DE2117369A1 - Umkapselter integrierter Schaltkreis - Google Patents
Umkapselter integrierter SchaltkreisInfo
- Publication number
- DE2117369A1 DE2117369A1 DE19712117369 DE2117369A DE2117369A1 DE 2117369 A1 DE2117369 A1 DE 2117369A1 DE 19712117369 DE19712117369 DE 19712117369 DE 2117369 A DE2117369 A DE 2117369A DE 2117369 A1 DE2117369 A1 DE 2117369A1
- Authority
- DE
- Germany
- Prior art keywords
- base plate
- conductors
- integrated circuit
- socket
- flat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 46
- 239000000463 material Substances 0.000 claims description 22
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 239000007769 metal material Substances 0.000 claims description 2
- 150000002739 metals Chemical class 0.000 claims 1
- 238000000034 method Methods 0.000 description 11
- 238000005538 encapsulation Methods 0.000 description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 230000002787 reinforcement Effects 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
- H01L23/4334—Auxiliary members in encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US2900170A | 1970-04-16 | 1970-04-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE2117369A1 true DE2117369A1 (de) | 1971-11-11 |
Family
ID=21846691
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19712117369 Pending DE2117369A1 (de) | 1970-04-16 | 1971-04-08 | Umkapselter integrierter Schaltkreis |
| DE19717113716 Expired DE7113716U (de) | 1970-04-16 | 1971-04-08 | Umkapselter integrierter schaltkreis |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19717113716 Expired DE7113716U (de) | 1970-04-16 | 1971-04-08 | Umkapselter integrierter schaltkreis |
Country Status (2)
| Country | Link |
|---|---|
| DE (2) | DE2117369A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
| NL (1) | NL7104239A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0108502A3 (en) * | 1982-10-08 | 1985-08-07 | Fujitsu Limited | A plastics moulded semiconductor device and a method of producing it |
-
1971
- 1971-03-30 NL NL7104239A patent/NL7104239A/xx unknown
- 1971-04-08 DE DE19712117369 patent/DE2117369A1/de active Pending
- 1971-04-08 DE DE19717113716 patent/DE7113716U/de not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0108502A3 (en) * | 1982-10-08 | 1985-08-07 | Fujitsu Limited | A plastics moulded semiconductor device and a method of producing it |
Also Published As
| Publication number | Publication date |
|---|---|
| NL7104239A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1971-10-19 |
| DE7113716U (de) | 1971-07-22 |
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