DE2543674B2 - Verfahren zum Verzinnen von Leiterplatten - Google Patents

Verfahren zum Verzinnen von Leiterplatten

Info

Publication number
DE2543674B2
DE2543674B2 DE2543674A DE2543674A DE2543674B2 DE 2543674 B2 DE2543674 B2 DE 2543674B2 DE 2543674 A DE2543674 A DE 2543674A DE 2543674 A DE2543674 A DE 2543674A DE 2543674 B2 DE2543674 B2 DE 2543674B2
Authority
DE
Germany
Prior art keywords
conductor tracks
lines
conductor
circuit boards
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE2543674A
Other languages
German (de)
English (en)
Other versions
DE2543674A1 (de
Inventor
Egon Jaeger
Josef Tratz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Priority to DE2543674A priority Critical patent/DE2543674B2/de
Priority to CH925776A priority patent/CH610172A5/xx
Priority to AT599276A priority patent/AT346958B/de
Priority to US05/725,944 priority patent/US4084022A/en
Priority to FR7628784A priority patent/FR2326829A1/fr
Priority to IT27760/76A priority patent/IT1072549B/it
Publication of DE2543674A1 publication Critical patent/DE2543674A1/de
Publication of DE2543674B2 publication Critical patent/DE2543674B2/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/0287—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/0989—Coating free areas, e.g. areas other than pads or lands free of solder resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09909—Special local insulating pattern, e.g. as dam around component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/044—Solder dip coating, i.e. coating printed conductors, e.g. pads by dipping in molten solder or by wave soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/175—Configurations of connections suitable for easy deletion, e.g. modifiable circuits or temporary conductors for electroplating; Processes for deleting connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3468—Application of molten solder, e.g. dip soldering

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
DE2543674A 1975-09-30 1975-09-30 Verfahren zum Verzinnen von Leiterplatten Withdrawn DE2543674B2 (de)

Priority Applications (6)

Application Number Priority Date Filing Date Title
DE2543674A DE2543674B2 (de) 1975-09-30 1975-09-30 Verfahren zum Verzinnen von Leiterplatten
CH925776A CH610172A5 (https=) 1975-09-30 1976-07-19
AT599276A AT346958B (de) 1975-09-30 1976-08-12 Verfahren zum verzinnen von leiterplatten
US05/725,944 US4084022A (en) 1975-09-30 1976-09-23 Method for tin plating printed boards
FR7628784A FR2326829A1 (fr) 1975-09-30 1976-09-24 Procede pour etamer des plaquettes a circuit imprime
IT27760/76A IT1072549B (it) 1975-09-30 1976-09-29 Procedimento per stagnare piastre circuitali

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2543674A DE2543674B2 (de) 1975-09-30 1975-09-30 Verfahren zum Verzinnen von Leiterplatten

Publications (2)

Publication Number Publication Date
DE2543674A1 DE2543674A1 (de) 1977-03-31
DE2543674B2 true DE2543674B2 (de) 1978-11-23

Family

ID=5957879

Family Applications (1)

Application Number Title Priority Date Filing Date
DE2543674A Withdrawn DE2543674B2 (de) 1975-09-30 1975-09-30 Verfahren zum Verzinnen von Leiterplatten

Country Status (6)

Country Link
US (1) US4084022A (https=)
AT (1) AT346958B (https=)
CH (1) CH610172A5 (https=)
DE (1) DE2543674B2 (https=)
FR (1) FR2326829A1 (https=)
IT (1) IT1072549B (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4486466A (en) * 1979-01-12 1984-12-04 Kollmorgen Technologies Corporation High resolution screen printable resists
US4816070A (en) * 1985-08-29 1989-03-28 Techo Instruments Investments Ltd. Use of immersion tin and alloys as a bonding medium for multilayer circuits
US4715894A (en) * 1985-08-29 1987-12-29 Techno Instruments Investments 1983 Ltd. Use of immersion tin and tin alloys as a bonding medium for multilayer circuits
US5316788A (en) * 1991-07-26 1994-05-31 International Business Machines Corporation Applying solder to high density substrates
CN103343366A (zh) * 2013-07-23 2013-10-09 皆利士多层线路版(中山)有限公司 印制线路板的电镀锡方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB893479A (en) * 1957-08-06 1962-04-11 Pye Ltd Improvements in or relating to printed circuit boards
GB915181A (en) * 1958-12-12 1963-01-09 Coates Brothers & Co Printing process
US3090706A (en) * 1959-07-03 1963-05-21 Motorola Inc Printed circuit process

Also Published As

Publication number Publication date
FR2326829A1 (fr) 1977-04-29
AT346958B (de) 1978-12-11
ATA599276A (de) 1978-04-15
IT1072549B (it) 1985-04-10
DE2543674A1 (de) 1977-03-31
CH610172A5 (https=) 1979-03-30
US4084022A (en) 1978-04-11

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Legal Events

Date Code Title Description
8239 Disposal/non-payment of the annual fee