FR2160360B1 - - Google Patents

Info

Publication number
FR2160360B1
FR2160360B1 FR7224943A FR7224943A FR2160360B1 FR 2160360 B1 FR2160360 B1 FR 2160360B1 FR 7224943 A FR7224943 A FR 7224943A FR 7224943 A FR7224943 A FR 7224943A FR 2160360 B1 FR2160360 B1 FR 2160360B1
Authority
FR
France
Prior art keywords
cavities
gold
semiconductor packages
packages
bottoms
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7224943A
Other languages
English (en)
Other versions
FR2160360A1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Publication of FR2160360A1 publication Critical patent/FR2160360A1/fr
Application granted granted Critical
Publication of FR2160360B1 publication Critical patent/FR2160360B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
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    • Y10T29/00—Metal working
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    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
FR7224943A 1971-11-15 1972-07-10 Expired FR2160360B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US19858471A 1971-11-15 1971-11-15

Publications (2)

Publication Number Publication Date
FR2160360A1 FR2160360A1 (fr) 1973-06-29
FR2160360B1 true FR2160360B1 (fr) 1974-10-04

Family

ID=22733982

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7224943A Expired FR2160360B1 (fr) 1971-11-15 1972-07-10

Country Status (5)

Country Link
US (1) US3793064A (fr)
JP (1) JPS4859775A (fr)
DE (1) DE2234461A1 (fr)
FR (1) FR2160360B1 (fr)
IT (1) IT960176B (fr)

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US4025716A (en) * 1975-01-30 1977-05-24 Burroughs Corporation Dual in-line package with window frame
JPS5211154A (en) * 1975-07-17 1977-01-27 Shoei Chemical Ind Co Electrode material for wire welding
US4142203A (en) * 1976-12-20 1979-02-27 Avx Corporation Method of assembling a hermetically sealed semiconductor unit
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US4399707A (en) * 1981-02-04 1983-08-23 Honeywell, Inc. Stress sensitive semiconductor unit and housing means therefor
JPS5893358A (ja) * 1981-11-30 1983-06-03 Mitsubishi Electric Corp 半導体装置
JPS584957A (ja) * 1982-06-22 1983-01-12 Nec Kyushu Ltd 半導体装置
DE3382727D1 (de) * 1982-06-30 1994-01-27 Fujitsu Ltd Integrierte Halbleiterschaltungsanordnung.
EP0266210B1 (fr) * 1986-10-29 1993-02-17 Kabushiki Kaisha Toshiba Appareil électronique comprenant un substrat céramique
US4860443A (en) * 1987-01-21 1989-08-29 Hughes Aircraft Company Method for connecting leadless chip package
US4993148A (en) * 1987-05-19 1991-02-19 Mitsubishi Denki Kabushiki Kaisha Method of manufacturing a circuit board
US5036584A (en) * 1989-06-13 1991-08-06 Texas Instruments Incorporated Method of manufacture of copper cored enclosures for hybrid circuits
US5089439A (en) * 1990-02-02 1992-02-18 Hughes Aircraft Company Process for attaching large area silicon-backed chips to gold-coated surfaces
US5360942A (en) * 1993-11-16 1994-11-01 Olin Corporation Multi-chip electronic package module utilizing an adhesive sheet
JP3120703B2 (ja) * 1995-08-07 2000-12-25 株式会社村田製作所 導電性ペースト及び積層セラミック電子部品
US6020646A (en) * 1997-12-05 2000-02-01 The Charles Stark Draper Laboratory, Inc. Intergrated circuit die assembly
JP3776907B2 (ja) * 2003-11-21 2006-05-24 ローム株式会社 回路基板
TWI446495B (zh) * 2011-01-19 2014-07-21 Subtron Technology Co Ltd 封裝載板及其製作方法
US9560781B2 (en) * 2013-07-19 2017-01-31 Materion Corporation Metal cap assembly for optical communications

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Publication number Priority date Publication date Assignee Title
US3347799A (en) * 1964-07-16 1967-10-17 Du Pont Gold-palladium conductor compositions and conductors made therefrom
BE679454A (fr) * 1965-04-26 1966-09-16
DE1646882B1 (de) * 1965-07-29 1970-11-19 Du Pont Edelmetallmasse zum Aufbrennen auf keramische Traeger
US3385799A (en) * 1965-11-09 1968-05-28 Du Pont Metalizing compositions
US3520054A (en) * 1967-11-13 1970-07-14 Mitronics Inc Method of making multilevel metallized ceramic bodies for semiconductor packages
US3458930A (en) * 1967-12-07 1969-08-05 Zenith Radio Corp Leadless inverted device forming process
US3609105A (en) * 1970-06-08 1971-09-28 Alpha Metals Metalizing material

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JPS4859775A (fr) 1973-08-22
IT960176B (it) 1973-11-20
FR2160360A1 (fr) 1973-06-29
US3793064A (en) 1974-02-19
DE2234461A1 (de) 1973-05-24

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