DE2101049A1 - Verfahren zur vorzugsweise beidseitigen Beschichtung von Kunststoffolien mit .Metall - Google Patents
Verfahren zur vorzugsweise beidseitigen Beschichtung von Kunststoffolien mit .MetallInfo
- Publication number
- DE2101049A1 DE2101049A1 DE19712101049 DE2101049A DE2101049A1 DE 2101049 A1 DE2101049 A1 DE 2101049A1 DE 19712101049 DE19712101049 DE 19712101049 DE 2101049 A DE2101049 A DE 2101049A DE 2101049 A1 DE2101049 A1 DE 2101049A1
- Authority
- DE
- Germany
- Prior art keywords
- film
- layer
- silver
- vpa
- acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims description 28
- 239000011248 coating agent Substances 0.000 title claims description 9
- 238000000576 coating method Methods 0.000 title claims description 9
- 239000011888 foil Substances 0.000 title description 12
- 239000004033 plastic Substances 0.000 title description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 17
- 229910052709 silver Inorganic materials 0.000 claims description 17
- 239000004332 silver Substances 0.000 claims description 17
- 229910052751 metal Inorganic materials 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 11
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 10
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 8
- 229920001721 polyimide Polymers 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 7
- 239000002253 acid Substances 0.000 claims description 7
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 239000010949 copper Substances 0.000 claims description 7
- 239000004020 conductor Substances 0.000 claims description 6
- 239000000203 mixture Substances 0.000 claims description 6
- 230000002787 reinforcement Effects 0.000 claims description 5
- 229910052763 palladium Inorganic materials 0.000 claims description 4
- 238000007788 roughening Methods 0.000 claims description 4
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 3
- 230000008021 deposition Effects 0.000 claims description 3
- 150000002148 esters Chemical class 0.000 claims description 3
- 230000035784 germination Effects 0.000 claims description 3
- 238000010899 nucleation Methods 0.000 claims description 3
- 238000007747 plating Methods 0.000 claims description 3
- 230000001427 coherent effect Effects 0.000 claims description 2
- 239000000126 substance Substances 0.000 claims description 2
- 239000003513 alkali Substances 0.000 claims 1
- 230000003321 amplification Effects 0.000 claims 1
- 238000003199 nucleic acid amplification method Methods 0.000 claims 1
- QAOWNCQODCNURD-UHFFFAOYSA-N sulfuric acid Substances OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims 1
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 238000005496 tempering Methods 0.000 description 5
- 239000004642 Polyimide Substances 0.000 description 2
- 238000009736 wetting Methods 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 1
- 239000005041 Mylar™ Substances 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910021626 Tin(II) chloride Inorganic materials 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 238000004873 anchoring Methods 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005234 chemical deposition Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 229910000041 hydrogen chloride Inorganic materials 0.000 description 1
- IXCSERBJSXMMFS-UHFFFAOYSA-N hydrogen chloride Substances Cl.Cl IXCSERBJSXMMFS-UHFFFAOYSA-N 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 description 1
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000001235 sensitizing effect Effects 0.000 description 1
- 229940100890 silver compound Drugs 0.000 description 1
- 150000003379 silver compounds Chemical group 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 235000011150 stannous chloride Nutrition 0.000 description 1
- FZUJWWOKDIGOKH-UHFFFAOYSA-N sulfuric acid hydrochloride Chemical compound Cl.OS(O)(=O)=O FZUJWWOKDIGOKH-UHFFFAOYSA-N 0.000 description 1
- AXZWODMDQAVCJE-UHFFFAOYSA-L tin(II) chloride (anhydrous) Chemical compound [Cl-].[Cl-].[Sn+2] AXZWODMDQAVCJE-UHFFFAOYSA-L 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2013—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by mechanical pretreatment, e.g. grinding, sanding
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2026—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by radiant energy
- C23C18/2033—Heat
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
- C23C18/208—Multistep pretreatment with use of metal first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
- C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/22—Roughening, e.g. by etching
- C23C18/24—Roughening, e.g. by etching using acid aqueous solutions
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
- C25D5/56—Electroplating of non-metallic surfaces of plastics
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S205/00—Electrolysis: processes, compositions used therein, and methods of preparing the compositions
- Y10S205/917—Treatment of workpiece between coating steps
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Electrochemistry (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Chemically Coating (AREA)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19712101049 DE2101049A1 (de) | 1971-01-11 | 1971-01-11 | Verfahren zur vorzugsweise beidseitigen Beschichtung von Kunststoffolien mit .Metall |
| DE19712104058 DE2104058B2 (de) | 1971-01-11 | 1971-01-28 | Verfahren zur vorzugsweise beidseitigen beschichtung von polyterphthalsaeureester- oder polyimidfolien mit einer aetzfaehigen metallschicht |
| US3767538D US3767538A (en) | 1971-01-11 | 1972-01-06 | Method of coating plastic films with metal |
| JP548572A JPS521418B1 (enExample) | 1971-01-11 | 1972-01-11 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19712101049 DE2101049A1 (de) | 1971-01-11 | 1971-01-11 | Verfahren zur vorzugsweise beidseitigen Beschichtung von Kunststoffolien mit .Metall |
| DE19712104058 DE2104058B2 (de) | 1971-01-11 | 1971-01-28 | Verfahren zur vorzugsweise beidseitigen beschichtung von polyterphthalsaeureester- oder polyimidfolien mit einer aetzfaehigen metallschicht |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE2101049A1 true DE2101049A1 (de) | 1972-08-03 |
Family
ID=25760499
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19712101049 Pending DE2101049A1 (de) | 1971-01-11 | 1971-01-11 | Verfahren zur vorzugsweise beidseitigen Beschichtung von Kunststoffolien mit .Metall |
| DE19712104058 Ceased DE2104058B2 (de) | 1971-01-11 | 1971-01-28 | Verfahren zur vorzugsweise beidseitigen beschichtung von polyterphthalsaeureester- oder polyimidfolien mit einer aetzfaehigen metallschicht |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19712104058 Ceased DE2104058B2 (de) | 1971-01-11 | 1971-01-28 | Verfahren zur vorzugsweise beidseitigen beschichtung von polyterphthalsaeureester- oder polyimidfolien mit einer aetzfaehigen metallschicht |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US3767538A (enExample) |
| JP (1) | JPS521418B1 (enExample) |
| DE (2) | DE2101049A1 (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3328339A1 (de) * | 1983-08-05 | 1985-02-14 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Verfahren zur metallisierung einer kunststoffoberflaeche |
| EP0350206A3 (en) * | 1988-06-30 | 1990-02-07 | Hoechst Celanese Corporation | Process for preparing conductive plastic articles |
| EP0600787A1 (fr) * | 1992-12-04 | 1994-06-08 | Thomson-Csf | Procédé pour la métallisation de surface de pièces en matériau composite à matrice organique, et pièces à usage électronique ainsi obtenues |
Families Citing this family (37)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BE792310A (fr) * | 1971-12-08 | 1973-06-05 | Kalle Ag | Procede pour le depot de couches de cuivre sur des pieces moulees en polyimides |
| NL176479C (nl) * | 1971-12-08 | 1985-04-16 | Hoechst Ag | Werkwijze voor het bekleden van kunststofvoorwerpen met koper. |
| US3937857A (en) * | 1974-07-22 | 1976-02-10 | Amp Incorporated | Catalyst for electroless deposition of metals |
| US3954570A (en) * | 1974-11-11 | 1976-05-04 | Amp Incorporated | Sensitized polyimides and circuit elements thereof |
| CA1120420A (en) * | 1976-10-26 | 1982-03-23 | Daniel Luch | Process for providing a polymer-electroplate bond of improved strength and stability |
| US4241105A (en) * | 1979-12-17 | 1980-12-23 | Western Electric Company, Inc. | Method of plating the surface of a substrate |
| JPS6036471B2 (ja) * | 1980-04-30 | 1985-08-20 | ポリプラスチツクス株式会社 | ポリアセタ−ル樹脂の表面処理法 |
| JPS59108043A (ja) * | 1982-12-14 | 1984-06-22 | Nippon Sanmou Senshoku Kk | 導電性高分子材料及びその製法 |
| FR2544340A1 (fr) * | 1983-04-15 | 1984-10-19 | Rhone Poulenc Rech | Procede de metallisation de films souples electriquement isolants en matiere plastique thermostable et articles obtenus |
| FR2544341A1 (fr) * | 1983-04-15 | 1984-10-19 | Rhone Poulenc Rech | Procede de metallisation de films souples electriquement isolants et articles obtenus |
| US5047114A (en) * | 1984-11-02 | 1991-09-10 | Amp-Akzo Corporation | Process for the production of metal clad thermoplastic base materials and printed circuits on thermoplastic base materials |
| US4552626A (en) * | 1984-11-19 | 1985-11-12 | Michael Landney, Jr. | Metal plating of polyamide thermoplastics |
| EP0199132B1 (de) * | 1985-04-13 | 1990-11-07 | Licentia Patent-Verwaltungs-GmbH | Verfahren zur nasschemischen Herstellung einer Metallschicht |
| DE3518766A1 (de) * | 1985-05-24 | 1986-11-27 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Verfahren zur metallisierung eines substrates |
| US4725504A (en) * | 1987-02-24 | 1988-02-16 | Polyonics Corporation | Metal coated laminate products made from textured polyimide film |
| US4894124A (en) * | 1988-02-16 | 1990-01-16 | Polyonics Corporation | Thermally stable dual metal coated laminate products made from textured polyimide film |
| US4832799A (en) * | 1987-02-24 | 1989-05-23 | Polyonics Corporation | Process for coating at least one surface of a polyimide sheet with copper |
| US4992144A (en) * | 1987-02-24 | 1991-02-12 | Polyonics Corporation | Thermally stable dual metal coated laminate products made from polyimide film |
| US4806395A (en) * | 1987-02-24 | 1989-02-21 | Polyonics Corporation | Textured polyimide film |
| IL89670A (en) * | 1988-03-22 | 1992-06-21 | Raychem Corp | Articles having permanent indicia thereon and their production |
| US5264248A (en) * | 1992-08-03 | 1993-11-23 | General Electric Company | Adhesion of metal coatings of polypyromellitimides |
| US5716410A (en) * | 1993-04-30 | 1998-02-10 | Scimed Life Systems, Inc. | Temporary stent and method of use |
| US5558759A (en) * | 1994-07-26 | 1996-09-24 | Sargent Manufacturing Company | Metal finishing process |
| JPH0948864A (ja) * | 1995-08-03 | 1997-02-18 | Kanegafuchi Chem Ind Co Ltd | ポリイミドフィルムの接着性改善方法及び接着性を改善したポリイミドフィルム |
| US6258239B1 (en) * | 1998-12-14 | 2001-07-10 | Ballard Power Systems Inc. | Process for the manufacture of an electrode for a solid polymer fuel cell |
| DE10007435A1 (de) * | 2000-02-18 | 2001-08-23 | Enthone Omi Deutschland Gmbh | Verfahren zum Galvanisieren eines mit einem elektrisch leitenden Polymer beschichteten Werkstücks |
| JP4532713B2 (ja) * | 2000-10-11 | 2010-08-25 | 東洋鋼鈑株式会社 | 多層金属積層フィルム及びその製造方法 |
| EP1433521A4 (en) * | 2001-09-26 | 2006-04-12 | Toyo Kohan Co Ltd | GAS SEPARATION UNIT AND METHOD FOR MANUFACTURING THE SAME |
| DE10259187B4 (de) * | 2002-12-18 | 2008-06-19 | Enthone Inc., West Haven | Metallisierung von Kunststoffsubstraten und Lösung zum Beizen und Aktivieren |
| US20040264139A1 (en) * | 2003-06-24 | 2004-12-30 | Nokia Corporation | Process for manufacturing a cover |
| US20050124976A1 (en) * | 2003-12-04 | 2005-06-09 | Devens Douglas A.Jr. | Medical devices |
| EP1584646B1 (en) * | 2004-04-09 | 2007-06-06 | Mitsubishi Gas Chemical Company, Inc. | Process for producing hard-coated optical materials |
| US10076032B2 (en) | 2014-03-20 | 2018-09-11 | Sumitomo Electric Industries, Ltd. | Substrate for printed circuit board, printed circuit board, and method for producing substrate for printed circuit board |
| US10237976B2 (en) | 2014-03-27 | 2019-03-19 | Sumitomo Electric Industries, Ltd. | Substrate for printed circuit board, printed circuit board, and method for producing substrate for printed circuit board |
| JP5770917B1 (ja) * | 2014-04-04 | 2015-08-26 | キヤノン・コンポーネンツ株式会社 | めっき皮膜付物品の製造方法 |
| WO2016117575A1 (ja) | 2015-01-22 | 2016-07-28 | 住友電気工業株式会社 | プリント配線板用基材、プリント配線板及びプリント配線板の製造方法 |
| JP7228468B2 (ja) * | 2019-05-28 | 2023-02-24 | 上村工業株式会社 | プリント配線基板の製造方法 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1905097A1 (de) * | 1969-02-01 | 1970-08-06 | Dynamit Nobel Ag | Verfahren zur Metallisierung von Kunststoffen |
-
1971
- 1971-01-11 DE DE19712101049 patent/DE2101049A1/de active Pending
- 1971-01-28 DE DE19712104058 patent/DE2104058B2/de not_active Ceased
-
1972
- 1972-01-06 US US3767538D patent/US3767538A/en not_active Expired - Lifetime
- 1972-01-11 JP JP548572A patent/JPS521418B1/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3328339A1 (de) * | 1983-08-05 | 1985-02-14 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Verfahren zur metallisierung einer kunststoffoberflaeche |
| EP0350206A3 (en) * | 1988-06-30 | 1990-02-07 | Hoechst Celanese Corporation | Process for preparing conductive plastic articles |
| EP0600787A1 (fr) * | 1992-12-04 | 1994-06-08 | Thomson-Csf | Procédé pour la métallisation de surface de pièces en matériau composite à matrice organique, et pièces à usage électronique ainsi obtenues |
| FR2698886A1 (fr) * | 1992-12-04 | 1994-06-10 | Thomson Csf | Procédé pour la métallisation de surface de pièces en matériau composite à matrice organique et pièces à usage électronique ainsi obtenues. |
Also Published As
| Publication number | Publication date |
|---|---|
| DE2104058A1 (de) | 1972-08-17 |
| JPS521418B1 (enExample) | 1977-01-14 |
| DE2104058B2 (de) | 1976-08-05 |
| US3767538A (en) | 1973-10-23 |
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