DE2015247C3 - Halbleiter-Bauelement - Google Patents

Halbleiter-Bauelement

Info

Publication number
DE2015247C3
DE2015247C3 DE2015247A DE2015247A DE2015247C3 DE 2015247 C3 DE2015247 C3 DE 2015247C3 DE 2015247 A DE2015247 A DE 2015247A DE 2015247 A DE2015247 A DE 2015247A DE 2015247 C3 DE2015247 C3 DE 2015247C3
Authority
DE
Germany
Prior art keywords
electrode
alloy
plate
tungsten
cobalt
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE2015247A
Other languages
German (de)
English (en)
Other versions
DE2015247B2 (de
DE2015247A1 (OSRAM
Inventor
Keiichi Morita
Kazusaburo Takahashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of DE2015247A1 publication Critical patent/DE2015247A1/de
Publication of DE2015247B2 publication Critical patent/DE2015247B2/de
Application granted granted Critical
Publication of DE2015247C3 publication Critical patent/DE2015247C3/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
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    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
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    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
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    • H01L2924/01011—Sodium [Na]
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    • H01L2924/01013—Aluminum [Al]
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    • H01L2924/01015—Phosphorus [P]
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    • H01L2924/01024—Chromium [Cr]
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    • H01L2924/01025—Manganese [Mn]
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    • H01L2924/01—Chemical elements
    • H01L2924/01027—Cobalt [Co]
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    • H01L2924/01029—Copper [Cu]
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    • H01L2924/0103—Zinc [Zn]
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    • H01L2924/01033—Arsenic [As]
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    • H01L2924/01—Chemical elements
    • H01L2924/01041—Niobium [Nb]
    • H—ELECTRICITY
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    • H01L2924/01042—Molybdenum [Mo]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01051—Antimony [Sb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01052—Tellurium [Te]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01073—Tantalum [Ta]
    • H—ELECTRICITY
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    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
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    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01327—Intermediate phases, i.e. intermetallics compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1203—Rectifying Diode
    • H01L2924/12036—PN diode

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Die Bonding (AREA)
  • Electroplating Methods And Accessories (AREA)
DE2015247A 1969-03-31 1970-03-31 Halbleiter-Bauelement Expired DE2015247C3 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP44023840A JPS5030428B1 (OSRAM) 1969-03-31 1969-03-31

Publications (3)

Publication Number Publication Date
DE2015247A1 DE2015247A1 (OSRAM) 1970-10-08
DE2015247B2 DE2015247B2 (de) 1972-07-27
DE2015247C3 true DE2015247C3 (de) 1982-07-08

Family

ID=12121578

Family Applications (1)

Application Number Title Priority Date Filing Date
DE2015247A Expired DE2015247C3 (de) 1969-03-31 1970-03-31 Halbleiter-Bauelement

Country Status (3)

Country Link
US (1) US3652904A (OSRAM)
JP (1) JPS5030428B1 (OSRAM)
DE (1) DE2015247C3 (OSRAM)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1381778A (en) * 1972-06-08 1975-01-29 Cableform Ltd Semiconductor clamping means
JPS5243227U (OSRAM) * 1975-09-20 1977-03-28
JPS5278223U (OSRAM) * 1975-12-09 1977-06-10
JPS5482278U (OSRAM) * 1977-11-22 1979-06-11
JPS5929143B2 (ja) * 1978-01-07 1984-07-18 株式会社東芝 電力用半導体装置
US4402004A (en) * 1978-01-07 1983-08-30 Tokyo Shibaura Denki Kabushiki Kaisha High current press pack semiconductor device having a mesa structure
DE3143335A1 (de) * 1981-10-31 1983-05-11 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Halbleitervorrichtung
US4646131A (en) * 1983-01-28 1987-02-24 Mitsubishi Denki Kabushiki Kaisha Rectifier device
US5719447A (en) * 1993-06-03 1998-02-17 Intel Corporation Metal alloy interconnections for integrated circuits
DE59407080D1 (de) * 1993-08-09 1998-11-19 Siemens Ag Leistungs-Halbleiterbauelement mit Druckkontakt
WO1999004433A2 (en) * 1997-07-19 1999-01-28 Koninklijke Philips Electronics N.V. Mcm semiconductor device assemblies and circuits
DE10224124A1 (de) * 2002-05-29 2003-12-18 Infineon Technologies Ag Elektronisches Bauteil mit äußeren Flächenkontakten und Verfahren zu seiner Herstellung

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE577086A (OSRAM) * 1958-04-03 1900-01-01
DE1185728B (de) * 1960-05-18 1965-01-21 Siemens Ag Halbleiteranordnung, insbesondere Flaechengleichrichter oder -transistor mit einem einkristallinen Halbleiterelement
DE1263190B (de) * 1961-07-12 1968-03-14 Siemens Ag Halbleiteranordnung mit einem in ein Gehaeuse eingeschlossenen Halbleiterkoerper
NL289148A (OSRAM) * 1961-08-12
BE621965A (OSRAM) * 1961-09-02 1900-01-01
BE626623A (OSRAM) * 1961-12-30 1900-01-01
NL291606A (OSRAM) * 1962-04-18
DE1248814B (de) * 1962-05-28 1968-03-14 Siemens Ag Halbleiterbauelement und zugehörige Kühlordnung
DE1279200B (de) * 1964-10-31 1968-10-03 Siemens Ag Halbleiterbauelement
US3396316A (en) * 1966-02-15 1968-08-06 Int Rectifier Corp Compression bonded semiconductor device with hermetically sealed subassembly
US3532942A (en) * 1967-05-23 1970-10-06 Int Rectifier Corp Pressure-assembled semiconductor device housing having three terminals
US3512053A (en) * 1968-01-25 1970-05-12 Asea Ab Semi-conductor device having means pressing a connector into contact with a semi-conductor disc

Also Published As

Publication number Publication date
DE2015247B2 (de) 1972-07-27
US3652904A (en) 1972-03-28
DE2015247A1 (OSRAM) 1970-10-08
JPS5030428B1 (OSRAM) 1975-10-01

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Legal Events

Date Code Title Description
C3 Grant after two publication steps (3rd publication)
8328 Change in the person/name/address of the agent

Free format text: STREHL, P., DIPL.-ING. DIPL.-WIRTSCH.-ING., PAT.-ANW., 8000 MUENCHEN