DE2014840A1 - Mit Kunstharz beschichtetes Halbleiterbauelement und Verfahren zur Herstellung desselben - Google Patents

Mit Kunstharz beschichtetes Halbleiterbauelement und Verfahren zur Herstellung desselben

Info

Publication number
DE2014840A1
DE2014840A1 DE19702014840 DE2014840A DE2014840A1 DE 2014840 A1 DE2014840 A1 DE 2014840A1 DE 19702014840 DE19702014840 DE 19702014840 DE 2014840 A DE2014840 A DE 2014840A DE 2014840 A1 DE2014840 A1 DE 2014840A1
Authority
DE
Germany
Prior art keywords
semiconductor
resin
junction
polyimide
semiconductor body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE19702014840
Other languages
German (de)
English (en)
Inventor
Takaaki Hino; Satou Susumu Saitama; Saeki (Japan). P 10767
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of DE2014840A1 publication Critical patent/DE2014840A1/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/68—Organic materials, e.g. photoresists
    • H10P14/683—Organic materials, e.g. photoresists carbon-based polymeric organic materials, e.g. polyimides, poly cyclobutene or PVC
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/63—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
    • H10P14/6326—Deposition processes
    • H10P14/6342—Liquid deposition, e.g. spin-coating, sol-gel techniques or spray coating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/65—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials
    • H10P14/6516—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials of treatments performed after formation of the materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Formation Of Insulating Films (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
DE19702014840 1969-03-28 1970-03-26 Mit Kunstharz beschichtetes Halbleiterbauelement und Verfahren zur Herstellung desselben Pending DE2014840A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1969027024U JPS525586Y1 (enExample) 1969-03-28 1969-03-28

Publications (1)

Publication Number Publication Date
DE2014840A1 true DE2014840A1 (de) 1970-10-01

Family

ID=33050032

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19702014840 Pending DE2014840A1 (de) 1969-03-28 1970-03-26 Mit Kunstharz beschichtetes Halbleiterbauelement und Verfahren zur Herstellung desselben

Country Status (4)

Country Link
JP (1) JPS525586Y1 (enExample)
DE (1) DE2014840A1 (enExample)
FR (1) FR2046162A5 (enExample)
GB (1) GB1291956A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4064289A (en) * 1974-08-21 1977-12-20 Hitachi, Ltd. Method of making a semiconductor device
DE3141000A1 (de) * 1980-10-15 1982-06-03 Mitsubishi Denki K.K., Tokyo Halbleitervorrichtung

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5623759A (en) * 1979-08-01 1981-03-06 Hitachi Ltd Resin-sealed semiconductor device and manufacture thereof
FR2469421A1 (fr) * 1979-11-09 1981-05-22 Rhone Poulenc Ind Procede d'encapsulation de composants electroniques a l'aide d'une matiere moulable a base d'un prepolymere thermodurcissable

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4064289A (en) * 1974-08-21 1977-12-20 Hitachi, Ltd. Method of making a semiconductor device
DE3141000A1 (de) * 1980-10-15 1982-06-03 Mitsubishi Denki K.K., Tokyo Halbleitervorrichtung

Also Published As

Publication number Publication date
JPS525586Y1 (enExample) 1977-02-04
GB1291956A (en) 1972-10-04
FR2046162A5 (enExample) 1971-03-05

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