IT960176B - Processo prodotto e composizione per la metallizzazione in cavita di unita complete a semicondut tore - Google Patents

Processo prodotto e composizione per la metallizzazione in cavita di unita complete a semicondut tore

Info

Publication number
IT960176B
IT960176B IT26486/72A IT2648672A IT960176B IT 960176 B IT960176 B IT 960176B IT 26486/72 A IT26486/72 A IT 26486/72A IT 2648672 A IT2648672 A IT 2648672A IT 960176 B IT960176 B IT 960176B
Authority
IT
Italy
Prior art keywords
product
composition process
semiconductor units
complete semiconductor
cavity
Prior art date
Application number
IT26486/72A
Other languages
English (en)
Italian (it)
Original Assignee
Du Pont
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Du Pont filed Critical Du Pont
Application granted granted Critical
Publication of IT960176B publication Critical patent/IT960176B/it

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)
  • Chemically Coating (AREA)
IT26486/72A 1971-11-15 1972-06-30 Processo prodotto e composizione per la metallizzazione in cavita di unita complete a semicondut tore IT960176B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US19858471A 1971-11-15 1971-11-15

Publications (1)

Publication Number Publication Date
IT960176B true IT960176B (it) 1973-11-20

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IT26486/72A IT960176B (it) 1971-11-15 1972-06-30 Processo prodotto e composizione per la metallizzazione in cavita di unita complete a semicondut tore

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US (1) US3793064A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP (1) JPS4859775A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
DE (1) DE2234461A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
FR (1) FR2160360B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
IT (1) IT960176B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1490978A (en) * 1973-12-21 1977-11-09 Marconi Co Ltd Light emitting diode(led)arrays
US3903344A (en) * 1974-02-26 1975-09-02 Rca Corp Adherent solderable cermet conductor
US3914858A (en) * 1974-08-23 1975-10-28 Nitto Electric Ind Co Method of making sealed cavity molded semiconductor devices
US4025716A (en) * 1975-01-30 1977-05-24 Burroughs Corporation Dual in-line package with window frame
JPS5211154A (en) * 1975-07-17 1977-01-27 Shoei Chemical Ind Co Electrode material for wire welding
US4142203A (en) * 1976-12-20 1979-02-27 Avx Corporation Method of assembling a hermetically sealed semiconductor unit
JPS5762539A (en) * 1980-10-01 1982-04-15 Hitachi Ltd Mounting method for semiconductor element
US4399707A (en) * 1981-02-04 1983-08-23 Honeywell, Inc. Stress sensitive semiconductor unit and housing means therefor
JPS5893358A (ja) * 1981-11-30 1983-06-03 Mitsubishi Electric Corp 半導体装置
JPS584957A (ja) * 1982-06-22 1983-01-12 Nec Kyushu Ltd 半導体装置
EP0098173B1 (en) * 1982-06-30 1990-04-11 Fujitsu Limited Semiconductor integrated-circuit apparatus
EP0266210B1 (en) * 1986-10-29 1993-02-17 Kabushiki Kaisha Toshiba Electronic apparatus comprising a ceramic substrate
US4860443A (en) * 1987-01-21 1989-08-29 Hughes Aircraft Company Method for connecting leadless chip package
US4993148A (en) * 1987-05-19 1991-02-19 Mitsubishi Denki Kabushiki Kaisha Method of manufacturing a circuit board
US5036584A (en) * 1989-06-13 1991-08-06 Texas Instruments Incorporated Method of manufacture of copper cored enclosures for hybrid circuits
US5089439A (en) * 1990-02-02 1992-02-18 Hughes Aircraft Company Process for attaching large area silicon-backed chips to gold-coated surfaces
US5360942A (en) * 1993-11-16 1994-11-01 Olin Corporation Multi-chip electronic package module utilizing an adhesive sheet
JP3120703B2 (ja) * 1995-08-07 2000-12-25 株式会社村田製作所 導電性ペースト及び積層セラミック電子部品
US6020646A (en) * 1997-12-05 2000-02-01 The Charles Stark Draper Laboratory, Inc. Intergrated circuit die assembly
JP3776907B2 (ja) * 2003-11-21 2006-05-24 ローム株式会社 回路基板
TWI446495B (zh) * 2011-01-19 2014-07-21 Subtron Technology Co Ltd 封裝載板及其製作方法
US9560781B2 (en) * 2013-07-19 2017-01-31 Materion Corporation Metal cap assembly for optical communications

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3347799A (en) * 1964-07-16 1967-10-17 Du Pont Gold-palladium conductor compositions and conductors made therefrom
BE679454A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1965-04-26 1966-09-16
DE1646882B1 (de) * 1965-07-29 1970-11-19 Du Pont Edelmetallmasse zum Aufbrennen auf keramische Traeger
US3385799A (en) * 1965-11-09 1968-05-28 Du Pont Metalizing compositions
US3520054A (en) * 1967-11-13 1970-07-14 Mitronics Inc Method of making multilevel metallized ceramic bodies for semiconductor packages
US3458930A (en) * 1967-12-07 1969-08-05 Zenith Radio Corp Leadless inverted device forming process
US3609105A (en) * 1970-06-08 1971-09-28 Alpha Metals Metalizing material

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FR2160360B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1974-10-04
DE2234461A1 (de) 1973-05-24
FR2160360A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1973-06-29
US3793064A (en) 1974-02-19
JPS4859775A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1973-08-22

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