DE2552641B2 - Verfahren zur Herstellung von Halbleiterbauelementen - Google Patents
Verfahren zur Herstellung von HalbleiterbauelementenInfo
- Publication number
- DE2552641B2 DE2552641B2 DE2552641A DE2552641A DE2552641B2 DE 2552641 B2 DE2552641 B2 DE 2552641B2 DE 2552641 A DE2552641 A DE 2552641A DE 2552641 A DE2552641 A DE 2552641A DE 2552641 B2 DE2552641 B2 DE 2552641B2
- Authority
- DE
- Germany
- Prior art keywords
- layer
- diffusion mask
- alloy
- active diffusion
- masking
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000000034 method Methods 0.000 title claims description 29
- 239000004065 semiconductor Substances 0.000 title claims description 26
- 230000008569 process Effects 0.000 title claims description 11
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- 238000009792 diffusion process Methods 0.000 claims description 76
- 239000000956 alloy Substances 0.000 claims description 55
- 229910045601 alloy Inorganic materials 0.000 claims description 55
- 230000000873 masking effect Effects 0.000 claims description 45
- 239000000758 substrate Substances 0.000 claims description 34
- 238000005530 etching Methods 0.000 claims description 29
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 claims description 24
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims description 24
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 claims description 15
- 229920002120 photoresistant polymer Polymers 0.000 claims description 15
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 claims description 13
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 12
- 235000011007 phosphoric acid Nutrition 0.000 claims description 12
- 239000005388 borosilicate glass Substances 0.000 claims description 9
- 239000005354 aluminosilicate glass Substances 0.000 claims description 8
- 230000003647 oxidation Effects 0.000 claims description 7
- 238000007254 oxidation reaction Methods 0.000 claims description 7
- 229960000583 acetic acid Drugs 0.000 claims description 6
- 235000012239 silicon dioxide Nutrition 0.000 claims description 6
- JKWMSGQKBLHBQQ-UHFFFAOYSA-N diboron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 claims description 5
- 239000012362 glacial acetic acid Substances 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 5
- 235000006408 oxalic acid Nutrition 0.000 claims description 5
- 239000000377 silicon dioxide Substances 0.000 claims description 5
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 4
- 229910052810 boron oxide Inorganic materials 0.000 claims description 4
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 4
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 3
- 229910052750 molybdenum Inorganic materials 0.000 claims description 3
- 239000011733 molybdenum Substances 0.000 claims description 3
- 238000004544 sputter deposition Methods 0.000 claims description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 2
- 239000002019 doping agent Substances 0.000 claims 4
- 229910052751 metal Inorganic materials 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 239000010410 layer Substances 0.000 description 170
- 230000015572 biosynthetic process Effects 0.000 description 11
- 239000000243 solution Substances 0.000 description 11
- 239000000654 additive Substances 0.000 description 8
- 230000000996 additive effect Effects 0.000 description 6
- 238000000206 photolithography Methods 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 238000000889 atomisation Methods 0.000 description 4
- 238000011161 development Methods 0.000 description 4
- 230000018109 developmental process Effects 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000012300 argon atmosphere Substances 0.000 description 3
- 238000001311 chemical methods and process Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000007800 oxidant agent Substances 0.000 description 3
- 230000001590 oxidative effect Effects 0.000 description 3
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000008367 deionised water Substances 0.000 description 2
- 229910021641 deionized water Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229910017604 nitric acid Inorganic materials 0.000 description 2
- 230000035515 penetration Effects 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910011255 B2O3 Inorganic materials 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910001392 phosphorus oxide Inorganic materials 0.000 description 1
- 239000005360 phosphosilicate glass Substances 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- VSAISIQCTGDGPU-UHFFFAOYSA-N tetraphosphorus hexaoxide Chemical compound O1P(O2)OP3OP1OP2O3 VSAISIQCTGDGPU-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/033—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/22—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities
- H01L21/225—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities using diffusion into or out of a solid from or into a solid phase, e.g. a doped oxide layer
- H01L21/2251—Diffusion into or out of group IV semiconductors
- H01L21/2254—Diffusion into or out of group IV semiconductors from or through or into an applied layer, e.g. photoresist, nitrides
- H01L21/2255—Diffusion into or out of group IV semiconductors from or through or into an applied layer, e.g. photoresist, nitrides the applied layer comprising oxides only, e.g. P2O5, PSG, H3BO3, doped oxides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
- H01L21/31105—Etching inorganic layers
- H01L21/31111—Etching inorganic layers by chemical means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/32—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers using masks
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Weting (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SU742076968A SU653647A1 (ru) | 1974-11-25 | 1974-11-25 | Способ формировани источника базы при изготовлении транзисторных структур |
SU7402076899A SU521802A1 (ru) | 1974-11-25 | 1974-11-25 | Способ селективного формировани источника базы при изготовлении транзисторных структур |
Publications (2)
Publication Number | Publication Date |
---|---|
DE2552641A1 DE2552641A1 (de) | 1976-06-10 |
DE2552641B2 true DE2552641B2 (de) | 1979-03-29 |
Family
ID=26665540
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE2552641A Withdrawn DE2552641B2 (de) | 1974-11-25 | 1975-11-24 | Verfahren zur Herstellung von Halbleiterbauelementen |
Country Status (5)
Country | Link |
---|---|
CS (1) | CS180949B1 (en, 2012) |
DD (1) | DD121429A5 (en, 2012) |
DE (1) | DE2552641B2 (en, 2012) |
FR (1) | FR2292333A1 (en, 2012) |
HU (1) | HU172486B (en, 2012) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2454698A1 (fr) * | 1979-04-20 | 1980-11-14 | Radiotechnique Compelec | Procede de realisation de circuits integres a l'aide d'un masque multicouche et dispositifs obtenus par ce procede |
-
1975
- 1975-11-20 HU HU75JA00000746A patent/HU172486B/hu unknown
- 1975-11-21 CS CS7500007915A patent/CS180949B1/cs unknown
- 1975-11-21 DD DD189616A patent/DD121429A5/xx unknown
- 1975-11-24 DE DE2552641A patent/DE2552641B2/de not_active Withdrawn
- 1975-11-24 FR FR7535846A patent/FR2292333A1/fr active Granted
Also Published As
Publication number | Publication date |
---|---|
DE2552641A1 (de) | 1976-06-10 |
DD121429A5 (en, 2012) | 1976-07-20 |
CS180949B1 (en) | 1978-02-28 |
HU172486B (hu) | 1978-09-28 |
FR2292333B1 (en, 2012) | 1979-02-02 |
FR2292333A1 (fr) | 1976-06-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE1764056C2 (de) | Verfahren zum Herstellen einer Halbleiteranordnung | |
DE2414033C3 (de) | Verfahren zur Herstellung von Halbleitervorrichtungen mit selektiv auf einer Oberfläche eines Halbleitersubstrats angeordneten Schichten aus einem Oxid des Substratmaterials | |
DE2915024C2 (de) | Verfahren zum Herstellen eines MOS-Transistors | |
DE2721397C3 (de) | Verfahren zur Herstellung eines mindestens eine Planardiode enthaltenden HF-Halbleiterbauelementes | |
DE2646308C3 (de) | Verfahren zum Herstellen nahe beieinander liegender elektrisch leitender Schichten | |
EP0030640B1 (de) | Verfahren zum Anbringen einer selbstausrichtenden Gateelektrode in einem V-Metalloxid-Feldeffekttransistor | |
DE2703877A1 (de) | Mis-feldeffekttransistor mit kurzer kanallaenge | |
DE2229457A1 (de) | Verfahren zur herstellung eines halbleiterbauelementes | |
DE3939319A1 (de) | Asymmetrischer feldeffekttransistor und verfahren zu seiner herstellung | |
DE3024084A1 (de) | Verfahren zur herstellung von halbleiterbauelementen | |
DE1514915C2 (de) | Verfahren zum Herstellen einer Halbleiteranordnung mit einem extrem kleinflächigen pn-Übergang | |
DE69016840T2 (de) | Verfahren zur Herstellung eines lateralen Bipolartransistors. | |
DE2740757C2 (de) | Halbleiteranordnung und Verfahren zu deren Herstellung | |
DE2534132C3 (de) | Verfahren zur Herstellung einer Halbleiteranordnung | |
DE2645014C3 (de) | Verfahren zur Herstellung einer integrierten MOS-Schaltungsstrukrur mit doppelten Schichten aus polykristallinem Silizium auf einem Silizium-Substrat | |
DE3024295C2 (de) | Ionenmessfühler und Verfahren zu dessen Herstellung | |
DE2111633A1 (de) | Verfahren zur Herstellung eines Oberflaechen-Feldeffekt-Transistors | |
DE2157633C3 (de) | Verfahren zum Herstellen von Zonen einer monolithisch integrierten Festkörperschaltung | |
DE3226097C2 (en, 2012) | ||
DE2451486C2 (de) | Verfahren zum Herstellen von integrierten Halbleiteranordnungen | |
DE2020531C2 (de) | Verfahren zur Herstellung von Silizium-Höchstfrequenz-Planartransistoren | |
DE2552641B2 (de) | Verfahren zur Herstellung von Halbleiterbauelementen | |
DE2407189A1 (de) | Planare integrierte schaltung mit dielektrisch isolierter schottky-sperrschicht und verfahren zu deren herstellung | |
DE2111089A1 (de) | Verfahren zur Herstellung eines Halbleiterschaltelementes | |
EP0003733B1 (de) | Verfahren zur Erzeugung abgestufter Fenster in Materialschichten aus Isolations- bzw. Elektrodenmaterial für die Herstellung einer integrierten Halbleiterschaltung und nach diesem Verfahren hergestellter MIS-Feldeffekttransistor mit kurzer Kanallänge |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8239 | Disposal/non-payment of the annual fee |