DE2451485A1 - Verfahren zur metallisierung von ungebranntem keramikmaterial - Google Patents

Verfahren zur metallisierung von ungebranntem keramikmaterial

Info

Publication number
DE2451485A1
DE2451485A1 DE19742451485 DE2451485A DE2451485A1 DE 2451485 A1 DE2451485 A1 DE 2451485A1 DE 19742451485 DE19742451485 DE 19742451485 DE 2451485 A DE2451485 A DE 2451485A DE 2451485 A1 DE2451485 A1 DE 2451485A1
Authority
DE
Germany
Prior art keywords
unfired ceramic
platelets
wettable
mask
unfired
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19742451485
Other languages
German (de)
English (en)
Inventor
Arnold Friedri Schmeckenbecher
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of DE2451485A1 publication Critical patent/DE2451485A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28B—SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
    • B28B11/00—Apparatus or processes for treating or working the shaped or preshaped articles
    • B28B11/04—Apparatus or processes for treating or working the shaped or preshaped articles for coating or applying engobing layers
    • B28B11/041—Apparatus or processes for treating or working the shaped or preshaped articles for coating or applying engobing layers for moulded articles undergoing a thermal treatment at high temperatures, such as burning, after coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1258—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by using a substrate provided with a shape pattern, e.g. grooves, banks, resist pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0568—Resist used for applying paste, ink or powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0029—Etching of the substrate by chemical or physical means by laser ablation of inorganic insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4981—Utilizing transitory attached element or associated separate material
    • Y10T29/49812—Temporary protective coating, impregnation, or cast layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • Structural Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laminated Bodies (AREA)
  • Ceramic Products (AREA)
  • Manufacturing Of Printed Wiring (AREA)
DE19742451485 1973-12-13 1974-10-30 Verfahren zur metallisierung von ungebranntem keramikmaterial Withdrawn DE2451485A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/424,505 US3948706A (en) 1973-12-13 1973-12-13 Method for metallizing ceramic green sheets

Publications (1)

Publication Number Publication Date
DE2451485A1 true DE2451485A1 (de) 1975-06-19

Family

ID=23682868

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19742451485 Withdrawn DE2451485A1 (de) 1973-12-13 1974-10-30 Verfahren zur metallisierung von ungebranntem keramikmaterial

Country Status (7)

Country Link
US (1) US3948706A (enExample)
JP (1) JPS5228452B2 (enExample)
CA (1) CA1043188A (enExample)
DE (1) DE2451485A1 (enExample)
FR (1) FR2254417B1 (enExample)
GB (1) GB1455938A (enExample)
IT (1) IT1025684B (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3134918A1 (de) * 1981-09-03 1983-03-17 Matsushita Electric Industrial Co., Ltd., Kadoma, Osaka "elektrode auf waermebestaendigem isolierendem substrat und verfahren zur herstellung derselben"
US5368911A (en) * 1992-03-27 1994-11-29 General Electric Company Method for fabrication of composite materials and composite
DE102024109559B3 (de) * 2024-04-05 2025-09-11 Technische Universität Ilmenau, Körperschaft des öffentlichen Rechts 2-in-1-Prozess mit Maske-auf-Substrat-Einheit für die Herstellung eines mikroelektronischen keramischen Schaltungsträgers mit vertikalen und lateralen Feinstrukturen

Families Citing this family (57)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4039338A (en) * 1972-12-29 1977-08-02 International Business Machines Corporation Accelerated sintering for a green ceramic sheet
CH575166A5 (enExample) * 1974-05-20 1976-04-30 Suisse Horlogerie
FR2296988A1 (fr) * 1974-12-31 1976-07-30 Ibm France Perfectionnement aux procedes de fabrication d'un module de circuits multicouches en ceramique
JPS5328266A (en) * 1976-08-13 1978-03-16 Fujitsu Ltd Method of producing multilayer ceramic substrate
US4189509A (en) * 1976-09-09 1980-02-19 Texas Instruments Incorporated Resistor device and method of making
US4169001A (en) * 1976-10-18 1979-09-25 International Business Machines Corporation Method of making multilayer module having optical channels therein
US4289719A (en) * 1976-12-10 1981-09-15 International Business Machines Corporation Method of making a multi-layer ceramic substrate
US4117588A (en) * 1977-01-24 1978-10-03 The United States Of America As Represented By The Secretary Of The Navy Method of manufacturing three dimensional integrated circuits
US4127680A (en) * 1977-02-03 1978-11-28 Sprague Electric Company Making a capacitor employing a temporary solid mask in the porous anode
US4206254A (en) * 1979-02-28 1980-06-03 International Business Machines Corporation Method of selectively depositing metal on a ceramic substrate with a metallurgy pattern
JPS55138294A (en) * 1979-04-11 1980-10-28 Matsushita Electric Industrial Co Ltd Method of forming through hole connector
JPS55165698A (en) * 1979-06-11 1980-12-24 Cho Lsi Gijutsu Kenkyu Kumiai Multilayer integrated circuit board
US4343833A (en) * 1979-06-26 1982-08-10 Mitsubishi Denki Kabushiki Kaisha Method of manufacturing thermal head
GB2124037B (en) * 1982-07-19 1986-02-26 Gen Electric Co Plc Methods of forming patterns on substrates
US4604799A (en) * 1982-09-03 1986-08-12 John Fluke Mfg. Co., Inc. Method of making molded circuit board
US4461077A (en) * 1982-10-04 1984-07-24 General Electric Ceramics, Inc. Method for preparing ceramic articles having raised, selectively metallized electrical contact points
US4586972A (en) * 1983-04-05 1986-05-06 Matsushita Electric Industrial Co., Ltd. Method for making multilayer ceramic body
US4504340A (en) * 1983-07-26 1985-03-12 International Business Machines Corporation Material and process set for fabrication of molecular matrix print head
US4546065A (en) * 1983-08-08 1985-10-08 International Business Machines Corporation Process for forming a pattern of metallurgy on the top of a ceramic substrate
US5094811A (en) * 1983-09-21 1992-03-10 Allied-Signal Method of making a printed circuit board
KR850700098A (ko) * 1983-09-21 1985-10-21 로이 에이취.맷신길 인쇄회로판 제조방법
WO1985001414A1 (en) * 1983-09-21 1985-03-28 Allied Corporation Method of making a printed circuit board
US5061438A (en) * 1983-09-21 1991-10-29 Allied-Signal Inc. Method of making a printed circuit board
US4555285A (en) * 1983-12-14 1985-11-26 International Business Machines Corporation Forming patterns in metallic or ceramic substrates
US4581098A (en) * 1984-10-19 1986-04-08 International Business Machines Corporation MLC green sheet process
US4645552A (en) * 1984-11-19 1987-02-24 Hughes Aircraft Company Process for fabricating dimensionally stable interconnect boards
US4662989A (en) * 1985-10-04 1987-05-05 Honeywell Inc. High efficiency metal lift-off process
US4766671A (en) * 1985-10-29 1988-08-30 Nec Corporation Method of manufacturing ceramic electronic device
US4753694A (en) * 1986-05-02 1988-06-28 International Business Machines Corporation Process for forming multilayered ceramic substrate having solid metal conductors
US4802945A (en) * 1986-10-09 1989-02-07 Hughes Aircraft Company Via filling of green ceramic tape
JPH01128587A (ja) * 1987-11-13 1989-05-22 Tdk Corp セラミック配線基板の製造方法
US5302219A (en) * 1991-04-03 1994-04-12 Coors Electronic Package Company Method for obtaining via patterns in ceramic sheets
US5309629A (en) * 1992-09-01 1994-05-10 Rogers Corporation Method of manufacturing a multilayer circuit board
KR0127666B1 (ko) * 1992-11-25 1997-12-30 모리시다 요이찌 세라믹전자부품 및 그 제조방법
US5480503A (en) * 1993-12-30 1996-01-02 International Business Machines Corporation Process for producing circuitized layers and multilayer ceramic sub-laminates and composites thereof
US5522963A (en) * 1994-05-31 1996-06-04 International Business Machines Corporation Method for machining and depositing metallurgy on ceramic layers
US5707575A (en) * 1994-07-28 1998-01-13 Micro Substrates Corporation Method for filling vias in ceramic substrates with composite metallic paste
US5821846A (en) * 1995-05-22 1998-10-13 Steward, Inc. High current ferrite electromagnetic interference suppressor and associated method
US5645673A (en) * 1995-06-02 1997-07-08 International Business Machines Corporation Lamination process for producing non-planar substrates
US5635000A (en) * 1995-12-22 1997-06-03 International Business Machines Corporation Method for screening using electrostatic adhesion
US20010001406A1 (en) * 1998-02-17 2001-05-24 Michael James Liberatore Method of making transmission lines and buried passive components in green tape
US6592696B1 (en) * 1998-10-09 2003-07-15 Motorola, Inc. Method for fabricating a multilayered structure and the structures formed by the method
US6572830B1 (en) 1998-10-09 2003-06-03 Motorola, Inc. Integrated multilayered microfludic devices and methods for making the same
US6352014B1 (en) * 1999-12-15 2002-03-05 International Business Machines Corporation Method for making punches using multi-layer ceramic technology
DE19963281A1 (de) * 1999-12-27 2001-06-28 Tridonic Bauelemente Verfahren zum Herstellen von Leiterbahnen
GB2374205B (en) * 2001-04-04 2004-12-22 Rolls Royce Plc An electrical conductor winding and a method of manufacturing an electrical conductor winding
US6676784B2 (en) 2001-07-17 2004-01-13 International Business Machines Corporation Process for the manufacture of multilayer ceramic substrates
US7332805B2 (en) * 2004-01-06 2008-02-19 International Business Machines Corporation Electronic package with improved current carrying capability and method of forming the same
JP4421910B2 (ja) * 2004-01-29 2010-02-24 日本碍子株式会社 熱処理用トレー及びそれを用いたセラミック製品の製造方法
EP2003939A1 (en) * 2007-06-14 2008-12-17 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO Method for preparing a pattern for a 3-dimensional electric circuit
EP2146559A1 (en) * 2008-07-15 2010-01-20 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO A method of forming a high density structure
US8410371B2 (en) * 2009-09-08 2013-04-02 Cree, Inc. Electronic device submounts with thermally conductive vias and light emitting devices including the same
US8772817B2 (en) 2010-12-22 2014-07-08 Cree, Inc. Electronic device submounts including substrates with thermally conductive vias
US8917106B2 (en) 2011-11-09 2014-12-23 Advantest America, Inc. Fine pitch microelectronic contact array and method of making same
CN104626334B (zh) * 2013-11-13 2017-01-11 深圳市金宝盈文化股份有限公司 金属陶瓷无缝结合工艺
CN111231561A (zh) * 2020-01-16 2020-06-05 淄博职业学院 一种多层叠彩艺术陶瓷制品及制备工艺
CN115460773A (zh) * 2022-07-26 2022-12-09 德中（天津）技术发展股份有限公司 用激光制造开口转移物料制电路板的方法、软件及设备

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2101945A1 (en) * 1971-01-15 1972-07-20 Siemens Ag Metallic coatings prodn - on semiconductor or dielectric substrates

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE420834A (enExample) * 1936-03-30
US2993815A (en) * 1959-05-25 1961-07-25 Bell Telephone Labor Inc Metallizing refractory substrates
US3293072A (en) * 1961-06-29 1966-12-20 Vitta Corp Ceramic-metallizing tape
GB966945A (en) * 1962-01-05 1964-08-19 Corning Glass Works Method of making ceramic articles
US3632365A (en) * 1967-07-13 1972-01-04 Owens Illinois Inc Decorative decal with a pyrolyzable film base
US3502491A (en) * 1967-08-02 1970-03-24 Scm Corp Method of making edge of glazed ceramic tiles
US3518756A (en) * 1967-08-22 1970-07-07 Ibm Fabrication of multilevel ceramic,microelectronic structures
US3615980A (en) * 1970-02-12 1971-10-26 Daniel J Rose Decal metallization of ceramic substrates
US3770529A (en) * 1970-08-25 1973-11-06 Ibm Method of fabricating multilayer circuits

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2101945A1 (en) * 1971-01-15 1972-07-20 Siemens Ag Metallic coatings prodn - on semiconductor or dielectric substrates

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3134918A1 (de) * 1981-09-03 1983-03-17 Matsushita Electric Industrial Co., Ltd., Kadoma, Osaka "elektrode auf waermebestaendigem isolierendem substrat und verfahren zur herstellung derselben"
US5368911A (en) * 1992-03-27 1994-11-29 General Electric Company Method for fabrication of composite materials and composite
DE102024109559B3 (de) * 2024-04-05 2025-09-11 Technische Universität Ilmenau, Körperschaft des öffentlichen Rechts 2-in-1-Prozess mit Maske-auf-Substrat-Einheit für die Herstellung eines mikroelektronischen keramischen Schaltungsträgers mit vertikalen und lateralen Feinstrukturen

Also Published As

Publication number Publication date
FR2254417B1 (enExample) 1976-12-31
US3948706A (en) 1976-04-06
JPS5228452B2 (enExample) 1977-07-27
CA1043188A (en) 1978-11-28
IT1025684B (it) 1978-08-30
JPS5091612A (enExample) 1975-07-22
GB1455938A (en) 1976-11-17
FR2254417A1 (enExample) 1975-07-11

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Legal Events

Date Code Title Description
OD Request for examination
8128 New person/name/address of the agent

Representative=s name: KINDERMANN, M., PAT.-ASS., 7030 BOEBLINGEN

8130 Withdrawal