DE2453788A1 - Verfahren zur herstellung von schaltplatten mit gedruckten schaltungen - Google Patents

Verfahren zur herstellung von schaltplatten mit gedruckten schaltungen

Info

Publication number
DE2453788A1
DE2453788A1 DE19742453788 DE2453788A DE2453788A1 DE 2453788 A1 DE2453788 A1 DE 2453788A1 DE 19742453788 DE19742453788 DE 19742453788 DE 2453788 A DE2453788 A DE 2453788A DE 2453788 A1 DE2453788 A1 DE 2453788A1
Authority
DE
Germany
Prior art keywords
holes
circuit
plated
metallic layer
connections
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19742453788
Other languages
German (de)
English (en)
Inventor
Melvin E Lindell
Charles F Prewitt
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Litton Industries Inc
Original Assignee
Litton Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Litton Industries Inc filed Critical Litton Industries Inc
Publication of DE2453788A1 publication Critical patent/DE2453788A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
    • H05K3/445—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits having insulated holes or insulated via connections through the metal core
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/143—Treating holes before another process, e.g. coating holes before coating the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
DE19742453788 1973-11-21 1974-11-13 Verfahren zur herstellung von schaltplatten mit gedruckten schaltungen Withdrawn DE2453788A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US41810573A 1973-11-21 1973-11-21

Publications (1)

Publication Number Publication Date
DE2453788A1 true DE2453788A1 (de) 1975-05-22

Family

ID=23656731

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19742453788 Withdrawn DE2453788A1 (de) 1973-11-21 1974-11-13 Verfahren zur herstellung von schaltplatten mit gedruckten schaltungen

Country Status (6)

Country Link
JP (1) JPS5083757A (enExample)
BE (1) BE822462A (enExample)
DE (1) DE2453788A1 (enExample)
FR (1) FR2251984A1 (enExample)
NL (1) NL7415185A (enExample)
NO (1) NO744158L (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3500303A1 (de) * 1984-01-17 1985-07-25 O.Key Printed Wiring Co., Ltd., Kokubunji, Tokio/Tokyo Gedruckte leiterplatte und verfahren zu ihrer herstellung
US4783247A (en) * 1985-05-17 1988-11-08 Hoechst Aktiengesellschaft Method and manufacture for electrically insulating base material used in plated-through printed circuit panels
EP0373363A3 (en) * 1988-12-15 1991-09-11 International Business Machines Corporation Filling of vias in a metallic plane
US5487218A (en) * 1994-11-21 1996-01-30 International Business Machines Corporation Method for making printed circuit boards with selectivity filled plated through holes

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5336666A (en) * 1976-09-17 1978-04-05 Fujitsu Ltd Method of producing composite substrate
JPS5350970A (en) * 1976-10-21 1978-05-09 Fujitsu Ltd Patterning method for fluorescent substance of plasma display panel
JPS5365966A (en) * 1976-11-25 1978-06-12 Fujitsu Ltd Method of producing shielding layer contained multilayer printed board
JPS5413968A (en) * 1977-07-04 1979-02-01 Fujitsu Ltd Method of manufacturing wiring board
JPS6055316B2 (ja) * 1977-11-08 1985-12-04 日立化成工業株式会社 感熱記録ヘツドの製造法
JPS5472462A (en) * 1977-11-22 1979-06-09 Hitachi Chemical Co Ltd Preparation of substrate for metallic core print plug board
JPS54150677A (en) * 1978-05-19 1979-11-27 Hitachi Ltd Method of producing metal coreereinforced copperrwired circuit board
JPS5784766U (enExample) * 1980-11-13 1982-05-25
DE3631426A1 (de) * 1986-09-16 1988-03-24 Ruwel Werke Gmbh Einen plattenfoermigen metallkern aufweisende leiterplatten und verfahren zu deren herstellung
US5153987A (en) * 1988-07-15 1992-10-13 Hitachi Chemical Company, Ltd. Process for producing printed wiring boards
US5425816A (en) * 1991-08-19 1995-06-20 Spectrolab, Inc. Electrical feedthrough structure and fabrication method
EP1111971A4 (en) * 1999-06-21 2006-03-22 Mitsubishi Electric Corp PROCESS FOR PRODUCING CIRCUIT FORMING CARD, CIRCUIT FORMING CARD, AND CARBON SHEET
CN107548244B (zh) * 2017-08-30 2020-02-28 景旺电子科技(龙川)有限公司 一种双面夹芯铜基板内部铜基之间绝缘的制作方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3500303A1 (de) * 1984-01-17 1985-07-25 O.Key Printed Wiring Co., Ltd., Kokubunji, Tokio/Tokyo Gedruckte leiterplatte und verfahren zu ihrer herstellung
US4783247A (en) * 1985-05-17 1988-11-08 Hoechst Aktiengesellschaft Method and manufacture for electrically insulating base material used in plated-through printed circuit panels
EP0373363A3 (en) * 1988-12-15 1991-09-11 International Business Machines Corporation Filling of vias in a metallic plane
US5487218A (en) * 1994-11-21 1996-01-30 International Business Machines Corporation Method for making printed circuit boards with selectivity filled plated through holes

Also Published As

Publication number Publication date
FR2251984A1 (en) 1975-06-13
BE822462A (fr) 1975-03-14
NO744158L (enExample) 1975-06-16
NL7415185A (nl) 1975-05-23
JPS5083757A (enExample) 1975-07-07

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Legal Events

Date Code Title Description
EHJ Ceased/non-payment of the annual fee