DE2332574A1 - Verfahren zur herstellung eines halbleiters und halbleitervorrichtung - Google Patents
Verfahren zur herstellung eines halbleiters und halbleitervorrichtungInfo
- Publication number
- DE2332574A1 DE2332574A1 DE2332574A DE2332574A DE2332574A1 DE 2332574 A1 DE2332574 A1 DE 2332574A1 DE 2332574 A DE2332574 A DE 2332574A DE 2332574 A DE2332574 A DE 2332574A DE 2332574 A1 DE2332574 A1 DE 2332574A1
- Authority
- DE
- Germany
- Prior art keywords
- element according
- layer
- face
- conductive
- cathode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body (electrodes)
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
- H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D99/00—Subject matter not provided for in other groups of this subclass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01014—Silicon [Si]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01015—Phosphorus [P]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01018—Argon [Ar]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01042—Molybdenum [Mo]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01047—Silver [Ag]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01058—Cerium [Ce]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01077—Iridium [Ir]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1301—Thyristor
- H01L2924/13034—Silicon Controlled Rectifier [SCR]
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electrodes Of Semiconductors (AREA)
- Thyristors (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB3036472 | 1972-06-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE2332574A1 true DE2332574A1 (de) | 1974-01-10 |
Family
ID=10306498
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE2332574A Pending DE2332574A1 (de) | 1972-06-28 | 1973-06-27 | Verfahren zur herstellung eines halbleiters und halbleitervorrichtung |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPS4944680A (enExample) |
| DE (1) | DE2332574A1 (enExample) |
| FR (1) | FR2191267B1 (enExample) |
| IT (1) | IT986605B (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3503709A1 (de) * | 1984-02-23 | 1985-08-29 | Mitsubishi Denki K.K., Tokio/Tokyo | Verfahren zur befestigung einer einsatzelektrodenplatte in eine druckgebondete halbleitereinrichtung |
| AT393009B (de) * | 1989-11-07 | 1991-07-25 | Poska Albertas Ionas Antanovic | Selbsttaetiges ventil |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5263494U (enExample) * | 1975-10-31 | 1977-05-11 | ||
| JPS5773945A (en) * | 1980-10-27 | 1982-05-08 | Hitachi Ltd | Semiconductor device |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1514563A1 (de) * | 1965-09-07 | 1969-06-19 | Semikron Gleichrichterbau | Steuerbares Halbleiterbauelement |
| FR1530863A (fr) * | 1966-07-07 | 1968-06-28 | Asea Ab | Empilage de semi-conducteurs se prêtant à la commande |
| DE1288690B (de) * | 1966-08-03 | 1969-02-06 | Itt Ind Gmbh Deutsche | Verfahren zum Herstellen eines gut haftenden Kontaktes mit Aluminium an einem Siliziumhalbleiterkoerper |
| US3508324A (en) * | 1967-02-13 | 1970-04-28 | Philco Ford Corp | Method of making contacts to semiconductor devices |
| US3611066A (en) * | 1969-12-12 | 1971-10-05 | Gen Electric | Thyristor with integrated ballasted gate auxiliary thyristor portion |
| DE2064110A1 (de) * | 1970-01-02 | 1971-07-08 | Westinghouse Electric Corp | Mittels einer Gate-Elektrode steuerbare Schalteinrichtung |
| DE2103146A1 (de) * | 1970-01-26 | 1971-08-05 | Westinghouse Electric Corp | Mittels einer Gate Elektrode Steuer bares Schaltelement |
| US3654529A (en) * | 1971-04-05 | 1972-04-04 | Gen Electric | Loose contact press pack |
-
1973
- 1973-06-26 FR FR7323214A patent/FR2191267B1/fr not_active Expired
- 1973-06-27 DE DE2332574A patent/DE2332574A1/de active Pending
- 1973-06-27 IT IT6892373A patent/IT986605B/it active
- 1973-06-28 JP JP7235173A patent/JPS4944680A/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3503709A1 (de) * | 1984-02-23 | 1985-08-29 | Mitsubishi Denki K.K., Tokio/Tokyo | Verfahren zur befestigung einer einsatzelektrodenplatte in eine druckgebondete halbleitereinrichtung |
| AT393009B (de) * | 1989-11-07 | 1991-07-25 | Poska Albertas Ionas Antanovic | Selbsttaetiges ventil |
Also Published As
| Publication number | Publication date |
|---|---|
| IT986605B (it) | 1975-01-30 |
| FR2191267B1 (enExample) | 1977-02-18 |
| JPS4944680A (enExample) | 1974-04-26 |
| FR2191267A1 (enExample) | 1974-02-01 |
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