DE2063721A1 - Entfernung von organischen Poly merfilmen von der Oberflache von Schicht tragern - Google Patents

Entfernung von organischen Poly merfilmen von der Oberflache von Schicht tragern

Info

Publication number
DE2063721A1
DE2063721A1 DE19702063721 DE2063721A DE2063721A1 DE 2063721 A1 DE2063721 A1 DE 2063721A1 DE 19702063721 DE19702063721 DE 19702063721 DE 2063721 A DE2063721 A DE 2063721A DE 2063721 A1 DE2063721 A1 DE 2063721A1
Authority
DE
Germany
Prior art keywords
organic polymer
polymer film
film
organic
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE19702063721
Other languages
German (de)
English (en)
Inventor
Archibald Nelson Schenec tady Merrill Richard Cardey Glens Falls N Y Wright (VStA)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Publication of DE2063721A1 publication Critical patent/DE2063721A1/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/311—Etching the insulating layers by chemical or physical means
    • H01L21/31127—Etching organic layers
    • H01L21/31133—Etching organic layers by chemical means
    • H01L21/31138—Etching organic layers by chemical means by dry-etching
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N97/00—Electric solid-state thin-film or thick-film devices, not otherwise provided for

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
DE19702063721 1969-12-29 1970-12-24 Entfernung von organischen Poly merfilmen von der Oberflache von Schicht tragern Pending DE2063721A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US88838069A 1969-12-29 1969-12-29

Publications (1)

Publication Number Publication Date
DE2063721A1 true DE2063721A1 (de) 1971-10-07

Family

ID=25393082

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19702063721 Pending DE2063721A1 (de) 1969-12-29 1970-12-24 Entfernung von organischen Poly merfilmen von der Oberflache von Schicht tragern

Country Status (3)

Country Link
US (1) US3664899A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
DE (1) DE2063721A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
FR (1) FR2077574A6 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2641624A1 (de) * 1975-09-22 1977-03-24 Ibm Verfahren zur herstellung eines positiven resistbildes
DE3624384A1 (de) * 1985-07-19 1987-01-29 Fusion Systems Corp Vorrichtung zum entfernen einer photoresistschicht von einem substrat
DE3835636A1 (de) * 1987-10-23 1989-05-03 Galram Technology Ind Ltd Verfahren und system zum vollstaendigen entfernen von fotoresist

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3753336A (en) * 1972-04-06 1973-08-21 Envirotech Corp Centrifugal separation apparatus
US3950569A (en) * 1972-05-05 1976-04-13 W. R. Grace & Co. Method for preparing coatings with solid curable compositions containing styrene-allyl alcohol copolymer based polythiols
IT992983B (it) * 1972-08-18 1975-09-30 Gen Electric Metodo per asportare materiale fotoresistente da un supporto
US3890176A (en) * 1972-08-18 1975-06-17 Gen Electric Method for removing photoresist from substrate
US3930913A (en) * 1974-07-18 1976-01-06 Lfe Corporation Process for manufacturing integrated circuits and metallic mesh screens
US4474864A (en) * 1983-07-08 1984-10-02 International Business Machines Corporation Method for dose calculation of photolithography projection printers through bleaching of photo-active compound in a photoresist
US4699689A (en) * 1985-05-17 1987-10-13 Emergent Technologies Corporation Method and apparatus for dry processing of substrates
US4617085A (en) * 1985-09-03 1986-10-14 General Electric Company Process for removing organic material in a patterned manner from an organic film
US4857382A (en) * 1988-04-26 1989-08-15 General Electric Company Apparatus and method for photoetching of polyimides, polycarbonates and polyetherimides
US5246526A (en) * 1989-06-29 1993-09-21 Hitachi, Ltd. Surface treatment apparatus
EP0714119B1 (en) * 1990-05-09 2002-12-04 Canon Kabushiki Kaisha Pattern forming process and process for preparing semiconductor device utilizing said pattern forming process
US5830533A (en) * 1991-05-28 1998-11-03 Microelectronics And Computer Technology Corporation Selective patterning of metallization on a dielectric substrate
US6664194B1 (en) * 1999-03-18 2003-12-16 Taiwan Semiconductor Manufacturing Company Photoexposure method for facilitating photoresist stripping
US6524936B2 (en) * 2000-12-22 2003-02-25 Axcelis Technologies, Inc. Process for removal of photoresist after post ion implantation
SG115381A1 (en) * 2001-06-20 2005-10-28 Univ Singapore Removal of organic layers from organic electronic devices
AU2003228205A1 (en) * 2002-01-18 2003-09-02 The Regents Of The University Of Michigan Porous polymers: compositions and uses thereof
US20050279453A1 (en) * 2004-06-17 2005-12-22 Uvtech Systems, Inc. System and methods for surface cleaning
US20060196525A1 (en) * 2005-03-03 2006-09-07 Vrtis Raymond N Method for removing a residue from a chamber
JP2008536699A (ja) * 2005-04-14 2008-09-11 プレジデント・アンド・フエローズ・オブ・ハーバード・カレツジ マイクロ加工のための犠牲層における調節可能な溶解度
US20080296258A1 (en) * 2007-02-08 2008-12-04 Elliott David J Plenum reactor system
WO2015070168A1 (en) * 2013-11-11 2015-05-14 Tokyo Electron Limited Method and hardware for enhanced removal of post etch polymer and hardmask removal
US9847211B2 (en) 2014-01-16 2017-12-19 The University Of Akron Conductive film and method of making same
JP2016111115A (ja) * 2014-12-04 2016-06-20 東京エレクトロン株式会社 基板処理方法、プログラム、コンピュータ記憶媒体及び基板処理システム

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2892712A (en) * 1954-04-23 1959-06-30 Du Pont Process for preparing relief images
US3042566A (en) * 1958-09-22 1962-07-03 Boeing Co Chemical milling
US3097097A (en) * 1959-02-12 1963-07-09 Gisela K Oster Photo degrading of gel systems and photographic production of reliefs therewith
US3346384A (en) * 1963-04-25 1967-10-10 Gen Electric Metal image formation
US3518111A (en) * 1966-12-01 1970-06-30 Gen Electric Photopolymerized film,coating and product,and method of forming

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2641624A1 (de) * 1975-09-22 1977-03-24 Ibm Verfahren zur herstellung eines positiven resistbildes
DE3624384A1 (de) * 1985-07-19 1987-01-29 Fusion Systems Corp Vorrichtung zum entfernen einer photoresistschicht von einem substrat
DE3835636A1 (de) * 1987-10-23 1989-05-03 Galram Technology Ind Ltd Verfahren und system zum vollstaendigen entfernen von fotoresist

Also Published As

Publication number Publication date
FR2077574A6 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1971-10-29
US3664899A (en) 1972-05-23

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