DE2104625C3 - Verwendung einer Lotlegierung - Google Patents

Verwendung einer Lotlegierung

Info

Publication number
DE2104625C3
DE2104625C3 DE2104625A DE2104625A DE2104625C3 DE 2104625 C3 DE2104625 C3 DE 2104625C3 DE 2104625 A DE2104625 A DE 2104625A DE 2104625 A DE2104625 A DE 2104625A DE 2104625 C3 DE2104625 C3 DE 2104625C3
Authority
DE
Germany
Prior art keywords
solder
aluminum
weak
soldering
alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE2104625A
Other languages
German (de)
English (en)
Other versions
DE2104625B2 (de
DE2104625A1 (de
Inventor
Kentaro Nagano
Kohji Nokami
Yoshihito Saoyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AGC Inc
Original Assignee
Asahi Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Glass Co Ltd filed Critical Asahi Glass Co Ltd
Publication of DE2104625A1 publication Critical patent/DE2104625A1/de
Publication of DE2104625B2 publication Critical patent/DE2104625B2/de
Application granted granted Critical
Publication of DE2104625C3 publication Critical patent/DE2104625C3/de
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/268—Pb as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Ceramic Products (AREA)
DE2104625A 1970-08-15 1971-02-01 Verwendung einer Lotlegierung Expired DE2104625C3 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7148770 1970-08-15

Publications (3)

Publication Number Publication Date
DE2104625A1 DE2104625A1 (de) 1972-02-17
DE2104625B2 DE2104625B2 (de) 1973-03-15
DE2104625C3 true DE2104625C3 (de) 1973-10-11

Family

ID=13462045

Family Applications (1)

Application Number Title Priority Date Filing Date
DE2104625A Expired DE2104625C3 (de) 1970-08-15 1971-02-01 Verwendung einer Lotlegierung

Country Status (5)

Country Link
US (1) US3744121A (enExample)
DE (1) DE2104625C3 (enExample)
FR (1) FR2101330A5 (enExample)
GB (1) GB1283848A (enExample)
NL (1) NL7018767A (enExample)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4106930A (en) * 1972-02-19 1978-08-15 Asahi Glass Company, Ltd. Solder alloys for soldering difficultly solderable material
US3949118A (en) * 1972-07-21 1976-04-06 Asahi Glass Company, Ltd. Process for soldering difficultly solderable material having oxide surface and a solder alloy therefor
FR2195502A1 (en) * 1972-08-07 1974-03-08 Asahi Glass Co Ltd Lead-tin solder - with high adhesion to oxide (coatings) and ceramics
US3831263A (en) * 1972-08-11 1974-08-27 Aluminum Co Of America Method of soldering
GB1385256A (en) * 1972-09-22 1975-02-26 Ici Ltd Coating and bonding of metals
US4032059A (en) * 1974-04-18 1977-06-28 Societe Anonyme Des Usines Chausson Method using a soldering alloy for connecting parts of which at least some are made of aluminium
FR2267853B1 (enExample) * 1974-04-18 1977-07-08 Chausson Usines Sa
JPS51138561A (en) * 1975-05-27 1976-11-30 Asahi Glass Co Ltd Soldering method of oxidized metal surface
US4386051A (en) * 1980-09-19 1983-05-31 Edgington Robert E Tin, lead, zinc alloy
US4352450A (en) * 1980-09-19 1982-10-05 Edgington Robert E Method for soldering aluminum
US4444351A (en) * 1981-11-16 1984-04-24 Electric Power Research Institute, Inc. Method of soldering metal oxide varistors
IT1210953B (it) * 1982-11-19 1989-09-29 Ates Componenti Elettron Metodo per la saldatura di piastrine di semiconduttore su supporti di metallo non nobile.
EP0264648B1 (en) * 1986-09-25 1993-05-05 Kabushiki Kaisha Toshiba Method of producing a film carrier
US5038996A (en) * 1988-10-12 1991-08-13 International Business Machines Corporation Bonding of metallic surfaces
JP2891432B2 (ja) * 1989-12-27 1999-05-17 田中電子工業株式会社 半導体材料の接続方法，それに用いる接続材料及び半導体装置
DE4126533A1 (de) * 1991-08-10 1993-02-11 Ver Glaswerke Gmbh Verfahren zum kontaktieren von elektrisch heizbaren glasscheiben mit transparenten heizwiderstandsschichten
WO2000062969A2 (en) * 1999-04-16 2000-10-26 Edison Welding Institute Soldering alloy
US6279811B1 (en) * 2000-05-12 2001-08-28 Mcgraw-Edison Company Solder application technique
TWM512217U (zh) 2013-06-20 2015-11-11 Plant PV 太陽能電池
WO2017035103A1 (en) 2015-08-25 2017-03-02 Plant Pv, Inc Core-shell, oxidation-resistant particles for low temperature conductive applications
US10418497B2 (en) 2015-08-26 2019-09-17 Hitachi Chemical Co., Ltd. Silver-bismuth non-contact metallization pastes for silicon solar cells
US9741878B2 (en) 2015-11-24 2017-08-22 PLANT PV, Inc. Solar cells and modules with fired multilayer stacks
PE20191810A1 (es) * 2017-04-10 2019-12-26 Metallo Belgium Proceso mejorado para la produccion de soldadura cruda
CA3019710A1 (en) * 2017-10-03 2019-04-03 Schlumberger Canada Limited Lead alloy barrier tape splice for downhole power cable
CN108188613B (zh) * 2017-11-28 2020-06-09 深圳市福摩索金属制品有限公司 一种活性钎料及其制备方法和应用

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB236747A (en) * 1924-08-07 1925-07-16 Aron Lepp Penner Aluminium solder
US2397400A (en) * 1938-05-27 1946-03-26 Barwich Heinz Apparatus for and method of producing metallic coatings
US2298237A (en) * 1941-03-07 1942-10-06 American Smelting Refining Lead base coating alloy
US2426650A (en) * 1943-12-27 1947-09-02 Bell Telephone Labor Inc Method of soldering a terminal to a piezoelectric crystal
US2522082A (en) * 1945-02-03 1950-09-12 Orlan M Arnold Method of bonding
US2737712A (en) * 1952-07-23 1956-03-13 Fred E Larson Solder and process for making and using same
US2824543A (en) * 1955-01-14 1958-02-25 Bendix Aviat Corp Ultrasonic tinning apparatus
US3266136A (en) * 1963-03-29 1966-08-16 Western Electric Co Mass soldering apparatus and method using vibratory energy

Also Published As

Publication number Publication date
DE2104625B2 (de) 1973-03-15
FR2101330A5 (enExample) 1972-03-31
US3744121A (en) 1973-07-10
DE2104625A1 (de) 1972-02-17
GB1283848A (en) 1972-08-02
NL7018767A (enExample) 1972-02-17

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Legal Events

Date Code Title Description
C3 Grant after two publication steps (3rd publication)
E77 Valid patent as to the heymanns-index 1977
8339 Ceased/non-payment of the annual fee