DE2221886C3 - Verfahren zum Montieren eines Halbleiterbauelementes - Google Patents

Verfahren zum Montieren eines Halbleiterbauelementes

Info

Publication number
DE2221886C3
DE2221886C3 DE2221886A DE2221886A DE2221886C3 DE 2221886 C3 DE2221886 C3 DE 2221886C3 DE 2221886 A DE2221886 A DE 2221886A DE 2221886 A DE2221886 A DE 2221886A DE 2221886 C3 DE2221886 C3 DE 2221886C3
Authority
DE
Germany
Prior art keywords
carrier sheet
lead
frame
connection
parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE2221886A
Other languages
German (de)
English (en)
Other versions
DE2221886B2 (de
DE2221886A1 (de
Inventor
Arthur Noel Somerville N.J. Gardiner (V.St.A.)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
RCA Corp
Original Assignee
RCA Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by RCA Corp filed Critical RCA Corp
Publication of DE2221886A1 publication Critical patent/DE2221886A1/de
Publication of DE2221886B2 publication Critical patent/DE2221886B2/de
Application granted granted Critical
Publication of DE2221886C3 publication Critical patent/DE2221886C3/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/424—Cross-sectional shapes
    • H10W70/427—Bent parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Wire Bonding (AREA)
DE2221886A 1971-05-13 1972-05-04 Verfahren zum Montieren eines Halbleiterbauelementes Expired DE2221886C3 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US14290171A 1971-05-13 1971-05-13

Publications (3)

Publication Number Publication Date
DE2221886A1 DE2221886A1 (de) 1972-11-23
DE2221886B2 DE2221886B2 (de) 1980-03-06
DE2221886C3 true DE2221886C3 (de) 1980-11-20

Family

ID=22501734

Family Applications (1)

Application Number Title Priority Date Filing Date
DE2221886A Expired DE2221886C3 (de) 1971-05-13 1972-05-04 Verfahren zum Montieren eines Halbleiterbauelementes

Country Status (14)

Country Link
US (1) US3685137A (enExample)
JP (1) JPS5121744B1 (enExample)
AU (1) AU463288B2 (enExample)
BE (1) BE783423A (enExample)
CA (1) CA951026A (enExample)
DE (1) DE2221886C3 (enExample)
ES (3) ES402464A1 (enExample)
FR (1) FR2137669B1 (enExample)
GB (1) GB1338188A (enExample)
HK (1) HK73676A (enExample)
IT (1) IT955452B (enExample)
MY (1) MY7700063A (enExample)
NL (1) NL7206425A (enExample)
SE (1) SE384426B (enExample)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3768986A (en) * 1971-10-08 1973-10-30 Micro Science Ass Laminated lead frame and method of producing same
US3995845A (en) * 1972-12-26 1976-12-07 Rca Corporation Ultrasonic wire bonding chuck
US4137546A (en) * 1977-10-14 1979-01-30 Plessey Incorporated Stamped lead frame for semiconductor packages
EP0063170A3 (en) * 1981-04-21 1983-08-31 Rockwell International Corporation Pneumatic wire lifter and method
US4534105A (en) * 1983-08-10 1985-08-13 Rca Corporation Method for grounding a pellet support pad in an integrated circuit device
KR100276781B1 (ko) * 1992-02-03 2001-01-15 비센트 비. 인그라시아 리드-온-칩 반도체장치 및 그 제조방법
US5954842A (en) * 1996-01-26 1999-09-21 Micron Technology, Inc. Lead finger clamp assembly
US5890644A (en) * 1996-01-26 1999-04-06 Micron Technology, Inc. Apparatus and method of clamping semiconductor devices using sliding finger supports
US5673845A (en) 1996-06-17 1997-10-07 Micron Technology, Inc. Lead penetrating clamping system
US5647528A (en) 1996-02-06 1997-07-15 Micron Technology, Inc. Bondhead lead clamp apparatus and method
US6068174A (en) 1996-12-13 2000-05-30 Micro)N Technology, Inc. Device and method for clamping and wire-bonding the leads of a lead frame one set at a time
US6121674A (en) 1998-02-23 2000-09-19 Micron Technology, Inc. Die paddle clamping method for wire bond enhancement
US6634538B2 (en) 1998-04-02 2003-10-21 Micron Technology, Inc. Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits
US6126062A (en) * 1998-04-02 2000-10-03 Micron Technology, Inc. Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits
US6977214B2 (en) * 1998-12-11 2005-12-20 Micron Technology, Inc. Die paddle clamping method for wire bond enhancement

Also Published As

Publication number Publication date
ES402464A1 (es) 1975-12-16
CA951026A (en) 1974-07-09
FR2137669A1 (enExample) 1972-12-29
DE2221886B2 (de) 1980-03-06
AU463288B2 (en) 1975-07-24
DE2221886A1 (de) 1972-11-23
FR2137669B1 (enExample) 1978-07-21
NL7206425A (enExample) 1972-11-15
MY7700063A (en) 1977-12-31
JPS5121744B1 (enExample) 1976-07-05
SE384426B (sv) 1976-05-03
HK73676A (en) 1976-12-03
US3685137A (en) 1972-08-22
GB1338188A (en) 1973-11-21
IT955452B (it) 1973-09-29
BE783423A (fr) 1972-09-01
ES406435A1 (es) 1975-07-16
ES406434A1 (es) 1975-07-01
AU4221672A (en) 1973-11-15

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Legal Events

Date Code Title Description
C3 Grant after two publication steps (3rd publication)