DE2162015A1 - Verfahren zur Herstellung einer blockförmigen Thermosäule - Google Patents
Verfahren zur Herstellung einer blockförmigen ThermosäuleInfo
- Publication number
- DE2162015A1 DE2162015A1 DE19712162015 DE2162015A DE2162015A1 DE 2162015 A1 DE2162015 A1 DE 2162015A1 DE 19712162015 DE19712162015 DE 19712162015 DE 2162015 A DE2162015 A DE 2162015A DE 2162015 A1 DE2162015 A1 DE 2162015A1
- Authority
- DE
- Germany
- Prior art keywords
- solder
- thermopile
- thermocouple
- polyimide
- legs
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims description 7
- 238000004519 manufacturing process Methods 0.000 title claims description 6
- 229910000679 solder Inorganic materials 0.000 claims description 22
- 229920001721 polyimide Polymers 0.000 claims description 17
- 239000004642 Polyimide Substances 0.000 claims description 13
- 239000000463 material Substances 0.000 claims description 12
- 239000011159 matrix material Substances 0.000 claims description 7
- 238000000576 coating method Methods 0.000 claims description 6
- 230000004907 flux Effects 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 4
- 230000008018 melting Effects 0.000 claims description 4
- 238000002844 melting Methods 0.000 claims description 4
- 238000009826 distribution Methods 0.000 claims description 3
- 239000011888 foil Substances 0.000 claims description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 2
- 230000008021 deposition Effects 0.000 claims description 2
- 239000001257 hydrogen Substances 0.000 claims description 2
- 229910052739 hydrogen Inorganic materials 0.000 claims description 2
- 238000005488 sandblasting Methods 0.000 claims description 2
- 238000003825 pressing Methods 0.000 claims 3
- 230000006835 compression Effects 0.000 claims 2
- 238000007906 compression Methods 0.000 claims 2
- 239000011261 inert gas Substances 0.000 claims 1
- 239000002904 solvent Substances 0.000 claims 1
- 210000002414 leg Anatomy 0.000 description 22
- 229910045601 alloy Inorganic materials 0.000 description 10
- 239000000956 alloy Substances 0.000 description 10
- 239000000919 ceramic Substances 0.000 description 8
- 239000004065 semiconductor Substances 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical group [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 5
- FRWYFWZENXDZMU-UHFFFAOYSA-N 2-iodoquinoline Chemical compound C1=CC=CC2=NC(I)=CC=C21 FRWYFWZENXDZMU-UHFFFAOYSA-N 0.000 description 4
- LTPBRCUWZOMYOC-UHFFFAOYSA-N beryllium oxide Inorganic materials O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 description 4
- 238000005498 polishing Methods 0.000 description 4
- 230000002285 radioactive effect Effects 0.000 description 4
- JIAARYAFYJHUJI-UHFFFAOYSA-L zinc dichloride Chemical compound [Cl-].[Cl-].[Zn+2] JIAARYAFYJHUJI-UHFFFAOYSA-L 0.000 description 4
- 238000005476 soldering Methods 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 229910002665 PbTe Inorganic materials 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000003776 cleavage reaction Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- 238000004663 powder metallurgy Methods 0.000 description 2
- 239000002244 precipitate Substances 0.000 description 2
- 230000007017 scission Effects 0.000 description 2
- OCGWQDWYSQAFTO-UHFFFAOYSA-N tellanylidenelead Chemical compound [Pb]=[Te] OCGWQDWYSQAFTO-UHFFFAOYSA-N 0.000 description 2
- 235000005074 zinc chloride Nutrition 0.000 description 2
- 239000011592 zinc chloride Substances 0.000 description 2
- 229910002909 Bi-Te Inorganic materials 0.000 description 1
- 230000005461 Bremsstrahlung Effects 0.000 description 1
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 229910000676 Si alloy Inorganic materials 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003245 coal Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 229910001651 emery Inorganic materials 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- 230000005251 gamma ray Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- ACVYVLVWPXVTIT-UHFFFAOYSA-M phosphinate Chemical compound [O-][PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-M 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- -1 polytetrafluoroethylene Polymers 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- BSWGGJHLVUUXTL-UHFFFAOYSA-N silver zinc Chemical compound [Zn].[Ag] BSWGGJHLVUUXTL-UHFFFAOYSA-N 0.000 description 1
- XSOKHXFFCGXDJZ-UHFFFAOYSA-N telluride(2-) Chemical compound [Te-2] XSOKHXFFCGXDJZ-UHFFFAOYSA-N 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
- 210000000689 upper leg Anatomy 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Laminated Bodies (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CA100796 | 1970-12-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE2162015A1 true DE2162015A1 (de) | 1972-07-06 |
Family
ID=4088259
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19712162015 Pending DE2162015A1 (de) | 1970-12-16 | 1971-12-14 | Verfahren zur Herstellung einer blockförmigen Thermosäule |
Country Status (4)
| Country | Link |
|---|---|
| DE (1) | DE2162015A1 (enExample) |
| FR (1) | FR2118658A5 (enExample) |
| GB (2) | GB1375382A (enExample) |
| NL (1) | NL7116639A (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5434744A (en) * | 1993-10-22 | 1995-07-18 | Fritz; Robert E. | Thermoelectric module having reduced spacing between semiconductor elements |
| JP2002518989A (ja) | 1996-12-02 | 2002-06-25 | ラリガン，パスカル | わずかな温度差から低消費電力の自立型装置に電気を供給することを可能にする熱出力変換器 |
| FR2767418B1 (fr) * | 1997-08-13 | 1999-10-22 | Jannick Simeray | Module thermocouple |
| NL1014370C1 (nl) * | 1999-02-12 | 2000-08-15 | Merel En B V | Halfgeleider-energiegenerator. |
| CN115919276A (zh) * | 2022-06-23 | 2023-04-07 | 长三角(嘉兴)纳米应用技术研究院 | 一种基于摩擦纳米发电的心率监测设备及其方法 |
-
1971
- 1971-11-30 GB GB2429473A patent/GB1375382A/en not_active Expired
- 1971-11-30 GB GB5552271A patent/GB1375381A/en not_active Expired
- 1971-12-03 NL NL7116639A patent/NL7116639A/xx unknown
- 1971-12-14 DE DE19712162015 patent/DE2162015A1/de active Pending
- 1971-12-15 FR FR7145112A patent/FR2118658A5/fr not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| FR2118658A5 (enExample) | 1972-07-28 |
| NL7116639A (enExample) | 1972-06-20 |
| GB1375382A (enExample) | 1974-11-27 |
| GB1375381A (enExample) | 1974-11-27 |
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