DE2453788A1 - Verfahren zur herstellung von schaltplatten mit gedruckten schaltungen - Google Patents
Verfahren zur herstellung von schaltplatten mit gedruckten schaltungenInfo
- Publication number
- DE2453788A1 DE2453788A1 DE19742453788 DE2453788A DE2453788A1 DE 2453788 A1 DE2453788 A1 DE 2453788A1 DE 19742453788 DE19742453788 DE 19742453788 DE 2453788 A DE2453788 A DE 2453788A DE 2453788 A1 DE2453788 A1 DE 2453788A1
- Authority
- DE
- Germany
- Prior art keywords
- holes
- circuit
- plated
- metallic layer
- connections
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 17
- 239000000463 material Substances 0.000 claims description 64
- 238000000034 method Methods 0.000 claims description 47
- 238000010586 diagram Methods 0.000 claims description 24
- 229920001187 thermosetting polymer Polymers 0.000 claims description 13
- 238000000576 coating method Methods 0.000 claims description 11
- 230000000873 masking effect Effects 0.000 claims description 9
- 238000005530 etching Methods 0.000 claims description 8
- 239000003365 glass fiber Substances 0.000 claims description 8
- 229910052782 aluminium Inorganic materials 0.000 claims description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 7
- 239000011248 coating agent Substances 0.000 claims description 7
- 239000007787 solid Substances 0.000 claims description 7
- 238000007743 anodising Methods 0.000 claims description 6
- 238000010030 laminating Methods 0.000 claims description 6
- 239000004033 plastic Substances 0.000 claims description 6
- 229920003023 plastic Polymers 0.000 claims description 6
- 239000012815 thermoplastic material Substances 0.000 claims description 6
- 238000011049 filling Methods 0.000 claims description 5
- 239000011343 solid material Substances 0.000 claims description 5
- 239000004593 Epoxy Substances 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 4
- 238000007711 solidification Methods 0.000 claims description 4
- 230000008023 solidification Effects 0.000 claims description 4
- 229920001169 thermoplastic Polymers 0.000 claims description 4
- 239000004416 thermosoftening plastic Substances 0.000 claims description 4
- 239000011810 insulating material Substances 0.000 claims description 3
- 230000002787 reinforcement Effects 0.000 claims 2
- 239000010410 layer Substances 0.000 description 39
- 238000007747 plating Methods 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 239000003822 epoxy resin Substances 0.000 description 6
- 229920000647 polyepoxide Polymers 0.000 description 6
- 239000007788 liquid Substances 0.000 description 4
- 239000004020 conductor Substances 0.000 description 3
- 238000007596 consolidation process Methods 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000006378 damage Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 241000530268 Lycaena heteronea Species 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000001627 detrimental effect Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- -1 e.g. Substances 0.000 description 1
- 239000011152 fibreglass Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000004848 polyfunctional curative Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
- H05K3/445—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits having insulated holes or insulated via connections through the metal core
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0315—Oxidising metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/143—Treating holes before another process, e.g. coating holes before coating the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US41810573A | 1973-11-21 | 1973-11-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE2453788A1 true DE2453788A1 (de) | 1975-05-22 |
Family
ID=23656731
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19742453788 Withdrawn DE2453788A1 (de) | 1973-11-21 | 1974-11-13 | Verfahren zur herstellung von schaltplatten mit gedruckten schaltungen |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JPS5083757A (enrdf_load_stackoverflow) |
| BE (1) | BE822462A (enrdf_load_stackoverflow) |
| DE (1) | DE2453788A1 (enrdf_load_stackoverflow) |
| FR (1) | FR2251984A1 (enrdf_load_stackoverflow) |
| NL (1) | NL7415185A (enrdf_load_stackoverflow) |
| NO (1) | NO744158L (enrdf_load_stackoverflow) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3500303A1 (de) * | 1984-01-17 | 1985-07-25 | O.Key Printed Wiring Co., Ltd., Kokubunji, Tokio/Tokyo | Gedruckte leiterplatte und verfahren zu ihrer herstellung |
| US4783247A (en) * | 1985-05-17 | 1988-11-08 | Hoechst Aktiengesellschaft | Method and manufacture for electrically insulating base material used in plated-through printed circuit panels |
| EP0373363A3 (en) * | 1988-12-15 | 1991-09-11 | International Business Machines Corporation | Filling of vias in a metallic plane |
| US5487218A (en) * | 1994-11-21 | 1996-01-30 | International Business Machines Corporation | Method for making printed circuit boards with selectivity filled plated through holes |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5336666A (en) * | 1976-09-17 | 1978-04-05 | Fujitsu Ltd | Method of producing composite substrate |
| JPS5350970A (en) * | 1976-10-21 | 1978-05-09 | Fujitsu Ltd | Patterning method for fluorescent substance of plasma display panel |
| JPS5365966A (en) * | 1976-11-25 | 1978-06-12 | Fujitsu Ltd | Method of producing shielding layer contained multilayer printed board |
| JPS5413968A (en) * | 1977-07-04 | 1979-02-01 | Fujitsu Ltd | Method of manufacturing wiring board |
| JPS6055316B2 (ja) * | 1977-11-08 | 1985-12-04 | 日立化成工業株式会社 | 感熱記録ヘツドの製造法 |
| JPS5472462A (en) * | 1977-11-22 | 1979-06-09 | Hitachi Chemical Co Ltd | Preparation of substrate for metallic core print plug board |
| JPS54150677A (en) * | 1978-05-19 | 1979-11-27 | Hitachi Ltd | Method of producing metal coreereinforced copperrwired circuit board |
| JPS5784766U (enrdf_load_stackoverflow) * | 1980-11-13 | 1982-05-25 | ||
| DE3631426A1 (de) * | 1986-09-16 | 1988-03-24 | Ruwel Werke Gmbh | Einen plattenfoermigen metallkern aufweisende leiterplatten und verfahren zu deren herstellung |
| US5153987A (en) * | 1988-07-15 | 1992-10-13 | Hitachi Chemical Company, Ltd. | Process for producing printed wiring boards |
| US5425816A (en) * | 1991-08-19 | 1995-06-20 | Spectrolab, Inc. | Electrical feedthrough structure and fabrication method |
| JP4365061B2 (ja) * | 1999-06-21 | 2009-11-18 | 三菱電機株式会社 | 回路形成基板製造方法及び回路形成基板 |
| CN107548244B (zh) * | 2017-08-30 | 2020-02-28 | 景旺电子科技(龙川)有限公司 | 一种双面夹芯铜基板内部铜基之间绝缘的制作方法 |
-
1974
- 1974-11-13 DE DE19742453788 patent/DE2453788A1/de not_active Withdrawn
- 1974-11-19 NO NO744158A patent/NO744158L/no unknown
- 1974-11-21 FR FR7438275A patent/FR2251984A1/fr not_active Withdrawn
- 1974-11-21 NL NL7415185A patent/NL7415185A/xx unknown
- 1974-11-21 BE BE150736A patent/BE822462A/xx unknown
- 1974-11-21 JP JP49135082A patent/JPS5083757A/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3500303A1 (de) * | 1984-01-17 | 1985-07-25 | O.Key Printed Wiring Co., Ltd., Kokubunji, Tokio/Tokyo | Gedruckte leiterplatte und verfahren zu ihrer herstellung |
| US4783247A (en) * | 1985-05-17 | 1988-11-08 | Hoechst Aktiengesellschaft | Method and manufacture for electrically insulating base material used in plated-through printed circuit panels |
| EP0373363A3 (en) * | 1988-12-15 | 1991-09-11 | International Business Machines Corporation | Filling of vias in a metallic plane |
| US5487218A (en) * | 1994-11-21 | 1996-01-30 | International Business Machines Corporation | Method for making printed circuit boards with selectivity filled plated through holes |
Also Published As
| Publication number | Publication date |
|---|---|
| NL7415185A (nl) | 1975-05-23 |
| NO744158L (enrdf_load_stackoverflow) | 1975-06-16 |
| FR2251984A1 (en) | 1975-06-13 |
| JPS5083757A (enrdf_load_stackoverflow) | 1975-07-07 |
| BE822462A (fr) | 1975-03-14 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EHJ | Ceased/non-payment of the annual fee |