JPS525586Y1 - - Google Patents
Info
- Publication number
- JPS525586Y1 JPS525586Y1 JP1969027024U JP2702469U JPS525586Y1 JP S525586 Y1 JPS525586 Y1 JP S525586Y1 JP 1969027024 U JP1969027024 U JP 1969027024U JP 2702469 U JP2702469 U JP 2702469U JP S525586 Y1 JPS525586 Y1 JP S525586Y1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10P14/683—
-
- H10P14/6342—
-
- H10P14/6516—
-
- H10W74/01—
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- H10W74/131—
-
- H10W74/47—
Landscapes
- Formation Of Insulating Films (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1969027024U JPS525586Y1 (enExample) | 1969-03-28 | 1969-03-28 | |
| GB03537/70A GB1291956A (en) | 1969-03-28 | 1970-03-20 | Semiconductor element coated with organic resin and its method of manufacture |
| DE19702014840 DE2014840A1 (de) | 1969-03-28 | 1970-03-26 | Mit Kunstharz beschichtetes Halbleiterbauelement und Verfahren zur Herstellung desselben |
| FR7011008A FR2046162A5 (enExample) | 1969-03-28 | 1970-03-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1969027024U JPS525586Y1 (enExample) | 1969-03-28 | 1969-03-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS525586Y1 true JPS525586Y1 (enExample) | 1977-02-04 |
Family
ID=33050032
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1969027024U Expired JPS525586Y1 (enExample) | 1969-03-28 | 1969-03-28 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPS525586Y1 (enExample) |
| DE (1) | DE2014840A1 (enExample) |
| FR (1) | FR2046162A5 (enExample) |
| GB (1) | GB1291956A (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5123082A (en) * | 1974-08-21 | 1976-02-24 | Hitachi Ltd | Handotaisochino seizoho |
| JPS5623759A (en) * | 1979-08-01 | 1981-03-06 | Hitachi Ltd | Resin-sealed semiconductor device and manufacture thereof |
| FR2469421A1 (fr) * | 1979-11-09 | 1981-05-22 | Rhone Poulenc Ind | Procede d'encapsulation de composants electroniques a l'aide d'une matiere moulable a base d'un prepolymere thermodurcissable |
| JPS5768059A (en) * | 1980-10-15 | 1982-04-26 | Mitsubishi Electric Corp | Semiconductor device |
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1969
- 1969-03-28 JP JP1969027024U patent/JPS525586Y1/ja not_active Expired
-
1970
- 1970-03-20 GB GB03537/70A patent/GB1291956A/en not_active Expired
- 1970-03-26 DE DE19702014840 patent/DE2014840A1/de active Pending
- 1970-03-26 FR FR7011008A patent/FR2046162A5/fr not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| GB1291956A (en) | 1972-10-04 |
| FR2046162A5 (enExample) | 1971-03-05 |
| DE2014840A1 (de) | 1970-10-01 |