DE2316118C3 - Verfahren zur Herstellung von Feldeffekttransistoren durch Anwendung einer selektiven Getterung - Google Patents
Verfahren zur Herstellung von Feldeffekttransistoren durch Anwendung einer selektiven GetterungInfo
- Publication number
- DE2316118C3 DE2316118C3 DE2316118A DE2316118A DE2316118C3 DE 2316118 C3 DE2316118 C3 DE 2316118C3 DE 2316118 A DE2316118 A DE 2316118A DE 2316118 A DE2316118 A DE 2316118A DE 2316118 C3 DE2316118 C3 DE 2316118C3
- Authority
- DE
- Germany
- Prior art keywords
- layer
- openings
- gettering
- areas
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000000034 method Methods 0.000 title claims description 38
- 238000005247 gettering Methods 0.000 title claims description 23
- 230000005669 field effect Effects 0.000 title claims description 17
- 238000004519 manufacturing process Methods 0.000 title claims description 17
- 239000004065 semiconductor Substances 0.000 claims description 26
- 239000012535 impurity Substances 0.000 claims description 11
- 238000009792 diffusion process Methods 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 9
- 238000007669 thermal treatment Methods 0.000 claims description 3
- 238000005530 etching Methods 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 description 16
- 239000010703 silicon Substances 0.000 description 16
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 15
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 13
- 229910052751 metal Inorganic materials 0.000 description 10
- 239000002184 metal Substances 0.000 description 10
- 239000000758 substrate Substances 0.000 description 9
- 229910052782 aluminium Inorganic materials 0.000 description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 8
- 229910052594 sapphire Inorganic materials 0.000 description 5
- 239000010980 sapphire Substances 0.000 description 5
- 229910052814 silicon oxide Inorganic materials 0.000 description 5
- 230000003647 oxidation Effects 0.000 description 4
- 238000007254 oxidation reaction Methods 0.000 description 4
- 235000012239 silicon dioxide Nutrition 0.000 description 4
- 239000000377 silicon dioxide Substances 0.000 description 4
- 229910052596 spinel Inorganic materials 0.000 description 4
- 239000011029 spinel Substances 0.000 description 4
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 3
- 229910052796 boron Inorganic materials 0.000 description 3
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- 230000004927 fusion Effects 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- 150000004767 nitrides Chemical class 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 229910020068 MgAl Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 238000011417 postcuring Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 150000003376 silicon Chemical class 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/22—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities
- H01L21/225—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities using diffusion into or out of a solid from or into a solid phase, e.g. a doped oxide layer
- H01L21/2251—Diffusion into or out of group IV semiconductors
- H01L21/2254—Diffusion into or out of group IV semiconductors from or through or into an applied layer, e.g. photoresist, nitrides
- H01L21/2255—Diffusion into or out of group IV semiconductors from or through or into an applied layer, e.g. photoresist, nitrides the applied layer comprising oxides only, e.g. P2O5, PSG, H3BO3, doped oxides
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6704—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device
- H10D30/6713—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device characterised by the properties of the source or drain regions, e.g. compositions or sectional shapes
- H10D30/6715—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device characterised by the properties of the source or drain regions, e.g. compositions or sectional shapes characterised by the doping profiles, e.g. having lightly-doped source or drain extensions
- H10D30/6717—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device characterised by the properties of the source or drain regions, e.g. compositions or sectional shapes characterised by the doping profiles, e.g. having lightly-doped source or drain extensions the source and the drain regions being asymmetrical
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/01—Manufacture or treatment
- H10D86/03—Manufacture or treatment wherein the substrate comprises sapphire, e.g. silicon-on-sapphire [SOS]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/043—Dual dielectric
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/053—Field effect transistors fets
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/15—Silicon on sapphire SOS
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S257/00—Active solid-state devices, e.g. transistors, solid-state diodes
- Y10S257/913—Active solid-state devices, e.g. transistors, solid-state diodes with means to absorb or localize unwanted impurities or defects from semiconductors, e.g. heavy metal gettering
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Thin Film Transistor (AREA)
- Bipolar Transistors (AREA)
Priority Applications (13)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE2316118A DE2316118C3 (de) | 1973-03-30 | 1973-03-30 | Verfahren zur Herstellung von Feldeffekttransistoren durch Anwendung einer selektiven Getterung |
| AT222874A AT339378B (de) | 1973-03-30 | 1974-03-18 | Verfahren zur herstellung von feldeffekttransistoren durch anwendung einer selektiven getterung |
| FR7409452A FR2223839B1 (enExample) | 1973-03-30 | 1974-03-20 | |
| CH402574A CH570041A5 (enExample) | 1973-03-30 | 1974-03-22 | |
| IT49646/74A IT1003883B (it) | 1973-03-30 | 1974-03-26 | Procedimento per fabbricare transi stori a effetto di campo applicando un processo di assorbimento selet tivo |
| GB1331374A GB1460489A (en) | 1973-03-30 | 1974-03-26 | Field-effect transistors |
| NL7404256A NL7404256A (enExample) | 1973-03-30 | 1974-03-28 | |
| JP3508174A JPS5648986B2 (enExample) | 1973-03-30 | 1974-03-28 | |
| LU69732A LU69732A1 (enExample) | 1973-03-30 | 1974-03-28 | |
| US455589A US3897625A (en) | 1973-03-30 | 1974-03-28 | Method for the production of field effect transistors by the application of selective gettering |
| CA196,351A CA991317A (en) | 1973-03-30 | 1974-03-29 | Method for the production of field effect transistors by the application of selective gettering |
| SE7404271A SE394767B (sv) | 1973-03-30 | 1974-03-29 | Forfarande for framstellning av felteffekttransistorer med ett kanalomrade med kort kanallengd |
| BE142635A BE813048A (fr) | 1973-03-30 | 1974-03-29 | Procede pour fabriquer des transistors a effet de champ en utilisant une getterisation selective |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE2316118A DE2316118C3 (de) | 1973-03-30 | 1973-03-30 | Verfahren zur Herstellung von Feldeffekttransistoren durch Anwendung einer selektiven Getterung |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| DE2316118A1 DE2316118A1 (de) | 1974-10-10 |
| DE2316118B2 DE2316118B2 (enExample) | 1975-04-03 |
| DE2316118C3 true DE2316118C3 (de) | 1975-11-27 |
Family
ID=5876584
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE2316118A Expired DE2316118C3 (de) | 1973-03-30 | 1973-03-30 | Verfahren zur Herstellung von Feldeffekttransistoren durch Anwendung einer selektiven Getterung |
Country Status (13)
| Country | Link |
|---|---|
| US (1) | US3897625A (enExample) |
| JP (1) | JPS5648986B2 (enExample) |
| AT (1) | AT339378B (enExample) |
| BE (1) | BE813048A (enExample) |
| CA (1) | CA991317A (enExample) |
| CH (1) | CH570041A5 (enExample) |
| DE (1) | DE2316118C3 (enExample) |
| FR (1) | FR2223839B1 (enExample) |
| GB (1) | GB1460489A (enExample) |
| IT (1) | IT1003883B (enExample) |
| LU (1) | LU69732A1 (enExample) |
| NL (1) | NL7404256A (enExample) |
| SE (1) | SE394767B (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2801085A1 (de) * | 1977-01-11 | 1978-07-13 | Zaidan Hojin Handotai Kenkyu | Statischer induktionstransistor |
| US4333224A (en) * | 1978-04-24 | 1982-06-08 | Buchanan Bobby L | Method of fabricating polysilicon/silicon junction field effect transistors |
| US4380113A (en) * | 1980-11-17 | 1983-04-19 | Signetics Corporation | Process for fabricating a high capacity memory cell |
| US4998146A (en) * | 1989-05-24 | 1991-03-05 | Xerox Corporation | High voltage thin film transistor |
| FR2774509B1 (fr) * | 1998-01-30 | 2001-11-16 | Sgs Thomson Microelectronics | Procede de depot d'une region de silicium monocristallin |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3490964A (en) * | 1966-04-29 | 1970-01-20 | Texas Instruments Inc | Process of forming semiconductor devices by masking and diffusion |
| US3783052A (en) * | 1972-11-10 | 1974-01-01 | Motorola Inc | Process for manufacturing integrated circuits on an alumina substrate |
| US3837071A (en) * | 1973-01-16 | 1974-09-24 | Rca Corp | Method of simultaneously making a sigfet and a mosfet |
-
1973
- 1973-03-30 DE DE2316118A patent/DE2316118C3/de not_active Expired
-
1974
- 1974-03-18 AT AT222874A patent/AT339378B/de not_active IP Right Cessation
- 1974-03-20 FR FR7409452A patent/FR2223839B1/fr not_active Expired
- 1974-03-22 CH CH402574A patent/CH570041A5/xx not_active IP Right Cessation
- 1974-03-26 IT IT49646/74A patent/IT1003883B/it active
- 1974-03-26 GB GB1331374A patent/GB1460489A/en not_active Expired
- 1974-03-28 NL NL7404256A patent/NL7404256A/xx unknown
- 1974-03-28 LU LU69732A patent/LU69732A1/xx unknown
- 1974-03-28 US US455589A patent/US3897625A/en not_active Expired - Lifetime
- 1974-03-28 JP JP3508174A patent/JPS5648986B2/ja not_active Expired
- 1974-03-29 BE BE142635A patent/BE813048A/xx unknown
- 1974-03-29 SE SE7404271A patent/SE394767B/xx unknown
- 1974-03-29 CA CA196,351A patent/CA991317A/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5648986B2 (enExample) | 1981-11-19 |
| LU69732A1 (enExample) | 1974-07-17 |
| US3897625A (en) | 1975-08-05 |
| BE813048A (fr) | 1974-07-15 |
| GB1460489A (en) | 1977-01-06 |
| SE394767B (sv) | 1977-07-04 |
| FR2223839B1 (enExample) | 1978-02-10 |
| NL7404256A (enExample) | 1974-10-02 |
| CH570041A5 (enExample) | 1975-11-28 |
| IT1003883B (it) | 1976-06-10 |
| DE2316118A1 (de) | 1974-10-10 |
| FR2223839A1 (enExample) | 1974-10-25 |
| ATA222874A (de) | 1977-02-15 |
| AT339378B (de) | 1977-10-10 |
| CA991317A (en) | 1976-06-15 |
| DE2316118B2 (enExample) | 1975-04-03 |
| JPS49131082A (enExample) | 1974-12-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C3 | Grant after two publication steps (3rd publication) | ||
| E77 | Valid patent as to the heymanns-index 1977 | ||
| 8339 | Ceased/non-payment of the annual fee |