ja) * 2000-04-25 2002-01-18 Torex Semiconductor Ltd 半導体装置、その製造方法、及び電着フレーム
US7622024B1 (en) 2000-05-10 2009-11-24 Novellus Systems, Inc. High resistance ionic current source
US6821407B1 (en) 2000-05-10 2004-11-23 Novellus Systems, Inc. Anode and anode chamber for copper electroplating
US6527920B1 (en) 2000-05-10 2003-03-04 Novellus Systems, Inc. Copper electroplating apparatus
TW550177B (en) * 2000-05-19 2003-09-01 Hewlett Packard Co Alloy and orifice plate for an ink-jet pen using the same
TW525216B (en) 2000-12-11 2003-03-21 Semiconductor Energy Lab Semiconductor device, and manufacturing method thereof
SG111923A1 (en) 2000-12-21 2005-06-29 Semiconductor Energy Lab Light emitting device and method of manufacturing the same
US7682498B1 (en) 2001-06-28 2010-03-23 Novellus Systems, Inc. Rotationally asymmetric variable electrode correction
US6720263B2 (en) 2001-10-16 2004-04-13 Applied Materials Inc. Planarization of metal layers on a semiconductor wafer through non-contact de-plating and control with endpoint detection
US7094684B2 (en) * 2002-09-20 2006-08-22 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method of semiconductor device
CN100578573C (zh) * 2002-09-20 2010-01-06 株式会社半导体能源研究所 显示器件及其制造方法
GB0303397D0 (en) * 2003-02-14 2003-03-19 Technology Dev Associate Opera Electro-plating method and apparatus
US8623193B1 (en) 2004-06-16 2014-01-07 Novellus Systems, Inc. Method of electroplating using a high resistance ionic current source
US7799684B1 (en) 2007-03-05 2010-09-21 Novellus Systems, Inc. Two step process for uniform across wafer deposition and void free filling on ruthenium coated wafers
CN101368284B (zh) * 2007-08-15 2010-10-06 富葵精密组件(深圳)有限公司 电镀装置
US20090065365A1 (en) * 2007-09-11 2009-03-12 Asm Nutool, Inc. Method and apparatus for copper electroplating
US7964506B1 (en) 2008-03-06 2011-06-21 Novellus Systems, Inc. Two step copper electroplating process with anneal for uniform across wafer deposition and void free filling on ruthenium coated wafers
US8513124B1 (en) 2008-03-06 2013-08-20 Novellus Systems, Inc. Copper electroplating process for uniform across wafer deposition and void free filling on semi-noble metal coated wafers
US8703615B1 (en) 2008-03-06 2014-04-22 Novellus Systems, Inc. Copper electroplating process for uniform across wafer deposition and void free filling on ruthenium coated wafers
US20120261254A1 (en) 2011-04-15 2012-10-18 Reid Jonathan D Method and apparatus for filling interconnect structures
US8475637B2 (en) * 2008-12-17 2013-07-02 Novellus Systems, Inc. Electroplating apparatus with vented electrolyte manifold
US8262871B1 (en) 2008-12-19 2012-09-11 Novellus Systems, Inc. Plating method and apparatus with multiple internally irrigated chambers
US9583125B1 (en) * 2009-12-16 2017-02-28 Magnecomp Corporation Low resistance interface metal for disk drive suspension component grounding
US10094034B2 (en) 2015-08-28 2018-10-09 Lam Research Corporation Edge flow element for electroplating apparatus
US8795480B2 (en) 2010-07-02 2014-08-05 Novellus Systems, Inc. Control of electrolyte hydrodynamics for efficient mass transfer during electroplating
US9523155B2 (en) 2012-12-12 2016-12-20 Novellus Systems, Inc. Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating
US9624592B2 (en) 2010-07-02 2017-04-18 Novellus Systems, Inc. Cross flow manifold for electroplating apparatus
US10233556B2 (en) 2010-07-02 2019-03-19 Lam Research Corporation Dynamic modulation of cross flow manifold during electroplating
US9670588B2 (en) 2013-05-01 2017-06-06 Lam Research Corporation Anisotropic high resistance ionic current source (AHRICS)
US9449808B2 (en) 2013-05-29 2016-09-20 Novellus Systems, Inc. Apparatus for advanced packaging applications
US9677190B2 (en) 2013-11-01 2017-06-13 Lam Research Corporation Membrane design for reducing defects in electroplating systems
US9816194B2 (en) 2015-03-19 2017-11-14 Lam Research Corporation Control of electrolyte flow dynamics for uniform electroplating
US10014170B2 (en) 2015-05-14 2018-07-03 Lam Research Corporation Apparatus and method for electrodeposition of metals with the use of an ionically resistive ionically permeable element having spatially tailored resistivity
US10364505B2 (en) 2016-05-24 2019-07-30 Lam Research Corporation Dynamic modulation of cross flow manifold during elecroplating
US11001934B2 (en) 2017-08-21 2021-05-11 Lam Research Corporation Methods and apparatus for flow isolation and focusing during electroplating
US10781527B2 (en) 2017-09-18 2020-09-22 Lam Research Corporation Methods and apparatus for controlling delivery of cross flowing and impinging electrolyte during electroplating

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GB1396342A (en) 1972-05-24 1975-06-04 Galentan Ag Plating apparatus
US2750332A (en) * 1952-06-04 1956-06-12 Pittsburgh Plate Glass Co Method and apparatus for electrodeposition of a layer of uniform thickness on a conductive surface
US2828255A (en) * 1953-02-01 1958-03-25 Wmf Wuerttemberg Metallwaren Apparatus for producing galvanic coatings
GB775359A (en) 1953-02-12 1957-05-22 Wmf Wuerttemberg Metallwaren Improvements relating to electro-deposition
US2854387A (en) * 1955-11-21 1958-09-30 Philco Corp Method of jet plating
US2945789A (en) * 1955-11-25 1960-07-19 Philco Corp Method for fabricating metal-semiconductor alloyed regions
US2873232A (en) * 1956-06-18 1959-02-10 Philco Corp Method of jet plating
US3137645A (en) * 1961-10-04 1964-06-16 Philco Corp Jet electrolytic treating apparatus
US3334028A (en) * 1966-08-02 1967-08-01 Day Company Method of electroplating selected areas
US3692639A (en) * 1969-10-13 1972-09-19 Center Scient & Applied Res Multiplication of metal surface,by electroplating or anodic dissolution
US3692638A (en) 1970-12-21 1972-09-19 Western Electric Co Process for supporting and nonuniformly treating articles
US3723283A (en) * 1970-12-23 1973-03-27 Select Au Matic Selective plating system
JPS5146143Y2 (enExample) * 1971-03-26 1976-11-08
US3788963A (en) * 1972-01-13 1974-01-29 Auric Corp Apparatus for intermittent electroplating strips
US3814117A (en) * 1972-06-19 1974-06-04 Western Electric Co Nonuniformly treating articles and supporting them therefor
US3810829A (en) * 1972-06-28 1974-05-14 Nasa Scanning nozzle plating system
US3891534A (en) * 1973-11-05 1975-06-24 Ford Motor Co Electroplating system for improving plating distribution of elnisil coatings
JPS5091534A (enExample) * 1973-12-15 1975-07-22
US3894918A (en) * 1973-12-20 1975-07-15 Western Electric Co Methods of treating portions of articles
US3897323A (en) * 1974-08-05 1975-07-29 Motorola Inc Apparatus for selective plating

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004034078B4 (de) * 2004-07-15 2014-02-13 Robert Bosch Gmbh Verfahren zur Erzeugung einer lokalen Beschichtung

Also Published As

Publication number Publication date
GB1556226A (en) 1979-11-21
FR2329774B1 (enExample) 1979-08-24
NL7611952A (nl) 1977-05-03
SE7611709L (sv) 1977-05-01
JPS5254626A (en) 1977-05-04
ES452841A1 (es) 1977-10-16
FR2329774A1 (fr) 1977-05-27
CH610356A5 (enExample) 1979-04-12
AU502981B2 (en) 1979-08-16
AU1904176A (en) 1978-05-04
CA1070635A (en) 1980-01-29
US4033833A (en) 1977-07-05

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