JPS525586Y1 - - Google Patents

Info

Publication number
JPS525586Y1
JPS525586Y1 JP1969027024U JP2702469U JPS525586Y1 JP S525586 Y1 JPS525586 Y1 JP S525586Y1 JP 1969027024 U JP1969027024 U JP 1969027024U JP 2702469 U JP2702469 U JP 2702469U JP S525586 Y1 JPS525586 Y1 JP S525586Y1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1969027024U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1969027024U priority Critical patent/JPS525586Y1/ja
Priority to GB03537/70A priority patent/GB1291956A/en
Priority to DE19702014840 priority patent/DE2014840A1/de
Priority to FR7011008A priority patent/FR2046162A5/fr
Publication of JPS525586Y1 publication Critical patent/JPS525586Y1/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/68—Organic materials, e.g. photoresists
    • H10P14/683—Organic materials, e.g. photoresists carbon-based polymeric organic materials, e.g. polyimides, poly cyclobutene or PVC
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/63—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
    • H10P14/6326—Deposition processes
    • H10P14/6342—Liquid deposition, e.g. spin-coating, sol-gel techniques or spray coating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/65—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials
    • H10P14/6516—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials of treatments performed after formation of the materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Formation Of Insulating Films (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP1969027024U 1969-03-28 1969-03-28 Expired JPS525586Y1 (enExample)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP1969027024U JPS525586Y1 (enExample) 1969-03-28 1969-03-28
GB03537/70A GB1291956A (en) 1969-03-28 1970-03-20 Semiconductor element coated with organic resin and its method of manufacture
DE19702014840 DE2014840A1 (de) 1969-03-28 1970-03-26 Mit Kunstharz beschichtetes Halbleiterbauelement und Verfahren zur Herstellung desselben
FR7011008A FR2046162A5 (enExample) 1969-03-28 1970-03-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1969027024U JPS525586Y1 (enExample) 1969-03-28 1969-03-28

Publications (1)

Publication Number Publication Date
JPS525586Y1 true JPS525586Y1 (enExample) 1977-02-04

Family

ID=33050032

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1969027024U Expired JPS525586Y1 (enExample) 1969-03-28 1969-03-28

Country Status (4)

Country Link
JP (1) JPS525586Y1 (enExample)
DE (1) DE2014840A1 (enExample)
FR (1) FR2046162A5 (enExample)
GB (1) GB1291956A (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5123082A (en) * 1974-08-21 1976-02-24 Hitachi Ltd Handotaisochino seizoho
JPS5623759A (en) * 1979-08-01 1981-03-06 Hitachi Ltd Resin-sealed semiconductor device and manufacture thereof
FR2469421A1 (fr) * 1979-11-09 1981-05-22 Rhone Poulenc Ind Procede d'encapsulation de composants electroniques a l'aide d'une matiere moulable a base d'un prepolymere thermodurcissable
JPS5768059A (en) * 1980-10-15 1982-04-26 Mitsubishi Electric Corp Semiconductor device

Also Published As

Publication number Publication date
DE2014840A1 (de) 1970-10-01
GB1291956A (en) 1972-10-04
FR2046162A5 (enExample) 1971-03-05

Similar Documents

Publication Publication Date Title
AU2270770A (enExample)
AU465413B2 (enExample)
AU429630B2 (enExample)
AU5461069A (enExample)
FR2046162A5 (enExample)
AU2355770A (enExample)
CS153076B2 (enExample)
AU427401B2 (enExample)
CS148795B1 (enExample)
AU442380B2 (enExample)
AU442357B2 (enExample)
AU442322B2 (enExample)
AU428129B2 (enExample)
AU442554B2 (enExample)
AU442535B2 (enExample)
AU428074B2 (enExample)
AU442285B2 (enExample)
AU417208B2 (enExample)
AU470661B1 (enExample)
AU438128B2 (enExample)
AU5228269A (enExample)
CS150905B2 (enExample)
AU5598769A (enExample)
AU6261969A (enExample)
AR203167Q (enExample)