DE2521727A1 - Verfahren zur herstellung eines resistbildes - Google Patents
Verfahren zur herstellung eines resistbildesInfo
- Publication number
- DE2521727A1 DE2521727A1 DE19752521727 DE2521727A DE2521727A1 DE 2521727 A1 DE2521727 A1 DE 2521727A1 DE 19752521727 DE19752521727 DE 19752521727 DE 2521727 A DE2521727 A DE 2521727A DE 2521727 A1 DE2521727 A1 DE 2521727A1
- Authority
- DE
- Germany
- Prior art keywords
- layer
- resist
- diazoketone
- substrate
- alkali
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000000034 method Methods 0.000 title claims description 36
- 238000004519 manufacturing process Methods 0.000 title description 5
- 239000000463 material Substances 0.000 claims description 36
- 239000000758 substrate Substances 0.000 claims description 21
- XXTZHYXQVWRADW-UHFFFAOYSA-N diazomethanone Chemical compound [N]N=C=O XXTZHYXQVWRADW-UHFFFAOYSA-N 0.000 claims description 14
- 229920005989 resin Polymers 0.000 claims description 14
- 239000011347 resin Substances 0.000 claims description 14
- 229910052751 metal Inorganic materials 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims description 11
- -1 hydrogen ions Chemical class 0.000 claims description 10
- 229910052739 hydrogen Inorganic materials 0.000 claims description 8
- 239000001257 hydrogen Substances 0.000 claims description 8
- 239000002253 acid Substances 0.000 claims description 7
- 230000005855 radiation Effects 0.000 claims description 6
- 239000003513 alkali Substances 0.000 claims description 5
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 5
- 125000000217 alkyl group Chemical group 0.000 claims description 3
- 125000000664 diazo group Chemical group [N-]=[N+]=[*] 0.000 claims description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 3
- 229910052500 inorganic mineral Inorganic materials 0.000 claims description 3
- 125000000468 ketone group Chemical group 0.000 claims description 3
- 239000011707 mineral Substances 0.000 claims description 3
- 229920001568 phenolic resin Polymers 0.000 claims description 3
- 125000003545 alkoxy group Chemical group 0.000 claims description 2
- 125000004104 aryloxy group Chemical group 0.000 claims description 2
- 238000006114 decarboxylation reaction Methods 0.000 claims description 2
- 125000000623 heterocyclic group Chemical group 0.000 claims description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims 1
- 125000002252 acyl group Chemical group 0.000 claims 1
- 125000003277 amino group Chemical group 0.000 claims 1
- 239000000243 solution Substances 0.000 description 11
- 238000010306 acid treatment Methods 0.000 description 8
- 229920002120 photoresistant polymer Polymers 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 4
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 3
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- BNIILDVGGAEEIG-UHFFFAOYSA-L disodium hydrogen phosphate Chemical compound [Na+].[Na+].OP([O-])([O-])=O BNIILDVGGAEEIG-UHFFFAOYSA-L 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000004115 Sodium Silicate Substances 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 239000003929 acidic solution Substances 0.000 description 2
- 239000012670 alkaline solution Substances 0.000 description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 2
- 239000008367 deionised water Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- FFUAGWLWBBFQJT-UHFFFAOYSA-N hexamethyldisilazane Chemical compound C[Si](C)(C)N[Si](C)(C)C FFUAGWLWBBFQJT-UHFFFAOYSA-N 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- 239000003791 organic solvent mixture Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 235000019795 sodium metasilicate Nutrition 0.000 description 2
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 2
- 229910052911 sodium silicate Inorganic materials 0.000 description 2
- 238000004528 spin coating Methods 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- 239000008096 xylene Substances 0.000 description 2
- HTQNYBBTZSBWKL-UHFFFAOYSA-N 2,3,4-trihydroxbenzophenone Chemical class OC1=C(O)C(O)=CC=C1C(=O)C1=CC=CC=C1 HTQNYBBTZSBWKL-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 description 1
- ZRYCRPNCXLQHPN-UHFFFAOYSA-N 3-hydroxy-2-methylbenzaldehyde Chemical compound CC1=C(O)C=CC=C1C=O ZRYCRPNCXLQHPN-UHFFFAOYSA-N 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- GXJUPKWKGLDWSP-UHFFFAOYSA-N [N-]=[N+]=C(C=CC1=C2C=CC=C1SO)C2=O Chemical compound [N-]=[N+]=C(C=CC1=C2C=CC=C1SO)C2=O GXJUPKWKGLDWSP-UHFFFAOYSA-N 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000002318 adhesion promoter Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 239000013068 control sample Substances 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 229910000397 disodium phosphate Inorganic materials 0.000 description 1
- 235000019800 disodium phosphate Nutrition 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- SLGWESQGEUXWJQ-UHFFFAOYSA-N formaldehyde;phenol Chemical compound O=C.OC1=CC=CC=C1 SLGWESQGEUXWJQ-UHFFFAOYSA-N 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 239000001488 sodium phosphate Substances 0.000 description 1
- 229910000162 sodium phosphate Inorganic materials 0.000 description 1
- 235000011008 sodium phosphates Nutrition 0.000 description 1
- 239000002195 soluble material Substances 0.000 description 1
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 239000012808 vapor phase Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US47683174A | 1974-06-06 | 1974-06-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE2521727A1 true DE2521727A1 (de) | 1975-12-18 |
Family
ID=23893432
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19752521727 Withdrawn DE2521727A1 (de) | 1974-06-06 | 1975-05-15 | Verfahren zur herstellung eines resistbildes |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPS5857097B2 (enExample) |
| DE (1) | DE2521727A1 (enExample) |
| FR (1) | FR2274072A1 (enExample) |
| GB (1) | GB1501194A (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4377633A (en) * | 1981-08-24 | 1983-03-22 | International Business Machines Corporation | Methods of simultaneous contact and metal lithography patterning |
| DE3541451A1 (de) * | 1985-02-27 | 1986-08-28 | Imtec Products, Inc., Sunnyvale, Calif. | Verfahren zum herstellen eines negativbildes |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6291938A (ja) * | 1985-10-18 | 1987-04-27 | Fuji Photo Film Co Ltd | 製版方法 |
| JPS62152377A (ja) * | 1985-12-24 | 1987-07-07 | Taga Denki Kk | 超音波振動子の駆動制御方法 |
| JPS62114478A (ja) * | 1985-11-11 | 1987-05-26 | Taga Denki Kk | 超音波振動子とその駆動制御方法 |
| JPS62126874A (ja) * | 1985-11-27 | 1987-06-09 | Taga Denki Kk | 超音波振動子 |
| JPS62152378A (ja) * | 1985-12-24 | 1987-07-07 | Taga Denki Kk | 超音波振動子 |
| JPS62171473A (ja) * | 1986-01-23 | 1987-07-28 | Taga Denki Kk | 超音波振動子 |
| JPS62141980A (ja) * | 1985-12-16 | 1987-06-25 | Taga Denki Kk | 超音波振動子とその駆動制御方法 |
| JPS63110980A (ja) * | 1986-10-28 | 1988-05-16 | Taga Electric Co Ltd | 超音波モ−タの駆動方法 |
| JPH0727220B2 (ja) * | 1988-03-08 | 1995-03-29 | 三洋電機株式会社 | パターン形成方法 |
| GB2224362B (en) * | 1988-11-01 | 1993-05-19 | Yamatoya Shokai | A process and apparatus for forming a negative resist pattern with a resist containing a diazoquinone sensitiser |
| US5286609A (en) * | 1988-11-01 | 1994-02-15 | Yamatoya & Co., Ltd. | Process for the formation of a negative resist pattern from a composition comprising a diazoquinone compound and an imidazole and having as a heat step the use of a hot water containing spray |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1058845B (de) * | 1958-02-11 | 1959-06-04 | Kalle & Co Ag | Verfahren zur Herstellung von Kopien, besonders Druckformen, mit Hilfe von wasserunloeslichen Diazoverbindungen |
| DE1224147B (de) * | 1963-08-23 | 1966-09-01 | Kalle Ag | Verfahren zur Umkehrentwicklung von Diazo-verbindungen enthaltenden Kopierschichten |
| US3666473A (en) * | 1970-10-06 | 1972-05-30 | Ibm | Positive photoresists for projection exposure |
-
1975
- 1975-04-29 FR FR7514030A patent/FR2274072A1/fr active Granted
- 1975-05-15 DE DE19752521727 patent/DE2521727A1/de not_active Withdrawn
- 1975-05-21 GB GB2187875A patent/GB1501194A/en not_active Expired
- 1975-05-26 JP JP6202775A patent/JPS5857097B2/ja not_active Expired
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1058845B (de) * | 1958-02-11 | 1959-06-04 | Kalle & Co Ag | Verfahren zur Herstellung von Kopien, besonders Druckformen, mit Hilfe von wasserunloeslichen Diazoverbindungen |
| DE1224147B (de) * | 1963-08-23 | 1966-09-01 | Kalle Ag | Verfahren zur Umkehrentwicklung von Diazo-verbindungen enthaltenden Kopierschichten |
| US3666473A (en) * | 1970-10-06 | 1972-05-30 | Ibm | Positive photoresists for projection exposure |
Non-Patent Citations (2)
| Title |
|---|
| Chemical Abstracts, Vol. 60, Jan. 1964, Nr. 651h * |
| IBM Techn.Discl.Bul. Vol. 9, Nr. 4, Sep. 1966, S. 348-349 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4377633A (en) * | 1981-08-24 | 1983-03-22 | International Business Machines Corporation | Methods of simultaneous contact and metal lithography patterning |
| DE3541451A1 (de) * | 1985-02-27 | 1986-08-28 | Imtec Products, Inc., Sunnyvale, Calif. | Verfahren zum herstellen eines negativbildes |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5857097B2 (ja) | 1983-12-19 |
| JPS513633A (ja) | 1976-01-13 |
| FR2274072B1 (enExample) | 1982-02-05 |
| GB1501194A (en) | 1978-02-15 |
| FR2274072A1 (fr) | 1976-01-02 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| OD | Request for examination | ||
| 8128 | New person/name/address of the agent |
Representative=s name: STREHL, P., DIPL.-ING. DIPL.-WIRTSCH.-ING. SCHUEBE |
|
| 8125 | Change of the main classification |
Ipc: G03F 7/08 |
|
| 8136 | Disposal/non-payment of the fee for publication/grant |