DE2508130A1 - Gold-platin-plattierbad - Google Patents

Gold-platin-plattierbad

Info

Publication number
DE2508130A1
DE2508130A1 DE19752508130 DE2508130A DE2508130A1 DE 2508130 A1 DE2508130 A1 DE 2508130A1 DE 19752508130 DE19752508130 DE 19752508130 DE 2508130 A DE2508130 A DE 2508130A DE 2508130 A1 DE2508130 A1 DE 2508130A1
Authority
DE
Germany
Prior art keywords
gold
essentially
alkali metal
solution
hexahydroxyplatinate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE19752508130
Other languages
German (de)
English (en)
Inventor
Harold Jerome Wiesner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
United States Atomic Energy Commission
Original Assignee
United States Atomic Energy Commission
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by United States Atomic Energy Commission filed Critical United States Atomic Energy Commission
Publication of DE2508130A1 publication Critical patent/DE2508130A1/de
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/62—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
DE19752508130 1974-02-25 1975-02-25 Gold-platin-plattierbad Pending DE2508130A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US445740A US3923612A (en) 1974-02-25 1974-02-25 Electroplating a gold-platinum alloy and electrolyte therefor

Publications (1)

Publication Number Publication Date
DE2508130A1 true DE2508130A1 (de) 1975-08-28

Family

ID=23770021

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19752508130 Pending DE2508130A1 (de) 1974-02-25 1975-02-25 Gold-platin-plattierbad

Country Status (5)

Country Link
US (1) US3923612A (enExample)
JP (1) JPS5110130A (enExample)
DE (1) DE2508130A1 (enExample)
FR (1) FR2262132A1 (enExample)
GB (1) GB1448549A (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2478512B1 (enExample) * 1980-03-24 1985-03-22 Charmilles Sa Ateliers
US4513191A (en) * 1980-05-13 1985-04-23 Inoue-Japax Research Incorporated Method of and apparatus for resetting a wire electrode in an operating setup on an electroerosion machine
DE3021665A1 (de) * 1980-06-10 1981-12-17 Degussa Ag, 6000 Frankfurt Stark saures goldlegierungsbad
CH636291A5 (fr) * 1980-07-15 1983-05-31 Charmilles Sa Ateliers Procede et dispositif pour introduire le bout d'une electrode-fil dans l'orifice de depart d'une piece a decouper par etincelage erosif.
JP2577832B2 (ja) * 1990-06-29 1997-02-05 日本エレクトロプレイテイング・エンジニヤース株式会社 白金電鋳浴
JPH04333588A (ja) * 1990-07-16 1992-11-20 Electroplating Eng Of Japan Co 高硬度白金材料の製造方法及びその高硬度白金材料
IL98550A (en) * 1990-06-29 1996-07-23 Electroplating Eng Baths for the investment of platinum and for the production of platinum products by electricity, methods for investing platinum and for the production of platinum products that use them and products produced by them
TW432397B (en) * 1997-10-23 2001-05-01 Sumitomo Metal Mining Co Transparent electro-conductive structure, progess for its production, transparent electro-conductive layer forming coating fluid used for its production, and process for preparing the coating fluid
US7208439B2 (en) * 2005-02-04 2007-04-24 The Research Foundation Of State University Of New York Gold-based alloy nanoparticles for use in fuel cell catalysts
US7829140B1 (en) 2006-03-29 2010-11-09 The Research Foundation Of The State University Of New York Method of forming iron oxide core metal shell nanoparticles
US8343627B2 (en) 2007-02-20 2013-01-01 Research Foundation Of State University Of New York Core-shell nanoparticles with multiple cores and a method for fabricating them
US20230211375A1 (en) * 2020-04-15 2023-07-06 Hewlett-Packard Development Company, L.P. Coated substrates for electronic devices
US11674234B1 (en) 2020-09-30 2023-06-13 National Technology & Engineering Solutions Of Sandia, Llc Electrodeposited platinum-gold alloy

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB928083A (en) * 1961-04-28 1963-06-06 Johnson Matthey Co Ltd Improvements in and relating to the electrodeposition of gold

Also Published As

Publication number Publication date
GB1448549A (en) 1976-09-08
US3923612A (en) 1975-12-02
FR2262132A1 (enExample) 1975-09-19
JPS5110130A (enExample) 1976-01-27
USB445740I5 (enExample) 1975-01-28

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