DE2535923C3 - Verfahren und Form zum Einkapseln elektrischer Bauteile - Google Patents

Verfahren und Form zum Einkapseln elektrischer Bauteile

Info

Publication number
DE2535923C3
DE2535923C3 DE2535923A DE2535923A DE2535923C3 DE 2535923 C3 DE2535923 C3 DE 2535923C3 DE 2535923 A DE2535923 A DE 2535923A DE 2535923 A DE2535923 A DE 2535923A DE 2535923 C3 DE2535923 C3 DE 2535923C3
Authority
DE
Germany
Prior art keywords
capsules
components
plastic material
holes
mold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE2535923A
Other languages
German (de)
English (en)
Other versions
DE2535923B2 (de
DE2535923A1 (de
Inventor
Arne Gudmund Kalmar Stroem (Schweden)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
RIFA KALMAR SE AB
Original Assignee
Telefonaktiebolaget LM Ericsson AB
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Telefonaktiebolaget LM Ericsson AB filed Critical Telefonaktiebolaget LM Ericsson AB
Publication of DE2535923A1 publication Critical patent/DE2535923A1/de
Publication of DE2535923B2 publication Critical patent/DE2535923B2/de
Application granted granted Critical
Publication of DE2535923C3 publication Critical patent/DE2535923C3/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/224—Housing; Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
    • H01G13/003—Apparatus or processes for encapsulating capacitors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/43—Electric condenser making
    • Y10T29/435—Solid dielectric type
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
    • Y10T29/49171—Assembling electrical component directly to terminal or elongated conductor with encapsulating
    • Y10T29/49172—Assembling electrical component directly to terminal or elongated conductor with encapsulating by molding of insulating material

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Details Of Resistors (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
DE2535923A 1974-09-19 1975-08-12 Verfahren und Form zum Einkapseln elektrischer Bauteile Expired DE2535923C3 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE7411786A SE389991B (sv) 1974-09-19 1974-09-19 Metod for kapsling av elektriska komponenter samt anordning herfor

Publications (3)

Publication Number Publication Date
DE2535923A1 DE2535923A1 (de) 1976-04-01
DE2535923B2 DE2535923B2 (de) 1977-07-14
DE2535923C3 true DE2535923C3 (de) 1980-11-13

Family

ID=20322167

Family Applications (1)

Application Number Title Priority Date Filing Date
DE2535923A Expired DE2535923C3 (de) 1974-09-19 1975-08-12 Verfahren und Form zum Einkapseln elektrischer Bauteile

Country Status (11)

Country Link
US (1) US4045867A (enExample)
JP (1) JPS5914882B2 (enExample)
BR (1) BR7505844A (enExample)
CA (1) CA1043974A (enExample)
CH (1) CH592354A5 (enExample)
DE (1) DE2535923C3 (enExample)
ES (1) ES440787A1 (enExample)
FR (1) FR2285225A1 (enExample)
GB (1) GB1509738A (enExample)
IT (1) IT1046891B (enExample)
SE (1) SE389991B (enExample)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4497756A (en) * 1981-10-05 1985-02-05 Gte Products Corporation Method of making a photoflash article using injection molding
FR2518808A1 (fr) * 1981-12-18 1983-06-24 Radiotechnique Compelec Procede et dispositif pour enrober un microassemblage
FR2549291B2 (fr) * 1982-10-29 1986-05-09 Radiotechnique Compelec Procede d'encapsulation de composants electroniques par extrusion de matiere plastique et applications a la fabrication de voyants lumineux et a l'encapsulation de circuits electroniques
IT1180514B (it) * 1984-07-27 1987-09-23 Arcotroniks Italia Spa Procedimento per la realizzazione di involucri protettivi in cui risultano annegati corrispondenti componenti elettrico elettronici
FR2590838B1 (fr) * 1985-12-04 1988-07-08 Plastic Omnium Cie Paniers pour le traitement de composants dans l'industrie des semiconducteurs et procede de fabrication de ces paniers
JPS62133768U (enExample) * 1986-02-14 1987-08-22
US4826931A (en) * 1986-10-09 1989-05-02 Mitsubishi Denki Kabushiki Kaisha Tablet for resin-molding semiconductor devices
US5387306A (en) * 1988-06-21 1995-02-07 Gec Avery Limited Manufacturing integrated circuit cards
GB2219960B (en) * 1988-06-21 1992-12-23 Avery Ltd W & T Manufacture of electronic tokens
US4895998A (en) * 1988-08-15 1990-01-23 Mcneil (Ohio) Corporation Encapsulated electrical component and method of making same
US5348475A (en) * 1991-05-08 1994-09-20 Jeneric/Pentron Inc. Trimodal method of curing dental restorative compositions
US5357399A (en) * 1992-09-25 1994-10-18 Avx Corporation Mass production method for the manufacture of surface mount solid state capacitor and resulting capacitor
JP2970338B2 (ja) * 1993-09-22 1999-11-02 住友電装株式会社 電線接続部の自動防水処理装置
US6173490B1 (en) * 1997-08-20 2001-01-16 National Semiconductor Corporation Method for forming a panel of packaged integrated circuits
US7632446B1 (en) * 2008-05-28 2009-12-15 Lincoln Global, Inc. System and method of sealing electrical components in a frame tray
CN105869928B (zh) * 2016-03-30 2018-10-12 安徽普和电子有限公司 一种电容器壳体和芯体组装控制系统
CN105826091B (zh) * 2016-03-30 2019-05-17 安徽普和电子有限公司 一种电容器自动组装系统
CN105742082B (zh) * 2016-03-30 2019-01-18 安徽诚越电子科技有限公司 一种电容器密封控制系统

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB712289A (en) * 1951-11-29 1954-07-21 Standard Telephones Cables Ltd Method of coating a plurality of electric impedance elements, such as condensers, and an impedance element coated in accordance with that method
US2758183A (en) * 1952-03-05 1956-08-07 Seci Process for making electric resistors and electric resistors made with that process
US2856639A (en) * 1953-04-13 1958-10-21 Bernard F Forrest Method of encasing electric coils
US2894316A (en) * 1955-01-21 1959-07-14 Chicago Condenser Corp Method of spacing capacitor leads
US2960641A (en) * 1958-06-23 1960-11-15 Sylvania Electric Prod Hermetically sealed semiconductor device and manufacture thereof
US3141049A (en) * 1961-06-05 1964-07-14 Gen Electric Methods for filling electrical apparatus with potting material
DE1439262B2 (de) * 1963-07-23 1972-03-30 Siemens AG, 1000 Berlin u. 8000 München Verfahren zum kontaktieren von halbleiterbauelementen durch thermokompression
US3261902A (en) * 1964-09-08 1966-07-19 Mallory & Co Inc P R Method of making encapsulated capacitor
US3560813A (en) * 1969-03-13 1971-02-02 Fairchild Camera Instr Co Hybridized monolithic array package
US3731371A (en) * 1970-03-02 1973-05-08 Union Carbide Corp Solid electrolytic capacitors and process

Also Published As

Publication number Publication date
ES440787A1 (es) 1977-04-01
FR2285225A1 (fr) 1976-04-16
JPS5914882B2 (ja) 1984-04-06
IT1046891B (it) 1980-07-31
DE2535923B2 (de) 1977-07-14
BR7505844A (pt) 1976-08-03
CA1043974A (en) 1978-12-12
GB1509738A (en) 1978-05-04
FR2285225B1 (enExample) 1979-08-24
JPS5158650A (enExample) 1976-05-22
SE7411786L (sv) 1976-03-22
US4045867A (en) 1977-09-06
CH592354A5 (enExample) 1977-10-31
DE2535923A1 (de) 1976-04-01
SE389991B (sv) 1976-11-29

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Legal Events

Date Code Title Description
C3 Grant after two publication steps (3rd publication)
8327 Change in the person/name/address of the patent owner

Owner name: RIFA AB, KALMAR, SE

8328 Change in the person/name/address of the agent

Free format text: EITLE, W., DIPL.-ING. HOFFMANN, K., DIPL.-ING. DR.RER.NAT. LEHN, W., DIPL.-ING. FUECHSLE, K., DIPL.-ING. HANSEN, B., DIPL.-CHEM. DR.RER.NAT. BRAUNS, H., DIPL.-CHEM. DR.RER.NAT. GOERG, K., DIPL.-ING. KOHLMANN, K., DIPL.-ING. KOLB, H., DIPL.-CHEM. DR.RER.NAT. RITTER UND EDLER VON FISCHERN, B., DIPL.-ING., PAT.-ANWAELTE NETTE, A., RECHTSANW., 8000 MUENCHEN

8339 Ceased/non-payment of the annual fee