DE2151200B2 - Verfahren zur Herstellung eines aus Vertiefungen bestehenden Musters in der Oberfläche eines, insbesondere mit einer Oberflächenschicht versehenen festen Körpers - Google Patents

Verfahren zur Herstellung eines aus Vertiefungen bestehenden Musters in der Oberfläche eines, insbesondere mit einer Oberflächenschicht versehenen festen Körpers

Info

Publication number
DE2151200B2
DE2151200B2 DE2151200A DE2151200A DE2151200B2 DE 2151200 B2 DE2151200 B2 DE 2151200B2 DE 2151200 A DE2151200 A DE 2151200A DE 2151200 A DE2151200 A DE 2151200A DE 2151200 B2 DE2151200 B2 DE 2151200B2
Authority
DE
Germany
Prior art keywords
ions
component
solid body
ion beam
depressions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE2151200A
Other languages
German (de)
English (en)
Other versions
DE2151200A1 (de
Inventor
Paul Herman Chatham Schmidt
Edward Guerrant Murray Hill Spencer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
Western Electric Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Western Electric Co Inc filed Critical Western Electric Co Inc
Publication of DE2151200A1 publication Critical patent/DE2151200A1/de
Publication of DE2151200B2 publication Critical patent/DE2151200B2/de
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/73—Etching of wafers, substrates or parts of devices using masks for insulating materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F4/00—Processes for removing metallic material from surfaces, not provided for in group C23F1/00 or C23F3/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F10/00—Thin magnetic films, e.g. of one-domain structure
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
    • H10P50/24—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials
    • H10P50/242—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials of Group IV materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
    • H10P50/28—Dry etching; Plasma etching; Reactive-ion etching of insulating materials
    • H10P50/282—Dry etching; Plasma etching; Reactive-ion etching of insulating materials of inorganic materials
    • H10P50/283—Dry etching; Plasma etching; Reactive-ion etching of insulating materials of inorganic materials by chemical means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Power Engineering (AREA)
  • Drying Of Semiconductors (AREA)
  • ing And Chemical Polishing (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Magnetic Heads (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
DE2151200A 1970-10-19 1971-10-14 Verfahren zur Herstellung eines aus Vertiefungen bestehenden Musters in der Oberfläche eines, insbesondere mit einer Oberflächenschicht versehenen festen Körpers Ceased DE2151200B2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US081756A US3860783A (en) 1970-10-19 1970-10-19 Ion etching through a pattern mask

Publications (2)

Publication Number Publication Date
DE2151200A1 DE2151200A1 (de) 1972-04-20
DE2151200B2 true DE2151200B2 (de) 1979-10-04

Family

ID=22166191

Family Applications (1)

Application Number Title Priority Date Filing Date
DE2151200A Ceased DE2151200B2 (de) 1970-10-19 1971-10-14 Verfahren zur Herstellung eines aus Vertiefungen bestehenden Musters in der Oberfläche eines, insbesondere mit einer Oberflächenschicht versehenen festen Körpers

Country Status (11)

Country Link
US (1) US3860783A (enExample)
JP (1) JPS5540665B1 (enExample)
KR (1) KR780000438B1 (enExample)
BE (1) BE773998A (enExample)
CA (1) CA926523A (enExample)
DE (1) DE2151200B2 (enExample)
FR (1) FR2111511A5 (enExample)
GB (1) GB1364735A (enExample)
IT (1) IT942719B (enExample)
NL (1) NL170646C (enExample)
SE (1) SE383280B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4202194A1 (de) * 1992-01-28 1993-07-29 Convac Gmbh Verfahren und vorrichtung zum partiellen entfernen von duennen schichten von einem substrat

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3988564A (en) * 1972-07-17 1976-10-26 Hughes Aircraft Company Ion beam micromachining method
US4049944A (en) * 1973-02-28 1977-09-20 Hughes Aircraft Company Process for fabricating small geometry semiconductive devices including integrated components
DE2521543A1 (de) * 1974-05-16 1975-11-27 Crosfield Electronics Ltd Verfahren und vorrichtung zur wiedergabe von bildern
JPS5230851B2 (enExample) * 1974-10-11 1977-08-11
JPS5738897B2 (enExample) * 1974-11-19 1982-08-18
US3920483A (en) * 1974-11-25 1975-11-18 Ibm Method of ion implantation through a photoresist mask
US4207105A (en) * 1975-01-27 1980-06-10 Fuji Photo Film Co., Ltd. Plasma-etching image in exposed AgX emulsion
JPS51105821A (en) * 1975-03-14 1976-09-20 Fuji Photo Film Co Ltd Masukugazono keiseihoho
US4117301A (en) * 1975-07-21 1978-09-26 Rca Corporation Method of making a submicrometer aperture in a substrate
US4016062A (en) * 1975-09-11 1977-04-05 International Business Machines Corporation Method of forming a serrated surface topography
JPS5275341A (en) * 1975-12-19 1977-06-24 Rikagaku Kenkyusho Method of producing echelette grating
FR2354617A1 (fr) * 1976-06-08 1978-01-06 Electro Resistance Procede pour la fabrication de resistances electriques a partir de feuilles ou de films metalliques et resistances obtenues
US4045318A (en) * 1976-07-30 1977-08-30 Rca Corporation Method of transferring a surface relief pattern from a poly(olefin sulfone) layer to a metal layer
GB1585460A (en) * 1976-11-23 1981-03-04 Lucas Industries Ltd Method of manufacturing a lamp
DE2708792C3 (de) * 1977-03-01 1980-07-10 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Verwendung des Ionenätzverf ahrens zum Strukturieren von Halbleiterschichten und Ionenätzverfahren für diese Verwendung
US4275286A (en) * 1978-12-04 1981-06-23 Hughes Aircraft Company Process and mask for ion beam etching of fine patterns
US4214966A (en) * 1979-03-20 1980-07-29 Bell Telephone Laboratories, Incorporated Process useful in the fabrication of articles with metallized surfaces
US4248688A (en) * 1979-09-04 1981-02-03 International Business Machines Corporation Ion milling of thin metal films
US4564997A (en) * 1981-04-21 1986-01-21 Nippon-Telegraph And Telephone Public Corporation Semiconductor device and manufacturing process thereof
US4426274A (en) 1981-06-02 1984-01-17 International Business Machines Corporation Reactive ion etching apparatus with interlaced perforated anode
US4359373A (en) * 1981-06-15 1982-11-16 Rca Corporation Method of formation of a blazed grating
IT1171401B (it) * 1981-07-20 1987-06-10 Selenia Ind Eletroniche Associ Aggiustamento a valore trimming diresistori a film sottile mediante erosione ionica
US4460434A (en) * 1982-04-15 1984-07-17 At&T Bell Laboratories Method for planarizing patterned surfaces
GB8319716D0 (en) * 1983-07-21 1983-08-24 Secr Defence Reactive ion etching
GB2148769A (en) * 1983-10-22 1985-06-05 Standard Telephones Cables Ltd Topographic feature formation by ion beam milling of a substrate
DE3509519A1 (de) * 1985-03-16 1986-09-18 Richard Heinze Kunststoff-Spritzgießwerke GmbH & Co, 4900 Herford Tastenkoerper sowie verfahren und vorrichtung zu seiner herstellung
US4906594A (en) * 1987-06-12 1990-03-06 Agency Of Industrial Science And Technology Surface smoothing method and method of forming SOI substrate using the surface smoothing method
CA2097388A1 (en) * 1992-07-16 1994-01-17 Susan Nord Bohlke Topographical selective patterns
JP3394602B2 (ja) * 1993-07-05 2003-04-07 株式会社荏原製作所 高速原子線を用いた加工方法
US7150811B2 (en) * 2002-11-26 2006-12-19 Pei Company Ion beam for target recovery
KR100845004B1 (ko) * 2007-04-30 2008-07-09 삼성전자주식회사 나노 갭을 갖는 금속막 패턴의 형성 방법 및 이를 이용한분자크기의 소자 제조 방법
US20100021720A1 (en) * 2008-07-24 2010-01-28 Shembel Elena M Transparent coductive oxide and method of production thereof

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3330696A (en) * 1967-07-11 Method of fabricating thin film capacitors
NL257531A (enExample) * 1960-03-30
US3118050A (en) * 1960-04-06 1964-01-14 Alloyd Electronics Corp Electron beam devices and processes
US3056881A (en) * 1961-06-07 1962-10-02 United Aircraft Corp Method of making electrical conductor device
BE630858A (enExample) * 1962-04-10 1900-01-01
US3398237A (en) * 1965-02-26 1968-08-20 Minnesota Mining & Mfg System for synchronizing a scanning electron beam with a rotating body
US3453723A (en) * 1966-01-03 1969-07-08 Texas Instruments Inc Electron beam techniques in integrated circuits
US3445926A (en) * 1967-02-28 1969-05-27 Electro Optical Systems Inc Production of semiconductor devices by use of ion beam implantation

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4202194A1 (de) * 1992-01-28 1993-07-29 Convac Gmbh Verfahren und vorrichtung zum partiellen entfernen von duennen schichten von einem substrat

Also Published As

Publication number Publication date
NL170646C (nl) 1982-12-01
FR2111511A5 (enExample) 1972-06-02
US3860783A (en) 1975-01-14
DE2151200A1 (de) 1972-04-20
NL7114349A (enExample) 1972-04-21
KR780000438B1 (en) 1978-10-14
SE383280B (sv) 1976-03-08
BE773998A (fr) 1972-01-31
CA926523A (en) 1973-05-15
GB1364735A (en) 1974-08-29
JPS5540665B1 (enExample) 1980-10-20
IT942719B (it) 1973-04-02

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