DE2048068A1 - Verfahren zur Herstellung von Anschlüssen an Halbleiter und danach hergestellte Halbleiter anordnungen - Google Patents

Verfahren zur Herstellung von Anschlüssen an Halbleiter und danach hergestellte Halbleiter anordnungen

Info

Publication number
DE2048068A1
DE2048068A1 DE19702048068 DE2048068A DE2048068A1 DE 2048068 A1 DE2048068 A1 DE 2048068A1 DE 19702048068 DE19702048068 DE 19702048068 DE 2048068 A DE2048068 A DE 2048068A DE 2048068 A1 DE2048068 A1 DE 2048068A1
Authority
DE
Germany
Prior art keywords
semiconductor
stack
connection
conductivity
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE19702048068
Other languages
German (de)
English (en)
Inventor
Warren Eimer Carmllus NY Berner (VStA)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Publication of DE2048068A1 publication Critical patent/DE2048068A1/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/121—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/157—Containers comprising an insulating or insulated base having interconnections parallel to the insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

Landscapes

  • Die Bonding (AREA)
  • Wire Bonding (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Thyristors (AREA)
DE19702048068 1969-10-02 1970-09-30 Verfahren zur Herstellung von Anschlüssen an Halbleiter und danach hergestellte Halbleiter anordnungen Pending DE2048068A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US86321069A 1969-10-02 1969-10-02

Publications (1)

Publication Number Publication Date
DE2048068A1 true DE2048068A1 (de) 1971-04-22

Family

ID=25340560

Family Applications (2)

Application Number Title Priority Date Filing Date
DE19702048068 Pending DE2048068A1 (de) 1969-10-02 1970-09-30 Verfahren zur Herstellung von Anschlüssen an Halbleiter und danach hergestellte Halbleiter anordnungen
DE7036188U Expired DE7036188U (de) 1969-10-02 1970-09-30 Halbleiteranordnungen.

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE7036188U Expired DE7036188U (de) 1969-10-02 1970-09-30 Halbleiteranordnungen.

Country Status (7)

Country Link
US (1) US3771025A (cg-RX-API-DMAC10.html)
JP (1) JPS4827498B1 (cg-RX-API-DMAC10.html)
DE (2) DE2048068A1 (cg-RX-API-DMAC10.html)
FR (1) FR2064105B1 (cg-RX-API-DMAC10.html)
GB (1) GB1327207A (cg-RX-API-DMAC10.html)
IE (1) IE34522B1 (cg-RX-API-DMAC10.html)
SE (1) SE372373B (cg-RX-API-DMAC10.html)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2265274A1 (de) * 1971-10-01 1977-04-07 Hitachi Ltd Hochspannungs-halbleitergleichrichter
DE3415446A1 (de) * 1983-04-25 1984-10-25 Mitsubishi Denki K.K., Tokio/Tokyo Gegossene harz-halbleitervorrichtung

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5310862Y2 (cg-RX-API-DMAC10.html) * 1972-12-28 1978-03-23
DE3248695A1 (de) * 1982-12-30 1984-07-05 Siemens AG, 1000 Berlin und 8000 München Elektrisches bauelement mit insbesondere zwei drahtfoermigen zuleitungen
JPS6060172U (ja) * 1983-09-13 1985-04-26 本田技研工業株式会社 整流器付トランス装置
US5880403A (en) 1994-04-01 1999-03-09 Space Electronics, Inc. Radiation shielding of three dimensional multi-chip modules
US6613978B2 (en) * 1993-06-18 2003-09-02 Maxwell Technologies, Inc. Radiation shielding of three dimensional multi-chip modules
US6720493B1 (en) 1994-04-01 2004-04-13 Space Electronics, Inc. Radiation shielding of integrated circuits and multi-chip modules in ceramic and metal packages
US6455864B1 (en) 1994-04-01 2002-09-24 Maxwell Electronic Components Group, Inc. Methods and compositions for ionizing radiation shielding
US6261508B1 (en) 1994-04-01 2001-07-17 Maxwell Electronic Components Group, Inc. Method for making a shielding composition
MY114888A (en) * 1994-08-22 2003-02-28 Ibm Method for forming a monolithic electronic module by stacking planar arrays of integrated circuit chips
US6368899B1 (en) 2000-03-08 2002-04-09 Maxwell Electronic Components Group, Inc. Electronic device packaging
US7382043B2 (en) * 2002-09-25 2008-06-03 Maxwell Technologies, Inc. Method and apparatus for shielding an integrated circuit from radiation
US7191516B2 (en) * 2003-07-16 2007-03-20 Maxwell Technologies, Inc. Method for shielding integrated circuit devices

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL125293C (cg-RX-API-DMAC10.html) * 1961-05-16 1900-01-01
US3274454A (en) * 1961-09-21 1966-09-20 Mallory & Co Inc P R Semiconductor multi-stack for regulating charging of current producing cells
US3383760A (en) * 1965-08-09 1968-05-21 Rca Corp Method of making semiconductor devices
US3422527A (en) * 1965-06-21 1969-01-21 Int Rectifier Corp Method of manufacture of high voltage solar cell
US3416046A (en) * 1965-12-13 1968-12-10 Dickson Electronics Corp Encased zener diode assembly and method of producing same

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2265274A1 (de) * 1971-10-01 1977-04-07 Hitachi Ltd Hochspannungs-halbleitergleichrichter
DE3415446A1 (de) * 1983-04-25 1984-10-25 Mitsubishi Denki K.K., Tokio/Tokyo Gegossene harz-halbleitervorrichtung
US4849803A (en) * 1983-04-25 1989-07-18 Mitsubishi Denki Kabushiki Kaisha Molded resin semiconductor device

Also Published As

Publication number Publication date
IE34522L (en) 1971-04-02
JPS4827498B1 (cg-RX-API-DMAC10.html) 1973-08-23
FR2064105B1 (cg-RX-API-DMAC10.html) 1974-06-21
FR2064105A1 (cg-RX-API-DMAC10.html) 1971-07-16
DE7036188U (de) 1972-05-04
US3771025A (en) 1973-11-06
IE34522B1 (en) 1975-05-28
GB1327207A (en) 1973-08-15
SE372373B (cg-RX-API-DMAC10.html) 1974-12-16

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