DE2339035C3 - Lichtempfindliches Aufzeichnungsmaterial und dessen Verwendung - Google Patents
Lichtempfindliches Aufzeichnungsmaterial und dessen VerwendungInfo
- Publication number
- DE2339035C3 DE2339035C3 DE2339035A DE2339035A DE2339035C3 DE 2339035 C3 DE2339035 C3 DE 2339035C3 DE 2339035 A DE2339035 A DE 2339035A DE 2339035 A DE2339035 A DE 2339035A DE 2339035 C3 DE2339035 C3 DE 2339035C3
- Authority
- DE
- Germany
- Prior art keywords
- epoxy resin
- recording material
- diazonium
- coating
- exposed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000463 material Substances 0.000 title claims description 17
- 239000003822 epoxy resin Substances 0.000 claims description 28
- 229920000647 polyepoxide Polymers 0.000 claims description 28
- 239000012954 diazonium Substances 0.000 claims description 17
- 150000001989 diazonium salts Chemical class 0.000 claims description 12
- -1 diazonium cation Chemical class 0.000 claims description 6
- 150000001450 anions Chemical class 0.000 claims description 4
- DGTVXEHQMSJRPE-UHFFFAOYSA-M difluorophosphinate Chemical group [O-]P(F)(F)=O DGTVXEHQMSJRPE-UHFFFAOYSA-M 0.000 claims description 4
- 239000003960 organic solvent Substances 0.000 claims description 2
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 21
- 239000011248 coating agent Substances 0.000 description 18
- 238000000576 coating method Methods 0.000 description 18
- XLLIQLLCWZCATF-UHFFFAOYSA-N 2-methoxyethyl acetate Chemical compound COCCOC(C)=O XLLIQLLCWZCATF-UHFFFAOYSA-N 0.000 description 10
- 238000007639 printing Methods 0.000 description 10
- 239000000203 mixture Substances 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 7
- 229910052782 aluminium Inorganic materials 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 239000007787 solid Substances 0.000 description 6
- 229920003986 novolac Polymers 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000011888 foil Substances 0.000 description 4
- 229920006267 polyester film Polymers 0.000 description 4
- PBYZMCDFOULPGH-UHFFFAOYSA-N tungstate Chemical compound [O-][W]([O-])(=O)=O PBYZMCDFOULPGH-UHFFFAOYSA-N 0.000 description 4
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 3
- CIZVQWNPBGYCGK-UHFFFAOYSA-N benzenediazonium Chemical compound N#[N+]C1=CC=CC=C1 CIZVQWNPBGYCGK-UHFFFAOYSA-N 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-O diazynium Chemical compound [NH+]#N IJGRMHOSHXDMSA-UHFFFAOYSA-O 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 229920003002 synthetic resin Polymers 0.000 description 3
- 239000000057 synthetic resin Substances 0.000 description 3
- 238000005406 washing Methods 0.000 description 3
- JDSKFGOGMQWSQN-UHFFFAOYSA-O 2-sulfanylbenzenediazonium Chemical compound SC1=CC=CC=C1[N+]#N JDSKFGOGMQWSQN-UHFFFAOYSA-O 0.000 description 2
- VGVHNLRUAMRIEW-UHFFFAOYSA-N 4-methylcyclohexan-1-one Chemical compound CC1CCC(=O)CC1 VGVHNLRUAMRIEW-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- 150000001768 cations Chemical class 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- 125000001891 dimethoxy group Chemical group [H]C([H])([H])O* 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- OEZDYMAFWLGKFC-UHFFFAOYSA-N n-(2,5-diethoxyphenyl)benzamide Chemical compound CCOC1=CC=C(OCC)C(NC(=O)C=2C=CC=CC=2)=C1 OEZDYMAFWLGKFC-UHFFFAOYSA-N 0.000 description 2
- 229920006254 polymer film Polymers 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 1
- 239000002841 Lewis acid Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 206010034972 Photosensitivity reaction Diseases 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 150000008280 chlorinated hydrocarbons Chemical class 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 239000012153 distilled water Substances 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000011152 fibreglass Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 150000002334 glycols Chemical class 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 150000007517 lewis acids Chemical class 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 230000036211 photosensitivity Effects 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 238000010926 purge Methods 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000011877 solvent mixture Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229920001059 synthetic polymer Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/016—Diazonium salts or compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/12—Production of screen printing forms or similar printing forms, e.g. stencils
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/28—Processing photosensitive materials; Apparatus therefor for obtaining powder images
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Materials For Photolithography (AREA)
- Epoxy Compounds (AREA)
- Epoxy Resins (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB3598372A GB1376840A (en) | 1972-08-02 | 1972-08-02 | Photosensitive compositions and their uses |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| DE2339035A1 DE2339035A1 (de) | 1974-02-14 |
| DE2339035B2 DE2339035B2 (de) | 1979-05-17 |
| DE2339035C3 true DE2339035C3 (de) | 1980-01-31 |
Family
ID=10383683
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE2339035A Expired DE2339035C3 (de) | 1972-08-02 | 1973-08-01 | Lichtempfindliches Aufzeichnungsmaterial und dessen Verwendung |
Country Status (12)
| Country | Link |
|---|---|
| US (1) | US3930856A (OSRAM) |
| AU (1) | AU465209B2 (OSRAM) |
| BE (1) | BE803119A (OSRAM) |
| CA (1) | CA1003260A (OSRAM) |
| DE (1) | DE2339035C3 (OSRAM) |
| FR (1) | FR2194984A1 (OSRAM) |
| GB (1) | GB1376840A (OSRAM) |
| IT (1) | IT990050B (OSRAM) |
| NL (1) | NL7310707A (OSRAM) |
| NO (1) | NO139874C (OSRAM) |
| SE (1) | SE398677B (OSRAM) |
| ZA (1) | ZA735028B (OSRAM) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2452729A1 (fr) * | 1979-03-28 | 1980-10-24 | Rhone Poulenc Syst | Article pour la realisation d'auxiliaires visuels tels que films de montage pour l'impression phonographique |
| FR2452731A1 (fr) * | 1979-03-28 | 1980-10-24 | Rhone Poulenc Syst | Compositions photopolymerisables filmogenes developpables a l'eau |
| FR2475753B1 (fr) * | 1980-02-11 | 1987-03-20 | Rhone Poulenc Syst | Plaque lithographique a base de fluoborate de paradiazodiphenylamine et de resine epoxy liquide |
| US4771005A (en) * | 1983-06-27 | 1988-09-13 | Erez Forensic Technology Ltd. | Reagents, test kits and methods for the detection of cannabinoids |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL270834A (OSRAM) * | 1960-10-31 | |||
| NL278337A (OSRAM) * | 1961-05-12 | |||
| US3155513A (en) * | 1961-10-30 | 1964-11-03 | Minnesota Mining & Mfg | Heat sensitive sheet material and method of making |
| US3205157A (en) * | 1962-03-13 | 1965-09-07 | North American Aviation Inc | Electromagnetic radiation polymerization |
| SE335474B (OSRAM) * | 1963-04-18 | 1971-05-24 | R Landau | |
| DE1447016C3 (de) * | 1963-10-25 | 1973-11-15 | Kalle Ag, 6202 Wiesbaden-Biebrich | Vorsensibilisierte Druckplatte |
| US3433769A (en) * | 1965-11-12 | 1969-03-18 | Us Air Force | Curing system for ethoxyline resins consisting of a solution of phosphomolybdic acid and a hydroxy phosphate ester |
| US3585034A (en) * | 1967-04-03 | 1971-06-15 | Gaf Corp | Manufacture of phosphor screens |
| US3703496A (en) * | 1967-10-20 | 1972-11-21 | Hooker Chemical Corp | Hydrolytic stabilizer of phosphite esters and use as epoxy resin stabilizer |
| US3708296A (en) * | 1968-08-20 | 1973-01-02 | American Can Co | Photopolymerization of epoxy monomers |
| US3711390A (en) * | 1971-05-18 | 1973-01-16 | J Feinberg | Photopolymerizable epoxy systems containing substituted cyclic amides or substituted ureas as gelation inhibitors |
-
1972
- 1972-08-02 GB GB3598372A patent/GB1376840A/en not_active Expired
-
1973
- 1973-07-24 NO NO2990/73A patent/NO139874C/no unknown
- 1973-07-24 ZA ZA735028A patent/ZA735028B/xx unknown
- 1973-07-24 CA CA177,240A patent/CA1003260A/en not_active Expired
- 1973-07-25 US US05/382,330 patent/US3930856A/en not_active Expired - Lifetime
- 1973-07-27 AU AU58609/73A patent/AU465209B2/en not_active Expired
- 1973-07-27 IT IT51704/73A patent/IT990050B/it active
- 1973-07-31 SE SE7310550A patent/SE398677B/xx unknown
- 1973-08-01 BE BE134153A patent/BE803119A/xx unknown
- 1973-08-01 DE DE2339035A patent/DE2339035C3/de not_active Expired
- 1973-08-02 FR FR7328356A patent/FR2194984A1/fr not_active Withdrawn
- 1973-08-02 NL NL7310707A patent/NL7310707A/xx not_active Application Discontinuation
Also Published As
| Publication number | Publication date |
|---|---|
| NO139874C (no) | 1979-05-23 |
| SE398677B (sv) | 1978-01-09 |
| CA1003260A (en) | 1977-01-11 |
| NO139874B (no) | 1979-02-12 |
| AU5860973A (en) | 1975-01-30 |
| IT990050B (it) | 1975-06-20 |
| BE803119A (fr) | 1973-12-03 |
| AU465209B2 (en) | 1975-09-18 |
| ZA735028B (en) | 1974-06-26 |
| US3930856A (en) | 1976-01-06 |
| GB1376840A (en) | 1974-12-11 |
| NL7310707A (OSRAM) | 1974-02-05 |
| DE2339035B2 (de) | 1979-05-17 |
| FR2194984A1 (OSRAM) | 1974-03-01 |
| DE2339035A1 (de) | 1974-02-14 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C3 | Grant after two publication steps (3rd publication) | ||
| 8339 | Ceased/non-payment of the annual fee |