DE2234408A1 - Verfahren zur herstellung einer elektrischen leiteranordnung - Google Patents
Verfahren zur herstellung einer elektrischen leiteranordnungInfo
- Publication number
- DE2234408A1 DE2234408A1 DE19722234408 DE2234408A DE2234408A1 DE 2234408 A1 DE2234408 A1 DE 2234408A1 DE 19722234408 DE19722234408 DE 19722234408 DE 2234408 A DE2234408 A DE 2234408A DE 2234408 A1 DE2234408 A1 DE 2234408A1
- Authority
- DE
- Germany
- Prior art keywords
- layer
- circuit board
- pattern
- zones
- thin layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 title claims description 38
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 238000000034 method Methods 0.000 claims description 21
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 13
- 229910052802 copper Inorganic materials 0.000 claims description 13
- 239000010949 copper Substances 0.000 claims description 13
- 239000002320 enamel (paints) Substances 0.000 claims description 6
- 230000000873 masking effect Effects 0.000 claims description 6
- 230000005611 electricity Effects 0.000 claims description 5
- 229920002120 photoresistant polymer Polymers 0.000 claims description 5
- 239000004922 lacquer Substances 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- VNNRSPGTAMTISX-UHFFFAOYSA-N chromium nickel Chemical compound [Cr].[Ni] VNNRSPGTAMTISX-UHFFFAOYSA-N 0.000 claims description 3
- 210000003298 dental enamel Anatomy 0.000 claims description 3
- 238000005530 etching Methods 0.000 claims description 3
- 238000004544 sputter deposition Methods 0.000 claims description 2
- 238000005406 washing Methods 0.000 claims description 2
- 230000000295 complement effect Effects 0.000 claims 3
- 239000011248 coating agent Substances 0.000 claims 2
- 238000000576 coating method Methods 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 2
- 229910052751 metal Inorganic materials 0.000 claims 2
- 229910000831 Steel Inorganic materials 0.000 claims 1
- 229910052759 nickel Inorganic materials 0.000 claims 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 1
- 239000010959 steel Substances 0.000 claims 1
- 239000002966 varnish Substances 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 9
- 229910052737 gold Inorganic materials 0.000 description 9
- 239000010931 gold Substances 0.000 description 9
- 229910001209 Low-carbon steel Inorganic materials 0.000 description 3
- 229910000990 Ni alloy Inorganic materials 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 239000003518 caustics Substances 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/426—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates without metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
- H05K3/445—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits having insulated holes or insulated via connections through the metal core
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB3293271 | 1971-07-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE2234408A1 true DE2234408A1 (de) | 1973-01-25 |
Family
ID=10346136
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19722234408 Pending DE2234408A1 (de) | 1971-07-14 | 1972-07-13 | Verfahren zur herstellung einer elektrischen leiteranordnung |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPS4831462A (enrdf_load_stackoverflow) |
| DE (1) | DE2234408A1 (enrdf_load_stackoverflow) |
| FR (1) | FR2145720B1 (enrdf_load_stackoverflow) |
| IT (1) | IT961375B (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0476898A3 (en) * | 1990-09-18 | 1993-02-03 | Fujitsu Limited | Circuit board and process for producing the same |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5332376A (en) * | 1976-09-07 | 1978-03-27 | Tokyo Shibaura Electric Co | Electric device substrate |
| JPS5436576A (en) * | 1977-08-26 | 1979-03-17 | Shin Kobe Electric Machinery | Laminated board for printed wiring circuit with resistance body |
| FR2462026A1 (fr) * | 1979-07-23 | 1981-02-06 | Lignes Telegraph Telephon | Procede de fabrication d'un circuit hybride sur un substrat en acier et circuit en resultant |
| CN1290384C (zh) * | 2003-05-26 | 2006-12-13 | 王立华 | 具有高散热孔的金属化印制线路板及制造方法 |
-
1972
- 1972-07-12 IT IT5149172A patent/IT961375B/it active
- 1972-07-13 DE DE19722234408 patent/DE2234408A1/de active Pending
- 1972-07-13 FR FR7225613A patent/FR2145720B1/fr not_active Expired
- 1972-07-14 JP JP7069472A patent/JPS4831462A/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0476898A3 (en) * | 1990-09-18 | 1993-02-03 | Fujitsu Limited | Circuit board and process for producing the same |
| US5236772A (en) * | 1990-09-18 | 1993-08-17 | Fujitsu Limited | Circuit board and process for producing same |
| US5362359A (en) * | 1990-09-18 | 1994-11-08 | Fujitsu Limited | Circuit board and process for producing same |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS4831462A (enrdf_load_stackoverflow) | 1973-04-25 |
| IT961375B (it) | 1973-12-10 |
| FR2145720A1 (enrdf_load_stackoverflow) | 1973-02-23 |
| FR2145720B1 (enrdf_load_stackoverflow) | 1976-01-16 |
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