DE2160462C2 - Halbleiteranordnung und Verfahren zu ihrer Herstellung - Google Patents

Halbleiteranordnung und Verfahren zu ihrer Herstellung

Info

Publication number
DE2160462C2
DE2160462C2 DE2160462A DE2160462A DE2160462C2 DE 2160462 C2 DE2160462 C2 DE 2160462C2 DE 2160462 A DE2160462 A DE 2160462A DE 2160462 A DE2160462 A DE 2160462A DE 2160462 C2 DE2160462 C2 DE 2160462C2
Authority
DE
Germany
Prior art keywords
mentioned
concentration
semiconductor
transistor
ions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE2160462A
Other languages
German (de)
English (en)
Other versions
DE2160462A1 (de
Inventor
Ronald Alfred Crawley Sussex Ford
Keith Harlow Reigate Surrey Nicholas
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Publication of DE2160462A1 publication Critical patent/DE2160462A1/de
Application granted granted Critical
Publication of DE2160462C2 publication Critical patent/DE2160462C2/de
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26Bombardment with radiation
    • H01L21/263Bombardment with radiation with high-energy radiation
    • H01L21/265Bombardment with radiation with high-energy radiation producing ion implantation
    • H01L21/26506Bombardment with radiation with high-energy radiation producing ion implantation in group IV semiconductors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/80Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs
    • H10D84/811Combinations of field-effect devices and one or more diodes, capacitors or resistors
    • H10D84/817Combinations of field-effect devices and resistors only
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/80Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs
    • H10D84/82Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components
    • H10D84/83Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components of only insulated-gate FETs [IGFET]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D99/00Subject matter not provided for in other groups of this subclass
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00Semiconductor device manufacturing: process
    • Y10S438/904Charge carrier lifetime control

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Power Engineering (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
  • Element Separation (AREA)
DE2160462A 1971-07-27 1971-12-06 Halbleiteranordnung und Verfahren zu ihrer Herstellung Expired DE2160462C2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB3512271 1971-07-27

Publications (2)

Publication Number Publication Date
DE2160462A1 DE2160462A1 (de) 1973-02-08
DE2160462C2 true DE2160462C2 (de) 1982-05-13

Family

ID=10374091

Family Applications (1)

Application Number Title Priority Date Filing Date
DE2160462A Expired DE2160462C2 (de) 1971-07-27 1971-12-06 Halbleiteranordnung und Verfahren zu ihrer Herstellung

Country Status (11)

Country Link
US (1) US3969744A (enExample)
JP (1) JPS5121750B1 (enExample)
BE (1) BE776319A (enExample)
CA (1) CA933671A (enExample)
CH (1) CH544410A (enExample)
DE (1) DE2160462C2 (enExample)
FR (1) FR2147016B1 (enExample)
GB (1) GB1345818A (enExample)
IT (1) IT943189B (enExample)
NL (1) NL161922C (enExample)
SE (1) SE377862B (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4053925A (en) * 1975-08-07 1977-10-11 Ibm Corporation Method and structure for controllng carrier lifetime in semiconductor devices
DE2537559C3 (de) * 1975-08-22 1978-05-03 Siemens Ag, 1000 Berlin Und 8000 Muenchen Verfahren zur Herstellung einer monolithisch integrierten Halbleiterschaltung mit einem Junction-Feldeffekttransistor und einem komplementären MIS-Feldeffekttransistor
US4080718A (en) * 1976-12-14 1978-03-28 Smc Standard Microsystems Corporation Method of modifying electrical characteristics of MOS devices using ion implantation
US4257826A (en) * 1979-10-11 1981-03-24 Texas Instruments Incorporated Photoresist masking in manufacture of semiconductor device
JPS5812493A (ja) * 1981-07-14 1983-01-24 Matsushita Electric Ind Co Ltd カラ−テレビジヨンカメラ
US4391651A (en) * 1981-10-15 1983-07-05 The United States Of America As Represented By The Secretary Of The Navy Method of forming a hyperabrupt interface in a GaAs substrate
JPS5869124A (ja) * 1981-10-20 1983-04-25 Toshiba Corp 半導体集積回路
JPH0612823B2 (ja) * 1982-05-10 1994-02-16 ゼネラル・エレクトリック・カンパニイ 二方向性の電力用高速mosfet素子
US4656493A (en) * 1982-05-10 1987-04-07 General Electric Company Bidirectional, high-speed power MOSFET devices with deep level recombination centers in base region
DE3605516A1 (de) * 1985-02-21 1986-09-04 Canon K.K., Tokio/Tokyo Optisches funktionselement sowie optische funktionsvorrichtung
US5250445A (en) * 1988-12-20 1993-10-05 Texas Instruments Incorporated Discretionary gettering of semiconductor circuits
JPH0526226A (ja) * 1991-07-23 1993-02-02 Nissan Motor Co Ltd 軸方向移動型ピロボールブツシユ
JPH05275692A (ja) * 1992-03-25 1993-10-22 Sony Corp 半導体装置およびその製造方法
JP3541958B2 (ja) * 1993-12-16 2004-07-14 株式会社東芝 不揮発性半導体記憶装置
US6455903B1 (en) * 2000-01-26 2002-09-24 Advanced Micro Devices, Inc. Dual threshold voltage MOSFET by local confinement of channel depletion layer using inert ion implantation
DE10261307B4 (de) * 2002-12-27 2010-11-11 Advanced Micro Devices, Inc., Sunnyvale Verfahren zur Herstellung einer Spannungsoberflächenschicht in einem Halbleiterelement
US20080180160A1 (en) * 2007-01-31 2008-07-31 Infineon Technologies Ag High voltage dual gate cmos switching device and method

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3341754A (en) * 1966-01-20 1967-09-12 Ion Physics Corp Semiconductor resistor containing interstitial and substitutional ions formed by an ion implantation method
US3540925A (en) * 1967-08-02 1970-11-17 Rca Corp Ion bombardment of insulated gate semiconductor devices
US3515956A (en) * 1967-10-16 1970-06-02 Ion Physics Corp High-voltage semiconductor device having a guard ring containing substitutionally active ions in interstitial positions
GB1261723A (en) * 1968-03-11 1972-01-26 Associated Semiconductor Mft Improvements in and relating to semiconductor devices
JPS5211199B1 (enExample) * 1970-05-27 1977-03-29
JPS4831036A (enExample) * 1971-08-26 1973-04-24

Also Published As

Publication number Publication date
NL7116693A (enExample) 1973-01-30
AU3637771A (en) 1973-06-07
BE776319A (fr) 1972-06-06
DE2160462A1 (de) 1973-02-08
JPS5121750B1 (enExample) 1976-07-05
IT943189B (it) 1973-04-02
CH544410A (de) 1973-11-15
US3969744A (en) 1976-07-13
FR2147016B1 (enExample) 1976-06-04
NL161922B (nl) 1979-10-15
NL161922C (nl) 1980-03-17
GB1345818A (en) 1974-02-06
FR2147016A1 (enExample) 1973-03-09
CA933671A (en) 1973-09-11
SE377862B (enExample) 1975-07-28

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Legal Events

Date Code Title Description
D2 Grant after examination
8339 Ceased/non-payment of the annual fee