IT960176B - Processo prodotto e composizione per la metallizzazione in cavita di unita complete a semicondut tore - Google Patents

Processo prodotto e composizione per la metallizzazione in cavita di unita complete a semicondut tore

Info

Publication number
IT960176B
IT960176B IT26486/72A IT2648672A IT960176B IT 960176 B IT960176 B IT 960176B IT 26486/72 A IT26486/72 A IT 26486/72A IT 2648672 A IT2648672 A IT 2648672A IT 960176 B IT960176 B IT 960176B
Authority
IT
Italy
Prior art keywords
product
composition process
semiconductor units
complete semiconductor
cavity
Prior art date
Application number
IT26486/72A
Other languages
English (en)
Original Assignee
Du Pont
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Du Pont filed Critical Du Pont
Application granted granted Critical
Publication of IT960176B publication Critical patent/IT960176B/it

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/02Containers; Seals
    • H01L23/04Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/057Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
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    • H01L2224/02Bonding areas; Manufacturing methods related thereto
    • H01L2224/03Manufacturing methods
    • H01L2224/035Manufacturing methods by chemical or physical modification of a pre-existing or pre-deposited material
    • H01L2224/03505Sintering
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    • H01L2224/04026Bonding areas specifically adapted for layer connectors
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    • H01L2224/481Disposition
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    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
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    • H01L2924/1025Semiconducting materials
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    • H01L2924/15172Fan-out arrangement of the internal vias
    • H01L2924/15173Fan-out arrangement of the internal vias in a single layer of the multilayer substrate
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    • H01L2924/156Material
    • H01L2924/15786Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15787Ceramics, e.g. crystalline carbides, nitrides or oxides
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    • H01L2924/161Cap
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    • H01L2924/16152Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913Assembling to base an electrical component, e.g., capacitor, etc.
IT26486/72A 1971-11-15 1972-06-30 Processo prodotto e composizione per la metallizzazione in cavita di unita complete a semicondut tore IT960176B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US19858471A 1971-11-15 1971-11-15

Publications (1)

Publication Number Publication Date
IT960176B true IT960176B (it) 1973-11-20

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ID=22733982

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IT26486/72A IT960176B (it) 1971-11-15 1972-06-30 Processo prodotto e composizione per la metallizzazione in cavita di unita complete a semicondut tore

Country Status (5)

Country Link
US (1) US3793064A (it)
JP (1) JPS4859775A (it)
DE (1) DE2234461A1 (it)
FR (1) FR2160360B1 (it)
IT (1) IT960176B (it)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1490978A (en) * 1973-12-21 1977-11-09 Marconi Co Ltd Light emitting diode(led)arrays
US3903344A (en) * 1974-02-26 1975-09-02 Rca Corp Adherent solderable cermet conductor
US3914858A (en) * 1974-08-23 1975-10-28 Nitto Electric Ind Co Method of making sealed cavity molded semiconductor devices
US4025716A (en) * 1975-01-30 1977-05-24 Burroughs Corporation Dual in-line package with window frame
JPS5211154A (en) * 1975-07-17 1977-01-27 Shoei Chemical Ind Co Electrode material for wire welding
US4142203A (en) * 1976-12-20 1979-02-27 Avx Corporation Method of assembling a hermetically sealed semiconductor unit
JPS5762539A (en) * 1980-10-01 1982-04-15 Hitachi Ltd Mounting method for semiconductor element
US4399707A (en) * 1981-02-04 1983-08-23 Honeywell, Inc. Stress sensitive semiconductor unit and housing means therefor
JPS5893358A (ja) * 1981-11-30 1983-06-03 Mitsubishi Electric Corp 半導体装置
JPS584957A (ja) * 1982-06-22 1983-01-12 Nec Kyushu Ltd 半導体装置
DE3382727D1 (de) * 1982-06-30 1994-01-27 Fujitsu Ltd Integrierte Halbleiterschaltungsanordnung.
DE3784213T2 (de) * 1986-10-29 1993-06-03 Toshiba Kawasaki Kk Elektronischer apparat mit einem keramischen substrat.
US4860443A (en) * 1987-01-21 1989-08-29 Hughes Aircraft Company Method for connecting leadless chip package
US4993148A (en) * 1987-05-19 1991-02-19 Mitsubishi Denki Kabushiki Kaisha Method of manufacturing a circuit board
US5036584A (en) * 1989-06-13 1991-08-06 Texas Instruments Incorporated Method of manufacture of copper cored enclosures for hybrid circuits
US5089439A (en) * 1990-02-02 1992-02-18 Hughes Aircraft Company Process for attaching large area silicon-backed chips to gold-coated surfaces
US5360942A (en) * 1993-11-16 1994-11-01 Olin Corporation Multi-chip electronic package module utilizing an adhesive sheet
JP3120703B2 (ja) * 1995-08-07 2000-12-25 株式会社村田製作所 導電性ペースト及び積層セラミック電子部品
US6020646A (en) * 1997-12-05 2000-02-01 The Charles Stark Draper Laboratory, Inc. Intergrated circuit die assembly
JP3776907B2 (ja) * 2003-11-21 2006-05-24 ローム株式会社 回路基板
TWI446495B (zh) * 2011-01-19 2014-07-21 Subtron Technology Co Ltd 封裝載板及其製作方法
US9560781B2 (en) * 2013-07-19 2017-01-31 Materion Corporation Metal cap assembly for optical communications

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3347799A (en) * 1964-07-16 1967-10-17 Du Pont Gold-palladium conductor compositions and conductors made therefrom
BE679454A (it) * 1965-04-26 1966-09-16
DE1646882B1 (de) * 1965-07-29 1970-11-19 Du Pont Edelmetallmasse zum Aufbrennen auf keramische Traeger
US3385799A (en) * 1965-11-09 1968-05-28 Du Pont Metalizing compositions
US3520054A (en) * 1967-11-13 1970-07-14 Mitronics Inc Method of making multilevel metallized ceramic bodies for semiconductor packages
US3458930A (en) * 1967-12-07 1969-08-05 Zenith Radio Corp Leadless inverted device forming process
US3609105A (en) * 1970-06-08 1971-09-28 Alpha Metals Metalizing material

Also Published As

Publication number Publication date
JPS4859775A (it) 1973-08-22
DE2234461A1 (de) 1973-05-24
FR2160360A1 (it) 1973-06-29
FR2160360B1 (it) 1974-10-04
US3793064A (en) 1974-02-19

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