GB1291956A - Semiconductor element coated with organic resin and its method of manufacture - Google Patents
Semiconductor element coated with organic resin and its method of manufactureInfo
- Publication number
- GB1291956A GB1291956A GB03537/70A GB1353770A GB1291956A GB 1291956 A GB1291956 A GB 1291956A GB 03537/70 A GB03537/70 A GB 03537/70A GB 1353770 A GB1353770 A GB 1353770A GB 1291956 A GB1291956 A GB 1291956A
- Authority
- GB
- United Kingdom
- Prior art keywords
- resin
- manufacture
- semiconductor element
- organic resin
- march
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 title abstract 4
- 239000011347 resin Substances 0.000 title abstract 3
- 229920005989 resin Polymers 0.000 title abstract 3
- 238000000034 method Methods 0.000 title abstract 2
- 238000004519 manufacturing process Methods 0.000 title 1
- 229920001721 polyimide Polymers 0.000 abstract 3
- 239000009719 polyimide resin Substances 0.000 abstract 3
- 239000011230 binding agent Substances 0.000 abstract 1
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 239000011521 glass Substances 0.000 abstract 1
- 239000000203 mixture Substances 0.000 abstract 1
- 229920003055 poly(ester-imide) Polymers 0.000 abstract 1
- 229920002312 polyamide-imide Polymers 0.000 abstract 1
- QLNJFJADRCOGBJ-UHFFFAOYSA-N propionamide Chemical compound CCC(N)=O QLNJFJADRCOGBJ-UHFFFAOYSA-N 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02118—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer carbon based polymeric organic or inorganic material, e.g. polyimides, poly cyclobutene or PVC
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02282—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process liquid deposition, e.g. spin-coating, sol-gel techniques, spray coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02296—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
- H01L21/02318—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3157—Partial encapsulation or coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12044—OLED
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Formation Of Insulating Films (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
1291956 Semi-conductor devices HITACHI Ltd 20 March 1970 [28 March 1969] 13537/70 Heading H1K A surface-emergent Pn junction in a semiconductor device 1 is passivatod by a coating 6 of a polyimide resin. Suitable polyimide resins include polyamidimide, polyesterimide and polybenzimidazopyrrolone. The device may be hermetically sealed in a glass housing 2. The procedure for applying a specified polyimide resin comprises mixing the resin with a binder such as propylamide, leaving the mixture at 5‹ C. or lower for a period and applying it by syringe or as a drop transferred to the semiconductor body from a wire. The resin is then dried at about 150‹ C. for about 2 hours.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1969027024U JPS525586Y1 (en) | 1969-03-28 | 1969-03-28 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1291956A true GB1291956A (en) | 1972-10-04 |
Family
ID=33050032
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB03537/70A Expired GB1291956A (en) | 1969-03-28 | 1970-03-20 | Semiconductor element coated with organic resin and its method of manufacture |
Country Status (4)
Country | Link |
---|---|
JP (1) | JPS525586Y1 (en) |
DE (1) | DE2014840A1 (en) |
FR (1) | FR2046162A5 (en) |
GB (1) | GB1291956A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4523371A (en) * | 1979-08-01 | 1985-06-18 | Yoshiaki Wakashima | Method of fabricating a resin mold type semiconductor device |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5123082A (en) * | 1974-08-21 | 1976-02-24 | Hitachi Ltd | Handotaisochino seizoho |
FR2469421A1 (en) * | 1979-11-09 | 1981-05-22 | Rhone Poulenc Ind | METHOD OF ENCAPSULATING ELECTRONIC COMPONENTS USING A MOLDABLE MATERIAL BASED ON A THERMOSETTING PREPOLYMER |
JPS5768059A (en) * | 1980-10-15 | 1982-04-26 | Mitsubishi Electric Corp | Semiconductor device |
-
1969
- 1969-03-28 JP JP1969027024U patent/JPS525586Y1/ja not_active Expired
-
1970
- 1970-03-20 GB GB03537/70A patent/GB1291956A/en not_active Expired
- 1970-03-26 FR FR7011008A patent/FR2046162A5/fr not_active Expired
- 1970-03-26 DE DE19702014840 patent/DE2014840A1/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4523371A (en) * | 1979-08-01 | 1985-06-18 | Yoshiaki Wakashima | Method of fabricating a resin mold type semiconductor device |
Also Published As
Publication number | Publication date |
---|---|
JPS525586Y1 (en) | 1977-02-04 |
FR2046162A5 (en) | 1971-03-05 |
DE2014840A1 (en) | 1970-10-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed [section 19, patents act 1949] | ||
PCNP | Patent ceased through non-payment of renewal fee |