DE2152318A1 - Verfahren und Vorrichtung zum Polieren von Duennschichtelementen - Google Patents

Verfahren und Vorrichtung zum Polieren von Duennschichtelementen

Info

Publication number
DE2152318A1
DE2152318A1 DE19712152318 DE2152318A DE2152318A1 DE 2152318 A1 DE2152318 A1 DE 2152318A1 DE 19712152318 DE19712152318 DE 19712152318 DE 2152318 A DE2152318 A DE 2152318A DE 2152318 A1 DE2152318 A1 DE 2152318A1
Authority
DE
Germany
Prior art keywords
polishing
disk
plate
friction
holding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19712152318
Other languages
German (de)
English (en)
Inventor
Walsh Robert Jerome
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Monsanto Co
Original Assignee
Monsanto Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Monsanto Co filed Critical Monsanto Co
Publication of DE2152318A1 publication Critical patent/DE2152318A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/02008—Multistep processes
    • H01L21/0201—Specific process step
    • H01L21/02024—Mirror polishing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
    • B24B37/107—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement in a rotary movement only, about an axis being stationary during lapping

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
DE19712152318 1970-10-21 1971-10-20 Verfahren und Vorrichtung zum Polieren von Duennschichtelementen Withdrawn DE2152318A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US8267370A 1970-10-21 1970-10-21

Publications (1)

Publication Number Publication Date
DE2152318A1 true DE2152318A1 (de) 1972-04-27

Family

ID=22172673

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19712152318 Withdrawn DE2152318A1 (de) 1970-10-21 1971-10-20 Verfahren und Vorrichtung zum Polieren von Duennschichtelementen

Country Status (5)

Country Link
JP (1) JPS545160B1 (ja)
BE (1) BE774209A (ja)
DE (1) DE2152318A1 (ja)
GB (1) GB1319882A (ja)
NL (1) NL7114274A (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0008360A1 (de) * 1978-08-15 1980-03-05 International Business Machines Corporation Vorrichtung zum freien Polieren von Werkstücken und Polierverfahren
EP0284343A2 (en) * 1987-03-23 1988-09-28 Westech Systems, Inc. Polishing apparatus

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57149373U (ja) * 1981-03-16 1982-09-20
JPS5871593U (ja) * 1981-11-04 1983-05-14 三菱重工業株式会社 水冷型熱交換器
US5104828A (en) * 1990-03-01 1992-04-14 Intel Corporation Method of planarizing a dielectric formed over a semiconductor substrate
GB2298961B (en) * 1992-05-26 1997-01-08 Toshiba Kk Polishing apparatus for planarizing layer on a semiconductor wafer
JP2914166B2 (ja) * 1994-03-16 1999-06-28 日本電気株式会社 研磨布の表面処理方法および研磨装置
GB9512262D0 (en) 1995-06-16 1995-08-16 Bingham Richard G Tool for computer-controlled machine for optical polishing and figuring

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0008360A1 (de) * 1978-08-15 1980-03-05 International Business Machines Corporation Vorrichtung zum freien Polieren von Werkstücken und Polierverfahren
EP0284343A2 (en) * 1987-03-23 1988-09-28 Westech Systems, Inc. Polishing apparatus
EP0284343A3 (en) * 1987-03-23 1989-01-18 Westech Systems, Inc. Counterbalanced polishing apparatus counterbalanced polishing apparatus

Also Published As

Publication number Publication date
GB1319882A (en) 1973-06-13
BE774209A (fr) 1972-04-20
NL7114274A (ja) 1972-04-25
JPS545160B1 (ja) 1979-03-14

Similar Documents

Publication Publication Date Title
DE69625962T2 (de) Verfahren und Vorrichtung zum Abrichten von Polierkissen
DE69308482T2 (de) Vorrichtung zum Polieren von Halbleiterscheiben
DE60133306T2 (de) Verfahren zum Abrichten eines Poliertuches
DE19723060C2 (de) Verfahren und Vorrichtung zum chemisch-mechanischen Polieren
DE68911456T2 (de) Vorrichtung zum mechanischen Planpolieren.
DE69217843T2 (de) Methode und Vorrichtung zum Ätzen des Randes einer Halbleiterscheibe
DE602005001110T2 (de) Verfahren zur Instandhaltung harter Oberflächen
DE19622004A1 (de) In-situ Steuerung der Planheit einer Polierscheibe
DE2702261A1 (de) Verfahren und vorrichtung zum schleifen der kanten eines zerbrechlichen werkstuecks
DE19649216A1 (de) Verfahren und Vorrichtung zur Oberflächenbearbeitung
DE2152318A1 (de) Verfahren und Vorrichtung zum Polieren von Duennschichtelementen
DE1652027A1 (de) Verfahren zur Fertigbearbeitung von Speicherplatten und Geraet zur Ausfuehrung des Verfahrens
DE102019212581A1 (de) Polierscheibe
DE68903661T2 (de) Polierverfahren und -vorrichtung fuer einen optischen gegenstand.
DE3885160T2 (de) Verfahren zur Bearbeitung der kanten Halbleiterplättchen sowie dazugehörige Apparatur.
DE2441976A1 (de) Verfahren und vorrichtung zum herstellen von schmidt-korrekturlinsen
DE60110922T2 (de) Abrichtvorrichtung für polierkissen und verfahren zu dessen anwendung
EP0008360B1 (de) Vorrichtung zum freien Polieren von Werkstücken und Polierverfahren
DE112020001146T5 (de) Doppelseitiges Polierverfahren
EP0209764B1 (de) Verfahren und Vorrichtung zur Herstellung von für die mikroskopische Untersuchung im Durchlicht geeigneten Dünnschliffen aus Proben mit harten Bestandteilen
DE2933172A1 (de) Fluessigphasenepitaxie-beschichtung von substratscheiben
DE102020202001A1 (de) Schleifvorrichtung
DE3407253A1 (de) Verfahren zum auftragen eines magnetischen (beschichtungs-)mediums auf eine platte oder scheibe
DE636797C (de) Verfahren und Vorrichtung zum Facettieren der Kanten von Plaettchen aus Glas o. dgl.eines Verkleidungsstueckes
DE2620477A1 (de) Vertikalschleif- oder -poliermaschine

Legal Events

Date Code Title Description
OD Request for examination
8139 Disposal/non-payment of the annual fee