DE2234461A1 - Metallisierungsmasse und verfahren zum metallisieren einer vertiefung in halbleiterpackungen sowie das dabei erhaltene produkt - Google Patents

Metallisierungsmasse und verfahren zum metallisieren einer vertiefung in halbleiterpackungen sowie das dabei erhaltene produkt

Info

Publication number
DE2234461A1
DE2234461A1 DE2234461A DE2234461A DE2234461A1 DE 2234461 A1 DE2234461 A1 DE 2234461A1 DE 2234461 A DE2234461 A DE 2234461A DE 2234461 A DE2234461 A DE 2234461A DE 2234461 A1 DE2234461 A1 DE 2234461A1
Authority
DE
Germany
Prior art keywords
recess
gold
metallization
gold powder
compound
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE2234461A
Other languages
German (de)
English (en)
Inventor
Joseph Paul Budd
Wayne Keith Robson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Publication of DE2234461A1 publication Critical patent/DE2234461A1/de
Pending legal-status Critical Current

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    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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    • H01L23/00—Details of semiconductor or other solid state devices
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    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)
  • Chemically Coating (AREA)
DE2234461A 1971-11-15 1972-07-13 Metallisierungsmasse und verfahren zum metallisieren einer vertiefung in halbleiterpackungen sowie das dabei erhaltene produkt Pending DE2234461A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US19858471A 1971-11-15 1971-11-15

Publications (1)

Publication Number Publication Date
DE2234461A1 true DE2234461A1 (de) 1973-05-24

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DE2234461A Pending DE2234461A1 (de) 1971-11-15 1972-07-13 Metallisierungsmasse und verfahren zum metallisieren einer vertiefung in halbleiterpackungen sowie das dabei erhaltene produkt

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Country Link
US (1) US3793064A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP (1) JPS4859775A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
DE (1) DE2234461A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
FR (1) FR2160360B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
IT (1) IT960176B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3243689A1 (de) * 1981-11-30 1983-06-30 Mitsubishi Denki K.K., Tokyo Halbleitervorrichtung

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US3903344A (en) * 1974-02-26 1975-09-02 Rca Corp Adherent solderable cermet conductor
US3914858A (en) * 1974-08-23 1975-10-28 Nitto Electric Ind Co Method of making sealed cavity molded semiconductor devices
US4025716A (en) * 1975-01-30 1977-05-24 Burroughs Corporation Dual in-line package with window frame
JPS5211154A (en) * 1975-07-17 1977-01-27 Shoei Chemical Ind Co Electrode material for wire welding
US4142203A (en) * 1976-12-20 1979-02-27 Avx Corporation Method of assembling a hermetically sealed semiconductor unit
JPS5762539A (en) * 1980-10-01 1982-04-15 Hitachi Ltd Mounting method for semiconductor element
US4399707A (en) * 1981-02-04 1983-08-23 Honeywell, Inc. Stress sensitive semiconductor unit and housing means therefor
JPS584957A (ja) * 1982-06-22 1983-01-12 Nec Kyushu Ltd 半導体装置
EP0098173B1 (en) * 1982-06-30 1990-04-11 Fujitsu Limited Semiconductor integrated-circuit apparatus
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FR2160360A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1973-06-29
US3793064A (en) 1974-02-19
IT960176B (it) 1973-11-20
JPS4859775A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1973-08-22

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