DE2505234A1 - Harz zur isolierung elektrischer teile - Google Patents

Harz zur isolierung elektrischer teile

Info

Publication number
DE2505234A1
DE2505234A1 DE19752505234 DE2505234A DE2505234A1 DE 2505234 A1 DE2505234 A1 DE 2505234A1 DE 19752505234 DE19752505234 DE 19752505234 DE 2505234 A DE2505234 A DE 2505234A DE 2505234 A1 DE2505234 A1 DE 2505234A1
Authority
DE
Germany
Prior art keywords
anhydride
epoxy
parts
resin
acid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE19752505234
Other languages
German (de)
English (en)
Inventor
Robert Newell Kauffman
James David Blackhall Smith
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Westinghouse Electric Corp
Original Assignee
Westinghouse Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Westinghouse Electric Corp filed Critical Westinghouse Electric Corp
Publication of DE2505234A1 publication Critical patent/DE2505234A1/de
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14Polycondensates modified by chemical after-treatment
    • C08G59/1433Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
    • C08G59/1438Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing oxygen
    • C08G59/145Compounds containing one epoxy group
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22Di-epoxy compounds
    • C08G59/226Mixtures of di-epoxy compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4292Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof together with monocarboxylic acids
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/688Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing phosphorus

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Emergency Medicine (AREA)
  • General Chemical & Material Sciences (AREA)
  • Epoxy Resins (AREA)
  • Organic Insulating Materials (AREA)
DE19752505234 1974-02-11 1975-02-07 Harz zur isolierung elektrischer teile Pending DE2505234A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/441,605 US4026862A (en) 1974-02-11 1974-02-11 Carboxylic acid storage stabilizers for latent catalyst cured epoxy resins

Publications (1)

Publication Number Publication Date
DE2505234A1 true DE2505234A1 (de) 1975-08-14

Family

ID=23753547

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19752505234 Pending DE2505234A1 (de) 1974-02-11 1975-02-07 Harz zur isolierung elektrischer teile

Country Status (5)

Country Link
US (1) US4026862A (enrdf_load_stackoverflow)
JP (1) JPS5146799B2 (enrdf_load_stackoverflow)
CH (1) CH618454A5 (enrdf_load_stackoverflow)
DE (1) DE2505234A1 (enrdf_load_stackoverflow)
FR (1) FR2260604B1 (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3003476B1 (de) * 1980-01-29 1981-01-29 Siemens Ag Verfahren zur Herstellung von gehaerteten Kunststoff-Formkoerpern durch Giessen
DE3003477A1 (de) * 1980-01-29 1981-07-30 Siemens AG, 1000 Berlin und 8000 München Isolierband zur herstellung einer mit einer heisshaertenden epoxidharz-saeureanhydrid-mischung impraegnierten isolierhuelse fuer elektrische leiter

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4255553A (en) * 1975-05-21 1981-03-10 Toyo Boseki Kabushiki Kaisha Powder coating composition
GB1498542A (en) * 1975-12-30 1978-01-18 Ciba Geigy Ag Compositions for curing epoxide resins
US4224541A (en) * 1978-05-26 1980-09-23 Westinghouse Electric Corp. Fluid solventless epoxy-anhydride compositions containing metal acetylacetonate accelerators and organic carboxylic acid co-accelerators for use on an electrical member
US4320222A (en) * 1980-04-10 1982-03-16 Shell Oil Company Storage-stable precatalyzed polyepoxide compositions
US4284753A (en) * 1980-04-14 1981-08-18 Shell Oil Company Heat curable polyepoxide-unsaturated aromatic monomer resin compositions
US4349651A (en) * 1980-08-01 1982-09-14 Westinghouse Electric Corp. Resinous copolymer insulating compositions
USRE32029E (en) * 1981-01-12 1985-11-12 The Goodyear Tire & Rubber Company Process to control the curing reaction between a copolyester resin and an epoxide compound, and a composition formed for that process
US4370452A (en) * 1981-01-12 1983-01-25 The Goodyear Tire & Rubber Company Process to induce rapid curing of a copolyester resin with epoxide compounds and a composition formed for that process
US4365046A (en) * 1981-01-12 1982-12-21 The Goodyear Tire & Rubber Company Process to control the curing reaction between a copolyester resin and an epoxide compound, and a composition formed for that process
US4481348A (en) * 1981-11-16 1984-11-06 Henkel Corporation Glycidyl ether of gem-bis(hydroxymethyl) hydrocarbons
US4552907A (en) * 1983-07-29 1985-11-12 Kabushiki Kaisha Toyota Chuo Kenkyusho Epoxy resin composition
DE3327708A1 (de) * 1983-07-29 1985-02-07 Siemens AG, 1000 Berlin und 8000 München Reaktionsharzmassen zum impraegnieren und vergiessen von grossvolumigen bauteilen
US4594291A (en) * 1984-07-17 1986-06-10 The Dow Chemical Company Curable, partially advanced epoxy resins
NZ212747A (en) * 1984-07-17 1989-01-27 Dow Chemical Co Partially advanced epoxy resin compositions
US5503937A (en) * 1984-07-17 1996-04-02 The Dow Chemical Company Curable composition which comprises adducts of heterocyclic compounds
DE3447251A1 (de) * 1984-12-22 1986-06-26 Bayer Ag, 5090 Leverkusen Waermehaertbare epoxidharzmischungen
JPS61285214A (ja) * 1985-06-12 1986-12-16 Mitsubishi Electric Corp エポキシ樹脂組成物
US4873273A (en) * 1986-03-20 1989-10-10 James River-Norwalk, Inc. Epoxide coating composition
EP0349192A3 (en) * 1988-06-24 1990-09-12 Somar Corporation Liquid, epoxy resin composition
US4937296A (en) * 1989-02-28 1990-06-26 The Glidden Company Epoxy-amine coatings with carboxylic acid thixotropic additive
GB9004013D0 (en) * 1990-02-22 1990-04-18 Shell Int Research Glycidylester-anhydride adducts,curing of epoxy resin powder coatings
JP3428695B2 (ja) * 1993-08-20 2003-07-22 ジャパンエポキシレジン株式会社 変性液状エポキシ樹脂組成物
JP2875479B2 (ja) * 1994-09-08 1999-03-31 日本ペルノックス株式会社 半導体の封止方法
DE19753461A1 (de) * 1997-12-02 1999-06-10 Espe Dental Ag Lagerstabile kationisch polymerisierende Zubereitungen mit verbessertem Härtungsverhalten
US6617401B2 (en) * 2001-08-23 2003-09-09 General Electric Company Composition comprising cycloaliphatic epoxy resin, 4-methylhexahydrophthalic anhydride curing agent and boron catalyst
US6617400B2 (en) * 2001-08-23 2003-09-09 General Electric Company Composition of cycloaliphatic epoxy resin, anhydride curing agent and boron catalyst
EP1491566B1 (en) * 2003-06-16 2007-02-28 ABB Technology Ltd Curable epoxy resin composition, and process for the production of shaped articles therefrom
US7405246B2 (en) * 2005-04-05 2008-07-29 Momentive Performance Materials Inc. Cure system, adhesive system, electronic device
US7446136B2 (en) * 2005-04-05 2008-11-04 Momentive Performance Materials Inc. Method for producing cure system, adhesive system, and electronic device
US20070231581A1 (en) * 2006-04-03 2007-10-04 Pui-Yan Lin Epoxy with low coefficient of thermal expansion
US20140178693A1 (en) * 2012-12-21 2014-06-26 General Electric Company High thermal conductivity composite for electric insulation, and articles thereof
US9080007B2 (en) * 2013-02-28 2015-07-14 Air Products And Chemicals, Inc. Anhydride accelerators for epoxy resin systems
CA2987830C (en) * 2015-09-14 2023-10-17 Appleton Grp Llc An arrangement for maintaining desired temperature conditions in an encapsulated transformer

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2844552A (en) * 1954-02-23 1958-07-22 Gen Mills Inc Stabilization of mixtures of polyamide, epoxy resin solutions with formic acid
US2934506A (en) * 1956-06-11 1960-04-26 Devoe & Raynolds Co Modified epoxide resins
NL221263A (enrdf_load_stackoverflow) * 1956-10-05
US2928809A (en) * 1957-08-12 1960-03-15 Devoe & Raynolds Co Epoxide resin-quaternary ammonium salt compositions
US3678004A (en) * 1970-01-07 1972-07-18 Scm Corp Acid-stabilized epoxide resin coating compositions and method of preparing same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3003476B1 (de) * 1980-01-29 1981-01-29 Siemens Ag Verfahren zur Herstellung von gehaerteten Kunststoff-Formkoerpern durch Giessen
DE3003477A1 (de) * 1980-01-29 1981-07-30 Siemens AG, 1000 Berlin und 8000 München Isolierband zur herstellung einer mit einer heisshaertenden epoxidharz-saeureanhydrid-mischung impraegnierten isolierhuelse fuer elektrische leiter

Also Published As

Publication number Publication date
FR2260604A1 (enrdf_load_stackoverflow) 1975-09-05
JPS50110500A (enrdf_load_stackoverflow) 1975-08-30
USB441605I5 (enrdf_load_stackoverflow) 1976-02-03
JPS5146799B2 (enrdf_load_stackoverflow) 1976-12-10
US4026862A (en) 1977-05-31
CH618454A5 (enrdf_load_stackoverflow) 1980-07-31
FR2260604B1 (enrdf_load_stackoverflow) 1981-09-04

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