FR2568082B1 - Procede pour la realisation de zones de dissipation thermique. - Google Patents

Procede pour la realisation de zones de dissipation thermique.

Info

Publication number
FR2568082B1
FR2568082B1 FR8411640A FR8411640A FR2568082B1 FR 2568082 B1 FR2568082 B1 FR 2568082B1 FR 8411640 A FR8411640 A FR 8411640A FR 8411640 A FR8411640 A FR 8411640A FR 2568082 B1 FR2568082 B1 FR 2568082B1
Authority
FR
France
Prior art keywords
production
thermal dissipation
dissipation areas
areas
thermal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR8411640A
Other languages
English (en)
Other versions
FR2568082A1 (fr
Inventor
Jean-Claude Pedron
Michel Barbot
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Constr Telephoniques
Original Assignee
Constr Telephoniques
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Constr Telephoniques filed Critical Constr Telephoniques
Priority to FR8411640A priority Critical patent/FR2568082B1/fr
Publication of FR2568082A1 publication Critical patent/FR2568082A1/fr
Application granted granted Critical
Publication of FR2568082B1 publication Critical patent/FR2568082B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0212—Printed circuits or mounted components having integral heating means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09727—Varying width along a single conductor; Conductors or pads having different widths
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1115—Resistance heating, e.g. by current through the PCB conductors or through a metallic mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/162—Testing a finished product, e.g. heat cycle testing of solder joints
FR8411640A 1984-07-23 1984-07-23 Procede pour la realisation de zones de dissipation thermique. Expired - Fee Related FR2568082B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR8411640A FR2568082B1 (fr) 1984-07-23 1984-07-23 Procede pour la realisation de zones de dissipation thermique.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8411640A FR2568082B1 (fr) 1984-07-23 1984-07-23 Procede pour la realisation de zones de dissipation thermique.

Publications (2)

Publication Number Publication Date
FR2568082A1 FR2568082A1 (fr) 1986-01-24
FR2568082B1 true FR2568082B1 (fr) 1993-08-13

Family

ID=9306382

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8411640A Expired - Fee Related FR2568082B1 (fr) 1984-07-23 1984-07-23 Procede pour la realisation de zones de dissipation thermique.

Country Status (1)

Country Link
FR (1) FR2568082B1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2670597B1 (fr) * 1990-12-18 1994-06-17 Thomson Csf Procede et systeme de modelisation thermique d'un composant.
DE19633923A1 (de) * 1996-08-22 1998-02-26 Siemens Ag Chipkarte mit einer Induktionsspule und Verfahren zu ihrer Herstellung

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5535843B2 (fr) * 1972-12-28 1980-09-17

Also Published As

Publication number Publication date
FR2568082A1 (fr) 1986-01-24

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Legal Events

Date Code Title Description
TP Transmission of property
ST Notification of lapse