DE2311736A1 - Verfahren zur herstellung bedruckter leiterplatten - Google Patents

Verfahren zur herstellung bedruckter leiterplatten

Info

Publication number
DE2311736A1
DE2311736A1 DE19732311736 DE2311736A DE2311736A1 DE 2311736 A1 DE2311736 A1 DE 2311736A1 DE 19732311736 DE19732311736 DE 19732311736 DE 2311736 A DE2311736 A DE 2311736A DE 2311736 A1 DE2311736 A1 DE 2311736A1
Authority
DE
Germany
Prior art keywords
holes
conductive
circuit boards
printed circuit
carrier plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE19732311736
Other languages
German (de)
English (en)
Inventor
Auf Nichtnennung Antrag
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BERTHOLD ULRICH
Original Assignee
BERTHOLD ULRICH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BERTHOLD ULRICH filed Critical BERTHOLD ULRICH
Priority to DE19732311736 priority Critical patent/DE2311736A1/de
Priority to HUBE001192 priority patent/HU168595B/hu
Priority to FR7407121A priority patent/FR2220964B3/fr
Priority to DD17691774A priority patent/DD110142A1/xx
Priority to GB990474A priority patent/GB1441526A/en
Priority to JP2612574A priority patent/JPS5026067A/ja
Publication of DE2311736A1 publication Critical patent/DE2311736A1/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
    • H05K3/445—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits having insulated holes or insulated via connections through the metal core
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09827—Tapered, e.g. tapered hole, via or groove
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09981—Metallised walls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/082—Suction, e.g. for holding solder balls or components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
DE19732311736 1973-03-06 1973-03-06 Verfahren zur herstellung bedruckter leiterplatten Pending DE2311736A1 (de)

Priority Applications (6)

Application Number Priority Date Filing Date Title
DE19732311736 DE2311736A1 (de) 1973-03-06 1973-03-06 Verfahren zur herstellung bedruckter leiterplatten
HUBE001192 HU168595B (https=) 1973-03-06 1974-02-28
FR7407121A FR2220964B3 (https=) 1973-03-06 1974-03-01
DD17691774A DD110142A1 (https=) 1973-03-06 1974-03-04
GB990474A GB1441526A (en) 1973-03-06 1974-03-05 Printed circuit plates
JP2612574A JPS5026067A (https=) 1973-03-06 1974-03-06

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19732311736 DE2311736A1 (de) 1973-03-06 1973-03-06 Verfahren zur herstellung bedruckter leiterplatten

Publications (1)

Publication Number Publication Date
DE2311736A1 true DE2311736A1 (de) 1975-03-27

Family

ID=5874285

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19732311736 Pending DE2311736A1 (de) 1973-03-06 1973-03-06 Verfahren zur herstellung bedruckter leiterplatten

Country Status (6)

Country Link
JP (1) JPS5026067A (https=)
DD (1) DD110142A1 (https=)
DE (1) DE2311736A1 (https=)
FR (1) FR2220964B3 (https=)
GB (1) GB1441526A (https=)
HU (1) HU168595B (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5354775A (en) * 1976-10-28 1978-05-18 Seiko Instr & Electronics Through hole processing method of circuit plate
US4313262A (en) * 1979-12-17 1982-02-02 General Electric Company Molybdenum substrate thick film circuit
JPS57120398A (en) * 1981-01-19 1982-07-27 Sanyo Electric Co Method of connecting both-side printed foil of both-side printed circuit board
DE3429236A1 (de) * 1984-08-08 1986-02-13 Krone Gmbh, 1000 Berlin Folie mit beidseitig aufgedruckten elektrischen leiterbahnen
JP2636537B2 (ja) * 1991-04-08 1997-07-30 日本電気株式会社 プリント配線板の製造方法

Also Published As

Publication number Publication date
JPS5026067A (https=) 1975-03-18
HU168595B (https=) 1976-06-28
DD110142A1 (https=) 1974-12-05
FR2220964A1 (https=) 1974-10-04
GB1441526A (en) 1976-07-07
FR2220964B3 (https=) 1976-03-12

Similar Documents

Publication Publication Date Title
DE3545989C2 (https=)
DE1815202A1 (de) Verfahren zur Herstellung mehrschichtiger Schaltungskarten
DE1521436A1 (de) Verfahren zum Herstellen von metallisierten Wandungen von Durchbruechen in elektrisch isolierenden Materialien
DE2242132A1 (de) Material fuer gedruckte schaltungen und verfahren zu seiner herstellung
DE3434672A1 (de) Verfahren zur herstellung von durchkontaktierten flexiblen leiterplatten fuer hohe biegebeanspruchung
DE2539925A1 (de) Verfahren zur herstellung einer mehrschichtigen gedruckten schaltungsplatte
DE1271235B (de) Verfahren zur Herstellung von leitenden Verbindungen zwischen den leitenden Schichten einer elektrischen Schaltungsplatte
DE2029071A1 (de) Kehrschichtige Anordnung für eine gedruckte Schaltung
DE2144137A1 (de) Verfahren zum Herstellen der Löcher für die Verbindungen zwischen elektrischen, parallel übereinander liegenden Schaltungslagen einer Mehrlagen-Schaltungspackung
DE3408630A1 (de) Verfahren und schichtmaterial zur herstellung durchkontaktierter elektrischer leiterplatten
EP0166105B1 (de) Flexible Leiterplatte und Verfahren zu ihrer Herstellung
DE3231831C2 (de) Verfahren zur galvanoplastischen Herstellung eines Rotationsdrucksiebs
DE1765164A1 (de) Verfahren zur Bindung von Stromleitern
DE10145750A1 (de) Verfahren zur Herstellung einer Metallschicht auf einem Trägerkörper und Trägerkörper mit einer Metallschicht
DE1665374B1 (de) Basismaterial aus isolierstoff zum herstellen gedruckter leiterplatten
DE2311736A1 (de) Verfahren zur herstellung bedruckter leiterplatten
CH628195A5 (en) Printed-circuit board having at least two wiring layers
DE2361270A1 (de) Gedruckter flachspulensatz
DE3137279A1 (de) Mehrlagige leiterplatte und verfahren zu deren herstellung
DE69931551T2 (de) Verfahren zur Herstellung einer mit elektroplattiertem Sackloch versehenen mehrschichtigen Leiterplatte
DE2234408A1 (de) Verfahren zur herstellung einer elektrischen leiteranordnung
DE2809013C2 (de) Verfahren zum Herstellen einer mit Bauelementen bestückten gedruckten Schaltungsplatte
DE3006117A1 (de) Verfahren zum herstellen von leiterplatten mit mindestens zwei leiterzugebenen
DE2161829B2 (de) Verfahren zur Herstellung einer gedruckten Schaltungsplatte
DE1765341B1 (de) Verfahren zur herstellung einer mehrlagigen gedruckten schaltung