DE2364520C3 - Verfahren zur Herstellung einer gedruckten Schaltung - Google Patents

Verfahren zur Herstellung einer gedruckten Schaltung

Info

Publication number
DE2364520C3
DE2364520C3 DE2364520A DE2364520A DE2364520C3 DE 2364520 C3 DE2364520 C3 DE 2364520C3 DE 2364520 A DE2364520 A DE 2364520A DE 2364520 A DE2364520 A DE 2364520A DE 2364520 C3 DE2364520 C3 DE 2364520C3
Authority
DE
Germany
Prior art keywords
layer
resistance layer
contact
conductor tracks
resistance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE2364520A
Other languages
German (de)
English (en)
Other versions
DE2364520B2 (de
DE2364520A1 (de
Inventor
Tsumoru Miyagi Oka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alps Alpine Co Ltd
Original Assignee
Alps Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alps Electric Co Ltd filed Critical Alps Electric Co Ltd
Publication of DE2364520A1 publication Critical patent/DE2364520A1/de
Publication of DE2364520B2 publication Critical patent/DE2364520B2/de
Application granted granted Critical
Publication of DE2364520C3 publication Critical patent/DE2364520C3/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors
    • H01C1/142—Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors the terminals or tapping points being coated on the resistive element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/0284—Paper, e.g. as reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/0293—Non-woven fibrous reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/035—Paste overlayer, i.e. conductive paste or solder paste over conductive layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0753—Insulation
    • H05K2201/0769—Anti metal-migration, e.g. avoiding tin whisker growth
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H05K3/247—Finish coating of conductors by using conductive pastes, inks or powders
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y10T29/49099—Coating resistive material on a base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y10T29/49101—Applying terminal

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Adjustable Resistors (AREA)
  • Non-Adjustable Resistors (AREA)
DE2364520A 1972-12-28 1973-12-24 Verfahren zur Herstellung einer gedruckten Schaltung Expired DE2364520C3 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP732761A JPS5535843B2 (en:Method) 1972-12-28 1972-12-28

Publications (3)

Publication Number Publication Date
DE2364520A1 DE2364520A1 (de) 1974-07-18
DE2364520B2 DE2364520B2 (de) 1978-01-26
DE2364520C3 true DE2364520C3 (de) 1982-01-21

Family

ID=11538307

Family Applications (1)

Application Number Title Priority Date Filing Date
DE2364520A Expired DE2364520C3 (de) 1972-12-28 1973-12-24 Verfahren zur Herstellung einer gedruckten Schaltung

Country Status (3)

Country Link
US (1) US4087779A (en:Method)
JP (1) JPS5535843B2 (en:Method)
DE (1) DE2364520C3 (en:Method)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3433196A1 (de) * 1983-09-09 1985-03-28 TDK Corporation, Tokio/Tokyo Ptc-widerstandsvorrichtung
DE9102576U1 (de) * 1991-03-05 1991-05-23 Hella KG Hueck & Co, 4780 Lippstadt Widerstands-/Sensoranordnung
DE4332282A1 (de) * 1993-09-23 1995-03-30 Sel Alcatel Ag Verfahren zur Herstellung von gedruckten Schaltungen
DE4408441A1 (de) * 1994-03-12 1995-09-14 Telefunken Microelectron Hochspannungs-Trimmpotentiometer

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2748271C3 (de) * 1977-10-27 1981-07-16 Wilhelm Ruf KG, 8000 München Gedruckte Leiterplatte und Verfahren zur Herstellung derselben
DE2803762A1 (de) * 1978-01-28 1979-08-02 Licentia Gmbh Verfahren zur additiven nasschemischen herstellung von schaltungsnetzwerken
FR2568082B1 (fr) * 1984-07-23 1993-08-13 Constr Telephoniques Procede pour la realisation de zones de dissipation thermique.
JPS63205991A (ja) * 1987-02-23 1988-08-25 株式会社日立製作所 回路基板
JPH0263101A (ja) * 1988-08-29 1990-03-02 Murata Mfg Co Ltd 可変抵抗器
JPH03211802A (ja) * 1990-01-17 1991-09-17 Aisin Seiki Co Ltd スイッチ付可変抵抗器
JPH09186006A (ja) * 1995-12-28 1997-07-15 Hokuriku Electric Ind Co Ltd 高電圧用抵抗器ユニット及び高電圧用可変抵抗器ユニット
DE10042764A1 (de) 2000-08-31 2002-03-14 Moeller Gmbh Verfahren zur Herstellung eines massereichen ohmschen Widerstands und elektronische Baueinheit
KR100619352B1 (ko) * 2005-04-29 2006-09-06 삼성전기주식회사 개질된 환형 올레핀 공중합체를 이용한 섬유 직물 강화재,및 인쇄회로기판용 수지기판

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2662957A (en) * 1949-10-29 1953-12-15 Eisler Paul Electrical resistor or semiconductor
US2758275A (en) * 1952-12-12 1956-08-07 Fox Prod Co Battery testing apparatus
US2781277A (en) * 1954-01-12 1957-02-12 Sanders Associates Inc Method of manufacturing electrical resistors
US3391373A (en) * 1965-07-12 1968-07-02 Western Electric Co Beta tantalum resistors
US3629782A (en) * 1970-10-06 1971-12-21 Cogar Corp Resistor with means for decreasing current density
DE2050675A1 (de) * 1970-10-15 1972-04-20 Vdo Schindling Kleindreh widerstand
US3808576A (en) * 1971-01-15 1974-04-30 Mica Corp Circuit board with resistance layer
US3848111A (en) * 1973-09-24 1974-11-12 Corning Glass Works Electrical heating unit

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3433196A1 (de) * 1983-09-09 1985-03-28 TDK Corporation, Tokio/Tokyo Ptc-widerstandsvorrichtung
DE9102576U1 (de) * 1991-03-05 1991-05-23 Hella KG Hueck & Co, 4780 Lippstadt Widerstands-/Sensoranordnung
DE4332282A1 (de) * 1993-09-23 1995-03-30 Sel Alcatel Ag Verfahren zur Herstellung von gedruckten Schaltungen
DE4408441A1 (de) * 1994-03-12 1995-09-14 Telefunken Microelectron Hochspannungs-Trimmpotentiometer

Also Published As

Publication number Publication date
JPS5535843B2 (en:Method) 1980-09-17
DE2364520B2 (de) 1978-01-26
US4087779A (en) 1978-05-02
DE2364520A1 (de) 1974-07-18
JPS4989148A (en:Method) 1974-08-26

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Legal Events

Date Code Title Description
C3 Grant after two publication steps (3rd publication)