GB1441526A - Printed circuit plates - Google Patents

Printed circuit plates

Info

Publication number
GB1441526A
GB1441526A GB990474A GB990474A GB1441526A GB 1441526 A GB1441526 A GB 1441526A GB 990474 A GB990474 A GB 990474A GB 990474 A GB990474 A GB 990474A GB 1441526 A GB1441526 A GB 1441526A
Authority
GB
United Kingdom
Prior art keywords
holes
insulant
metal
plate
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB990474A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BERTHOLD U
Original Assignee
BERTHOLD U
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BERTHOLD U filed Critical BERTHOLD U
Publication of GB1441526A publication Critical patent/GB1441526A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
    • H05K3/445—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits having insulated holes or insulated via connections through the metal core
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09827—Tapered, e.g. tapered hole, via or groove
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09981—Metallised walls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/082—Suction, e.g. for holding solder balls or components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits

Abstract

1441526 Printed circuits U BERTHOLD 5 March 1974 [6 March 1973] 9904/74 Heading H1R Double sided printed circuit plates are fabricated by etching through holes 11 in a metal carrier plate 10 exceeding the final required diameter, coating both surfaces of the plate with insulant plastic 12 extending into the holes, selectively applying conducting layers 14, 15 to the insulant faces so as to pass into the holes from each side and abut, and to apply a printed circuit by chemical deposition of metal to overly the conductive layers. The carrier may comprise two metallic plates 20, 21 coated with insulant 23, 24, 25, 26 on both faces; with aligned holes 22 therein whose walls are coated with insulant at 27. A conductive layer 28 is selectively applied and reinforced by chemically deposited metal 29 to make up the circuit pattern. The holes may be chamfered, and the metallic layers may be drawn by suction into the holes. The printed circuitry and insulant may be applied to one surface only of the plate, and the circuitry may be deposited by printing or chemical deposition. The metal plate acts as a, screen against circuit interaction, and the finished device may be of three dimensional shape.
GB990474A 1973-03-06 1974-03-05 Printed circuit plates Expired GB1441526A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19732311736 DE2311736A1 (en) 1973-03-06 1973-03-06 METHOD OF MANUFACTURING PRINTED CIRCUIT BOARDS

Publications (1)

Publication Number Publication Date
GB1441526A true GB1441526A (en) 1976-07-07

Family

ID=5874285

Family Applications (1)

Application Number Title Priority Date Filing Date
GB990474A Expired GB1441526A (en) 1973-03-06 1974-03-05 Printed circuit plates

Country Status (6)

Country Link
JP (1) JPS5026067A (en)
DD (1) DD110142A1 (en)
DE (1) DE2311736A1 (en)
FR (1) FR2220964B3 (en)
GB (1) GB1441526A (en)
HU (1) HU168595B (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4313262A (en) * 1979-12-17 1982-02-02 General Electric Company Molybdenum substrate thick film circuit
GB2163007A (en) * 1984-08-08 1986-02-12 Krone Gmbh Sheet with printed conductors on both sides and method of forming interconnections between the conductors
US5218761A (en) * 1991-04-08 1993-06-15 Nec Corporation Process for manufacturing printed wiring boards

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5354775A (en) * 1976-10-28 1978-05-18 Seiko Instr & Electronics Through hole processing method of circuit plate
JPS57120398A (en) * 1981-01-19 1982-07-27 Sanyo Electric Co Method of connecting both-side printed foil of both-side printed circuit board

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4313262A (en) * 1979-12-17 1982-02-02 General Electric Company Molybdenum substrate thick film circuit
GB2163007A (en) * 1984-08-08 1986-02-12 Krone Gmbh Sheet with printed conductors on both sides and method of forming interconnections between the conductors
US5218761A (en) * 1991-04-08 1993-06-15 Nec Corporation Process for manufacturing printed wiring boards

Also Published As

Publication number Publication date
FR2220964B3 (en) 1976-03-12
JPS5026067A (en) 1975-03-18
HU168595B (en) 1976-06-28
DE2311736A1 (en) 1975-03-27
FR2220964A1 (en) 1974-10-04
DD110142A1 (en) 1974-12-05

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Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee