DE2317404A1 - Bauelementplaettchen fuer eine vielschichtige elektrische schaltungsanordnung - Google Patents

Bauelementplaettchen fuer eine vielschichtige elektrische schaltungsanordnung

Info

Publication number
DE2317404A1
DE2317404A1 DE2317404A DE2317404A DE2317404A1 DE 2317404 A1 DE2317404 A1 DE 2317404A1 DE 2317404 A DE2317404 A DE 2317404A DE 2317404 A DE2317404 A DE 2317404A DE 2317404 A1 DE2317404 A1 DE 2317404A1
Authority
DE
Germany
Prior art keywords
component
sheet
platelets
connection
cavity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE2317404A
Other languages
German (de)
English (en)
Inventor
Howard Lee Parks
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bunker Ramo Corp
Original Assignee
Bunker Ramo Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bunker Ramo Corp filed Critical Bunker Ramo Corp
Publication of DE2317404A1 publication Critical patent/DE2317404A1/de
Pending legal-status Critical Current

Links

Classifications

    • H10W76/60—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
    • H05K3/445—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits having insulated holes or insulated via connections through the metal core
    • H10W70/611—
    • H10W90/00—
    • H10W90/401—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09745—Recess in conductor, e.g. in pad or in metallic substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09881—Coating only between conductors, i.e. flush with the conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0323—Working metal substrate or core, e.g. by etching, deforming
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H10W72/01—
    • H10W72/5363—
    • H10W72/932—
    • H10W90/20—
    • H10W90/22—
    • H10W90/291—
    • H10W90/297—
    • H10W90/754—

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Laminated Bodies (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Combinations Of Printed Boards (AREA)
  • Lead Frames For Integrated Circuits (AREA)
DE2317404A 1972-04-27 1973-04-06 Bauelementplaettchen fuer eine vielschichtige elektrische schaltungsanordnung Pending DE2317404A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US24800272A 1972-04-27 1972-04-27

Publications (1)

Publication Number Publication Date
DE2317404A1 true DE2317404A1 (de) 1973-11-15

Family

ID=22937240

Family Applications (1)

Application Number Title Priority Date Filing Date
DE2317404A Pending DE2317404A1 (de) 1972-04-27 1973-04-06 Bauelementplaettchen fuer eine vielschichtige elektrische schaltungsanordnung

Country Status (8)

Country Link
JP (1) JPS5644599B2 (cg-RX-API-DMAC10.html)
CA (1) CA977451A (cg-RX-API-DMAC10.html)
CH (1) CH560500A5 (cg-RX-API-DMAC10.html)
DE (1) DE2317404A1 (cg-RX-API-DMAC10.html)
GB (1) GB1429078A (cg-RX-API-DMAC10.html)
NL (1) NL7304648A (cg-RX-API-DMAC10.html)
SE (1) SE385538B (cg-RX-API-DMAC10.html)
ZA (1) ZA731895B (cg-RX-API-DMAC10.html)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5262782U (cg-RX-API-DMAC10.html) * 1975-11-04 1977-05-09
JPS54111661U (cg-RX-API-DMAC10.html) * 1978-01-20 1979-08-06
JPS6270107A (ja) * 1985-09-24 1987-03-31 Okura Yusoki Co Ltd 搬送装置
JPS6253221U (cg-RX-API-DMAC10.html) * 1985-09-24 1987-04-02
JPS62156847A (ja) * 1985-12-28 1987-07-11 Ibiden Co Ltd 多層プリント配線板の製造方法
JPS6487417A (en) * 1987-09-25 1989-03-31 Nippon Denso Co Method and device for transferring pallet
US5006923A (en) * 1989-09-14 1991-04-09 Litton Systems, Inc. Stackable multilayer substrate for mounting integrated circuits
JP2833947B2 (ja) * 1992-12-24 1998-12-09 加茂精工株式会社 カムによる間欠回転装置
US5423119A (en) * 1994-07-08 1995-06-13 Hualon Microelectronics Corporation Method for manufacturing a hybrid circuit charge-coupled device image sensor
DE102012212249B4 (de) * 2012-07-12 2016-02-25 Infineon Technologies Ag Verfahren zur Herstellung eines Verbundes und eines Halbleitermoduls
US20250379129A1 (en) * 2024-06-05 2025-12-11 Qualcomm Incorporated Conductive structure and interconnects for electrically connecting a substrate and an interposer

Also Published As

Publication number Publication date
SE385538B (sv) 1976-07-05
CA977451A (en) 1975-11-04
JPS4949157A (cg-RX-API-DMAC10.html) 1974-05-13
CH560500A5 (cg-RX-API-DMAC10.html) 1975-03-27
JPS5644599B2 (cg-RX-API-DMAC10.html) 1981-10-20
AU5343873A (en) 1974-09-19
ZA731895B (en) 1973-12-19
GB1429078A (en) 1976-03-24
NL7304648A (cg-RX-API-DMAC10.html) 1973-10-30

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Legal Events

Date Code Title Description
OHA Expiration of time for request for examination