DE19983939T1 - Laserstrahlmaschine - Google Patents
LaserstrahlmaschineInfo
- Publication number
- DE19983939T1 DE19983939T1 DE19983939T DE19983939T DE19983939T1 DE 19983939 T1 DE19983939 T1 DE 19983939T1 DE 19983939 T DE19983939 T DE 19983939T DE 19983939 T DE19983939 T DE 19983939T DE 19983939 T1 DE19983939 T1 DE 19983939T1
- Authority
- DE
- Germany
- Prior art keywords
- laser beam
- beam machine
- machine
- laser
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
- B23K26/042—Automatically aligning the laser beam
- B23K26/043—Automatically aligning the laser beam along the beam path, i.e. alignment of laser beam axis relative to laser beam apparatus
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0665—Shaping the laser beam, e.g. by masks or multi-focusing by beam condensation on the workpiece, e.g. for focusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
- B23K26/0676—Dividing the beam into multiple beams, e.g. multifocusing into dependently operating sub-beams, e.g. an array of spots with fixed spatial relationship or for performing simultaneously identical operations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP1999/001089 WO2000053365A1 (fr) | 1999-03-05 | 1999-03-05 | Appareil d'usinage au laser |
Publications (2)
Publication Number | Publication Date |
---|---|
DE19983939T1 true DE19983939T1 (de) | 2002-04-11 |
DE19983939B4 DE19983939B4 (de) | 2005-02-17 |
Family
ID=14235119
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19983939T Expired - Fee Related DE19983939B4 (de) | 1999-03-05 | 1999-03-05 | Laserstrahlmaschine |
Country Status (5)
Country | Link |
---|---|
US (1) | US6635849B1 (de) |
JP (1) | JP4218209B2 (de) |
DE (1) | DE19983939B4 (de) |
TW (1) | TW436358B (de) |
WO (1) | WO2000053365A1 (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1441874A1 (de) | 2001-10-09 | 2004-08-04 | Chromalloy Gas Turbine Corporation | Verfahren zur entfernung von überzugsmaterial aus einem kühlloch eines turbomotorbauteils |
Families Citing this family (80)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI223581B (en) * | 1999-04-02 | 2004-11-01 | Murata Manufacturing Co | Method for machining ceramic green sheet and apparatus for machining the same |
TW552645B (en) | 2001-08-03 | 2003-09-11 | Semiconductor Energy Lab | Laser irradiating device, laser irradiating method and manufacturing method of semiconductor device |
JP4397571B2 (ja) | 2001-09-25 | 2010-01-13 | 株式会社半導体エネルギー研究所 | レーザ照射方法およびレーザ照射装置、並びに半導体装置の作製方法 |
JP4148138B2 (ja) | 2001-11-15 | 2008-09-10 | 三菱電機株式会社 | レーザ加工装置 |
JP3925169B2 (ja) * | 2001-11-26 | 2007-06-06 | 株式会社デンソー | レーザー光による材料の同時一括溶融方法及び装置 |
CN1232380C (zh) * | 2002-03-28 | 2005-12-21 | 三菱电机株式会社 | 激光加工装置 |
JP3775410B2 (ja) * | 2003-02-03 | 2006-05-17 | セイコーエプソン株式会社 | レーザー加工方法、レーザー溶接方法並びにレーザー加工装置 |
JP4662411B2 (ja) | 2003-03-14 | 2011-03-30 | 日立ビアメカニクス株式会社 | レーザ加工装置 |
TWI275439B (en) * | 2003-05-19 | 2007-03-11 | Mitsubishi Electric Corp | Laser processing apparatus |
US6947454B2 (en) * | 2003-06-30 | 2005-09-20 | Electro Scientific Industries, Inc. | Laser pulse picking employing controlled AOM loading |
JP2005144487A (ja) * | 2003-11-13 | 2005-06-09 | Seiko Epson Corp | レーザ加工装置及びレーザ加工方法 |
EP1550528A1 (de) * | 2003-12-30 | 2005-07-06 | Advanced Laser Separation International (ALSI) B.V. | Verfahren, Vorrichtung und Beugungsgitter zum Trennen eines auf einem Substrat hergestellten Halbleiterelementes durch Veränderung dieses Beugungsgitters |
JP4615231B2 (ja) * | 2004-02-02 | 2011-01-19 | 三星ダイヤモンド工業株式会社 | スクライブ装置およびこの装置を用いたスクライブ方法 |
KR100514996B1 (ko) | 2004-04-19 | 2005-09-15 | 주식회사 이오테크닉스 | 레이저 가공 장치 |
JP2005342748A (ja) * | 2004-06-01 | 2005-12-15 | Hitachi Via Mechanics Ltd | レーザ加工機 |
US7244907B2 (en) * | 2004-06-30 | 2007-07-17 | Matsushita Electric Industrial Co., Ltd. | Method of optimizing optical power use in a parallel processing laser system |
US20060086898A1 (en) * | 2004-10-26 | 2006-04-27 | Matsushita Electric Industrial Co., Ltd. | Method and apparatus of making highly repetitive micro-pattern using laser writer |
US20060114948A1 (en) * | 2004-11-29 | 2006-06-01 | Lo Ho W | Workpiece processing system using a common imaged optical assembly to shape the spatial distributions of light energy of multiple laser beams |
CN100523976C (zh) * | 2005-06-17 | 2009-08-05 | 同济大学 | 一种全固态电致变色器件及其制备方法 |
JP4664852B2 (ja) * | 2006-03-31 | 2011-04-06 | 三菱電機株式会社 | レーザ加工装置 |
JP4667329B2 (ja) * | 2006-08-30 | 2011-04-13 | 三菱電機株式会社 | レーザ加工装置 |
JP4667400B2 (ja) * | 2007-01-16 | 2011-04-13 | 三菱電機株式会社 | Doe調整方法およびレーザ加工装置 |
CN101878087B (zh) * | 2007-11-20 | 2015-05-13 | 三菱电机株式会社 | 激光振荡器内出射镜的老化状态测定方法以及激光加工装置 |
DE102008032751B3 (de) * | 2008-07-11 | 2009-12-10 | Innolas Systems Gmbh | Laserbearbeitungsvorrichtung und Laserbearbeitungsverfahren mit Doppel- oder Mehrfachspot mittels eines Galvanoscanners |
AU2015201408B2 (en) * | 2008-12-01 | 2017-04-13 | Amo Development, Llc | System and method for laser photoaltering a material using multi-beam scanning |
US8388609B2 (en) * | 2008-12-01 | 2013-03-05 | Amo Development, Llc. | System and method for multibeam scanning |
DE112009003752B4 (de) | 2008-12-17 | 2018-02-15 | Mitsubishi Electric Corporation | Verfahren zur Herstellung einer Fotovoltaikvorrichtung |
JP5300544B2 (ja) * | 2009-03-17 | 2013-09-25 | 株式会社ディスコ | 光学系及びレーザ加工装置 |
JP5667347B2 (ja) * | 2009-06-30 | 2015-02-12 | 三星ダイヤモンド工業株式会社 | レーザ光によるガラス基板加工装置 |
WO2011116968A2 (en) * | 2010-03-24 | 2011-09-29 | Laser Zentrum Hannover E.V. | System and method for laser-beam based processing |
DE202010013161U1 (de) * | 2010-07-08 | 2011-03-31 | Oerlikon Solar Ag, Trübbach | Laserbearbeitung mit mehreren Strahlen und dafür geeigneter Laseroptikkopf |
JP5511644B2 (ja) * | 2010-12-07 | 2014-06-04 | 住友重機械工業株式会社 | レーザ加工装置及びレーザ加工方法 |
JP6035096B2 (ja) * | 2012-09-27 | 2016-11-30 | 三星ダイヤモンド工業株式会社 | レーザ加工装置 |
WO2014079478A1 (en) | 2012-11-20 | 2014-05-30 | Light In Light Srl | High speed laser processing of transparent materials |
EP2754524B1 (de) | 2013-01-15 | 2015-11-25 | Corning Laser Technologies GmbH | Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie |
EP2781296B1 (de) | 2013-03-21 | 2020-10-21 | Corning Laser Technologies GmbH | Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser |
TWI561327B (en) * | 2013-10-16 | 2016-12-11 | Asm Tech Singapore Pte Ltd | Laser scribing apparatus comprising adjustable spatial filter and method for etching semiconductor substrate |
US10293436B2 (en) | 2013-12-17 | 2019-05-21 | Corning Incorporated | Method for rapid laser drilling of holes in glass and products made therefrom |
US20150165560A1 (en) | 2013-12-17 | 2015-06-18 | Corning Incorporated | Laser processing of slots and holes |
US9676167B2 (en) | 2013-12-17 | 2017-06-13 | Corning Incorporated | Laser processing of sapphire substrate and related applications |
US9815730B2 (en) | 2013-12-17 | 2017-11-14 | Corning Incorporated | Processing 3D shaped transparent brittle substrate |
US11556039B2 (en) | 2013-12-17 | 2023-01-17 | Corning Incorporated | Electrochromic coated glass articles and methods for laser processing the same |
US10442719B2 (en) | 2013-12-17 | 2019-10-15 | Corning Incorporated | Edge chamfering methods |
US9850160B2 (en) | 2013-12-17 | 2017-12-26 | Corning Incorporated | Laser cutting of display glass compositions |
US9701563B2 (en) | 2013-12-17 | 2017-07-11 | Corning Incorporated | Laser cut composite glass article and method of cutting |
KR102445217B1 (ko) | 2014-07-08 | 2022-09-20 | 코닝 인코포레이티드 | 재료를 레이저 가공하는 방법 및 장치 |
TWI659793B (zh) * | 2014-07-14 | 2019-05-21 | 美商康寧公司 | 用於使用可調整雷射束焦線來處理透明材料的系統及方法 |
CN208586209U (zh) | 2014-07-14 | 2019-03-08 | 康宁股份有限公司 | 一种用于在工件中形成限定轮廓的多个缺陷的系统 |
WO2016010943A2 (en) | 2014-07-14 | 2016-01-21 | Corning Incorporated | Method and system for arresting crack propagation |
US10526234B2 (en) | 2014-07-14 | 2020-01-07 | Corning Incorporated | Interface block; system for and method of cutting a substrate being transparent within a range of wavelengths using such interface block |
KR101527482B1 (ko) * | 2014-11-25 | 2015-06-10 | 유수영 | 레이저를 이용한 미세 부품 가공 장치 |
US10047001B2 (en) | 2014-12-04 | 2018-08-14 | Corning Incorporated | Glass cutting systems and methods using non-diffracting laser beams |
CN107406293A (zh) | 2015-01-12 | 2017-11-28 | 康宁股份有限公司 | 使用多光子吸收方法来对经热回火的基板进行激光切割 |
EP3274306B1 (de) | 2015-03-24 | 2021-04-14 | Corning Incorporated | Laserschneiden und verarbeiten von anzeigeglaszusammensetzungen |
EP3274313A1 (de) | 2015-03-27 | 2018-01-31 | Corning Incorporated | Gasdurchlässiges fenster und verfahren zur herstellung davon |
EP3319911B1 (de) | 2015-07-10 | 2023-04-19 | Corning Incorporated | Verfahren zur kontinuierlichen herstellung von löchern in flexiblen substratbahnen und zugehörige produkte |
JP6938543B2 (ja) | 2016-05-06 | 2021-09-22 | コーニング インコーポレイテッド | 透明基板からの、輪郭設定された形状のレーザ切断及び取り外し |
US10410883B2 (en) | 2016-06-01 | 2019-09-10 | Corning Incorporated | Articles and methods of forming vias in substrates |
US10794679B2 (en) | 2016-06-29 | 2020-10-06 | Corning Incorporated | Method and system for measuring geometric parameters of through holes |
KR101653524B1 (ko) * | 2016-07-01 | 2016-09-01 | 이석준 | 레이저 3차원 가공 시스템 |
WO2018012379A1 (ja) * | 2016-07-14 | 2018-01-18 | 三菱電機株式会社 | レーザ加工装置 |
JP7090594B2 (ja) | 2016-07-29 | 2022-06-24 | コーニング インコーポレイテッド | レーザ加工するための装置および方法 |
EP3507057A1 (de) | 2016-08-30 | 2019-07-10 | Corning Incorporated | Laserbearbeitung von transparenten materialien |
CN109803786B (zh) | 2016-09-30 | 2021-05-07 | 康宁股份有限公司 | 使用非轴对称束斑对透明工件进行激光加工的设备和方法 |
EP3529214B1 (de) | 2016-10-24 | 2020-12-23 | Corning Incorporated | Substratverarbeitungsstation zur laserbasierten verarbeitung von flächigen glassubstraten |
US10752534B2 (en) | 2016-11-01 | 2020-08-25 | Corning Incorporated | Apparatuses and methods for laser processing laminate workpiece stacks |
US10688599B2 (en) | 2017-02-09 | 2020-06-23 | Corning Incorporated | Apparatus and methods for laser processing transparent workpieces using phase shifted focal lines |
US10580725B2 (en) | 2017-05-25 | 2020-03-03 | Corning Incorporated | Articles having vias with geometry attributes and methods for fabricating the same |
US11078112B2 (en) | 2017-05-25 | 2021-08-03 | Corning Incorporated | Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same |
US10626040B2 (en) | 2017-06-15 | 2020-04-21 | Corning Incorporated | Articles capable of individual singulation |
JP6595558B2 (ja) * | 2017-10-30 | 2019-10-23 | ファナック株式会社 | レーザ加工システム |
US11554984B2 (en) | 2018-02-22 | 2023-01-17 | Corning Incorporated | Alkali-free borosilicate glasses with low post-HF etch roughness |
JP7073986B2 (ja) * | 2018-08-29 | 2022-05-24 | 日本電信電話株式会社 | レーザー加工装置 |
JP7295728B2 (ja) * | 2019-07-11 | 2023-06-21 | 日本電信電話株式会社 | レーザー光走査装置及びレーザー光走査方法 |
JP7303053B2 (ja) * | 2019-07-17 | 2023-07-04 | ファナック株式会社 | 調整補助具及びレーザ溶接装置 |
JP7412925B2 (ja) * | 2019-08-26 | 2024-01-15 | キヤノン株式会社 | 光学装置、および、物品の製造方法 |
US11305377B2 (en) * | 2019-12-23 | 2022-04-19 | Precitec Gmbh & Co. Kg | Add-on module for interposing between a control device and a laser machining head of a laser machining system |
US12064830B2 (en) | 2020-03-12 | 2024-08-20 | Rohr, Inc. | Substrate perforation system and method using beamlets |
US20220117218A1 (en) * | 2020-10-16 | 2022-04-21 | Verdant Robotics, Inc. | Autonomous system for light treatment of a plant |
DE102020131405A1 (de) | 2020-11-26 | 2022-06-02 | LANG LASER - System GmbH | Vorrichtung zur Materialbearbeitung mit Mehrfachapplikation |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0770834B2 (ja) | 1990-05-17 | 1995-07-31 | 富士機工電子株式会社 | 内層パターン部が露出したプリント基板、およびその製造方法 |
JPH0422190U (de) * | 1990-06-07 | 1992-02-24 | ||
US5322999A (en) * | 1992-10-13 | 1994-06-21 | Merryman Jerry D | Method and apparatus for precision control of galvanometer patterning system |
US5521628A (en) * | 1993-08-30 | 1996-05-28 | Lumonics Corporation | Laser system for simultaneously marking multiple parts |
JPH07124778A (ja) * | 1993-10-29 | 1995-05-16 | Japan Energy Corp | レーザ加工装置 |
JP2682475B2 (ja) * | 1994-11-17 | 1997-11-26 | 日本電気株式会社 | ビームスキャン式レーザマーキング方法および装置 |
DE19511393B4 (de) * | 1995-03-28 | 2005-08-25 | Carl Baasel Lasertechnik Gmbh | Gerät zur Substratbehandlung, insbesondere zum Perforieren von Papier |
JPH091363A (ja) * | 1995-06-14 | 1997-01-07 | Hitachi Ltd | レーザマーカ |
JP3738790B2 (ja) | 1996-07-26 | 2006-01-25 | セイコーエプソン株式会社 | インクジェット記録ヘッドの構成部材の開口穿孔方法 |
EP0884128B1 (de) * | 1996-11-20 | 2007-08-08 | Ibiden Co., Ltd. | Laserbearbeitungsvorrichtung, verfahren und vorrichtung zur herstellung einer mehrschichtigen, gedruckten leiterplatte |
JP3199653B2 (ja) | 1996-12-27 | 2001-08-20 | イビデン株式会社 | 多層プリント配線板の製造装置及び製造方法 |
GB9811557D0 (en) * | 1998-05-29 | 1998-07-29 | Exitech Ltd | The use of beam shaping for improving the performance of machines used to laser drill microvia holes in printed circuit (wiring) and other packages |
JP3346374B2 (ja) * | 1999-06-23 | 2002-11-18 | 住友電気工業株式会社 | レーザ穴開け加工装置 |
-
1999
- 1999-03-05 US US09/914,779 patent/US6635849B1/en not_active Expired - Fee Related
- 1999-03-05 DE DE19983939T patent/DE19983939B4/de not_active Expired - Fee Related
- 1999-03-05 JP JP2000603840A patent/JP4218209B2/ja not_active Expired - Fee Related
- 1999-03-05 WO PCT/JP1999/001089 patent/WO2000053365A1/ja active Application Filing
- 1999-03-31 TW TW088105075A patent/TW436358B/zh not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1441874A1 (de) | 2001-10-09 | 2004-08-04 | Chromalloy Gas Turbine Corporation | Verfahren zur entfernung von überzugsmaterial aus einem kühlloch eines turbomotorbauteils |
Also Published As
Publication number | Publication date |
---|---|
US6635849B1 (en) | 2003-10-21 |
TW436358B (en) | 2001-05-28 |
WO2000053365A1 (fr) | 2000-09-14 |
JP4218209B2 (ja) | 2009-02-04 |
DE19983939B4 (de) | 2005-02-17 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE19983939T1 (de) | Laserstrahlmaschine | |
DE50007382D1 (de) | Abschirmung gegen laserstrahlen | |
DE69908745D1 (de) | Laserbearbeitungskopf | |
DE19782307T1 (de) | Laserbearbeitungsgerät | |
DE69817099D1 (de) | Laserdrucker | |
DE69826720D1 (de) | Schweissgerät | |
DE60029865D1 (de) | Einmodiger Halbleiterlaser | |
DE60045653D1 (de) | Laserbestrahlungsgerät | |
DE60336956D1 (de) | Laserstrahlmaschine | |
DE69800626D1 (de) | Laserstrahlbearbeitungsvorrichtung | |
DE60032862D1 (de) | Laserätzverfahren | |
DE69927226D1 (de) | Schweissgerät | |
DE60019257D1 (de) | Oberflächenemittierender halbleiterlaser | |
DE50009759D1 (de) | Durchstrahl-Laser-Schweisseinrichtung | |
DE50002091D1 (de) | Festkörperlaser | |
FI980860A (fi) | Aallonpituudeltaan säädettävä laserjärjestely | |
ATA150099A (de) | Laserskalpell | |
DE60041742D1 (de) | Halbleiterlaser | |
DE69937857D1 (de) | Lasersystem | |
DE60017076D1 (de) | Lasersystem | |
DE69924544D1 (de) | Faserlaser | |
NO20005271D0 (no) | Optisk aktive tetrahydrobenzindol-derivater | |
DE60040636D1 (de) | Lasermustergenerator | |
DE69928801D1 (de) | Stabilisierte Laserquelle | |
DE69901967D1 (de) | Laser-Nivelliersystem |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
OP8 | Request for examination as to paragraph 44 patent law | ||
8364 | No opposition during term of opposition | ||
8320 | Willingness to grant licences declared (paragraph 23) | ||
8339 | Ceased/non-payment of the annual fee |