CA1043188A - Method for metallizing ceramic green sheets - Google Patents

Method for metallizing ceramic green sheets

Info

Publication number
CA1043188A
CA1043188A CA213,802A CA213802A CA1043188A CA 1043188 A CA1043188 A CA 1043188A CA 213802 A CA213802 A CA 213802A CA 1043188 A CA1043188 A CA 1043188A
Authority
CA
Canada
Prior art keywords
green sheet
ceramic green
metallizing
ceramic
wettable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA213,802A
Other languages
English (en)
French (fr)
Other versions
CA213802S (en
Inventor
Arnold F. Schmeckenbecher
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of CA1043188A publication Critical patent/CA1043188A/en
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28B—SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
    • B28B11/00—Apparatus or processes for treating or working the shaped or preshaped articles
    • B28B11/04—Apparatus or processes for treating or working the shaped or preshaped articles for coating or applying engobing layers
    • B28B11/041—Apparatus or processes for treating or working the shaped or preshaped articles for coating or applying engobing layers for moulded articles undergoing a thermal treatment at high temperatures, such as burning, after coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1258—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by using a substrate provided with a shape pattern, e.g. grooves, banks, resist pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0568—Resist used for applying paste, ink or powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0029—Etching of the substrate by chemical or physical means by laser ablation of inorganic insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4981—Utilizing transitory attached element or associated separate material
    • Y10T29/49812—Temporary protective coating, impregnation, or cast layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • Structural Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laminated Bodies (AREA)
  • Ceramic Products (AREA)
  • Manufacturing Of Printed Wiring (AREA)
CA213,802A 1973-12-13 1974-11-15 Method for metallizing ceramic green sheets Expired CA1043188A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/424,505 US3948706A (en) 1973-12-13 1973-12-13 Method for metallizing ceramic green sheets

Publications (1)

Publication Number Publication Date
CA1043188A true CA1043188A (en) 1978-11-28

Family

ID=23682868

Family Applications (1)

Application Number Title Priority Date Filing Date
CA213,802A Expired CA1043188A (en) 1973-12-13 1974-11-15 Method for metallizing ceramic green sheets

Country Status (7)

Country Link
US (1) US3948706A (enExample)
JP (1) JPS5228452B2 (enExample)
CA (1) CA1043188A (enExample)
DE (1) DE2451485A1 (enExample)
FR (1) FR2254417B1 (enExample)
GB (1) GB1455938A (enExample)
IT (1) IT1025684B (enExample)

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CH575166A5 (enExample) * 1974-05-20 1976-04-30 Suisse Horlogerie
FR2296988A1 (fr) * 1974-12-31 1976-07-30 Ibm France Perfectionnement aux procedes de fabrication d'un module de circuits multicouches en ceramique
JPS5328266A (en) * 1976-08-13 1978-03-16 Fujitsu Ltd Method of producing multilayer ceramic substrate
US4189509A (en) * 1976-09-09 1980-02-19 Texas Instruments Incorporated Resistor device and method of making
US4169001A (en) * 1976-10-18 1979-09-25 International Business Machines Corporation Method of making multilayer module having optical channels therein
US4289719A (en) * 1976-12-10 1981-09-15 International Business Machines Corporation Method of making a multi-layer ceramic substrate
US4117588A (en) * 1977-01-24 1978-10-03 The United States Of America As Represented By The Secretary Of The Navy Method of manufacturing three dimensional integrated circuits
US4127680A (en) * 1977-02-03 1978-11-28 Sprague Electric Company Making a capacitor employing a temporary solid mask in the porous anode
US4206254A (en) * 1979-02-28 1980-06-03 International Business Machines Corporation Method of selectively depositing metal on a ceramic substrate with a metallurgy pattern
JPS55138294A (en) * 1979-04-11 1980-10-28 Matsushita Electric Industrial Co Ltd Method of forming through hole connector
JPS55165698A (en) * 1979-06-11 1980-12-24 Cho Lsi Gijutsu Kenkyu Kumiai Multilayer integrated circuit board
US4343833A (en) * 1979-06-26 1982-08-10 Mitsubishi Denki Kabushiki Kaisha Method of manufacturing thermal head
DE3134918A1 (de) * 1981-09-03 1983-03-17 Matsushita Electric Industrial Co., Ltd., Kadoma, Osaka "elektrode auf waermebestaendigem isolierendem substrat und verfahren zur herstellung derselben"
GB2124037B (en) * 1982-07-19 1986-02-26 Gen Electric Co Plc Methods of forming patterns on substrates
US4604799A (en) * 1982-09-03 1986-08-12 John Fluke Mfg. Co., Inc. Method of making molded circuit board
US4461077A (en) * 1982-10-04 1984-07-24 General Electric Ceramics, Inc. Method for preparing ceramic articles having raised, selectively metallized electrical contact points
US4586972A (en) * 1983-04-05 1986-05-06 Matsushita Electric Industrial Co., Ltd. Method for making multilayer ceramic body
US4504340A (en) * 1983-07-26 1985-03-12 International Business Machines Corporation Material and process set for fabrication of molecular matrix print head
US4546065A (en) * 1983-08-08 1985-10-08 International Business Machines Corporation Process for forming a pattern of metallurgy on the top of a ceramic substrate
US5094811A (en) * 1983-09-21 1992-03-10 Allied-Signal Method of making a printed circuit board
KR850700098A (ko) * 1983-09-21 1985-10-21 로이 에이취.맷신길 인쇄회로판 제조방법
WO1985001414A1 (en) * 1983-09-21 1985-03-28 Allied Corporation Method of making a printed circuit board
US5061438A (en) * 1983-09-21 1991-10-29 Allied-Signal Inc. Method of making a printed circuit board
US4555285A (en) * 1983-12-14 1985-11-26 International Business Machines Corporation Forming patterns in metallic or ceramic substrates
US4581098A (en) * 1984-10-19 1986-04-08 International Business Machines Corporation MLC green sheet process
US4645552A (en) * 1984-11-19 1987-02-24 Hughes Aircraft Company Process for fabricating dimensionally stable interconnect boards
US4662989A (en) * 1985-10-04 1987-05-05 Honeywell Inc. High efficiency metal lift-off process
US4766671A (en) * 1985-10-29 1988-08-30 Nec Corporation Method of manufacturing ceramic electronic device
US4753694A (en) * 1986-05-02 1988-06-28 International Business Machines Corporation Process for forming multilayered ceramic substrate having solid metal conductors
US4802945A (en) * 1986-10-09 1989-02-07 Hughes Aircraft Company Via filling of green ceramic tape
JPH01128587A (ja) * 1987-11-13 1989-05-22 Tdk Corp セラミック配線基板の製造方法
US5302219A (en) * 1991-04-03 1994-04-12 Coors Electronic Package Company Method for obtaining via patterns in ceramic sheets
US5368911A (en) * 1992-03-27 1994-11-29 General Electric Company Method for fabrication of composite materials and composite
US5309629A (en) * 1992-09-01 1994-05-10 Rogers Corporation Method of manufacturing a multilayer circuit board
KR0127666B1 (ko) * 1992-11-25 1997-12-30 모리시다 요이찌 세라믹전자부품 및 그 제조방법
US5480503A (en) * 1993-12-30 1996-01-02 International Business Machines Corporation Process for producing circuitized layers and multilayer ceramic sub-laminates and composites thereof
US5522963A (en) * 1994-05-31 1996-06-04 International Business Machines Corporation Method for machining and depositing metallurgy on ceramic layers
US5707575A (en) * 1994-07-28 1998-01-13 Micro Substrates Corporation Method for filling vias in ceramic substrates with composite metallic paste
US5821846A (en) * 1995-05-22 1998-10-13 Steward, Inc. High current ferrite electromagnetic interference suppressor and associated method
US5645673A (en) * 1995-06-02 1997-07-08 International Business Machines Corporation Lamination process for producing non-planar substrates
US5635000A (en) * 1995-12-22 1997-06-03 International Business Machines Corporation Method for screening using electrostatic adhesion
US20010001406A1 (en) * 1998-02-17 2001-05-24 Michael James Liberatore Method of making transmission lines and buried passive components in green tape
US6592696B1 (en) * 1998-10-09 2003-07-15 Motorola, Inc. Method for fabricating a multilayered structure and the structures formed by the method
US6572830B1 (en) 1998-10-09 2003-06-03 Motorola, Inc. Integrated multilayered microfludic devices and methods for making the same
US6352014B1 (en) * 1999-12-15 2002-03-05 International Business Machines Corporation Method for making punches using multi-layer ceramic technology
DE19963281A1 (de) * 1999-12-27 2001-06-28 Tridonic Bauelemente Verfahren zum Herstellen von Leiterbahnen
GB2374205B (en) * 2001-04-04 2004-12-22 Rolls Royce Plc An electrical conductor winding and a method of manufacturing an electrical conductor winding
US6676784B2 (en) 2001-07-17 2004-01-13 International Business Machines Corporation Process for the manufacture of multilayer ceramic substrates
US7332805B2 (en) * 2004-01-06 2008-02-19 International Business Machines Corporation Electronic package with improved current carrying capability and method of forming the same
JP4421910B2 (ja) * 2004-01-29 2010-02-24 日本碍子株式会社 熱処理用トレー及びそれを用いたセラミック製品の製造方法
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CN104626334B (zh) * 2013-11-13 2017-01-11 深圳市金宝盈文化股份有限公司 金属陶瓷无缝结合工艺
CN111231561A (zh) * 2020-01-16 2020-06-05 淄博职业学院 一种多层叠彩艺术陶瓷制品及制备工艺
CN115460773A (zh) * 2022-07-26 2022-12-09 德中（天津）技术发展股份有限公司 用激光制造开口转移物料制电路板的方法、软件及设备
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Also Published As

Publication number Publication date
FR2254417B1 (enExample) 1976-12-31
US3948706A (en) 1976-04-06
JPS5228452B2 (enExample) 1977-07-27
IT1025684B (it) 1978-08-30
JPS5091612A (enExample) 1975-07-22
GB1455938A (en) 1976-11-17
DE2451485A1 (de) 1975-06-19
FR2254417A1 (enExample) 1975-07-11

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