DE19734695C1 - Verfahren zur Korrektur der Messfehler einer Koodinaten-Messmaschine - Google Patents

Verfahren zur Korrektur der Messfehler einer Koodinaten-Messmaschine

Info

Publication number
DE19734695C1
DE19734695C1 DE19734695A DE19734695A DE19734695C1 DE 19734695 C1 DE19734695 C1 DE 19734695C1 DE 19734695 A DE19734695 A DE 19734695A DE 19734695 A DE19734695 A DE 19734695A DE 19734695 C1 DE19734695 C1 DE 19734695C1
Authority
DE
Germany
Prior art keywords
calibration
coordinates
correction function
functions
rotation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE19734695A
Other languages
German (de)
English (en)
Inventor
Klaus Dr Rinn
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Leica Microsystems CMS GmbH
Original Assignee
Leica Mikroskopie und Systems GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to DE19734695A priority Critical patent/DE19734695C1/de
Application filed by Leica Mikroskopie und Systems GmbH filed Critical Leica Mikroskopie und Systems GmbH
Priority to PCT/DE1998/001744 priority patent/WO1999008070A1/de
Priority to US09/269,768 priority patent/US6317991B1/en
Priority to EP98936250A priority patent/EP0931241B1/de
Priority to JP11511495A priority patent/JP2001502433A/ja
Priority to KR1019997002954A priority patent/KR20000068713A/ko
Priority to DE59809276T priority patent/DE59809276D1/de
Priority to TW087111708A priority patent/TW393564B/zh
Application granted granted Critical
Publication of DE19734695C1 publication Critical patent/DE19734695C1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
    • G01B21/02—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness
    • G01B21/04—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness by measuring coordinates of points
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G03F7/70725—Stages control
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
    • G01B21/02—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness
    • G01B21/04—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness by measuring coordinates of points
    • G01B21/042—Calibration or calibration artifacts
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/70516—Calibration of components of the microlithographic apparatus, e.g. light sources, addressable masks or detectors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Length Measuring Devices With Unspecified Measuring Means (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Image Processing (AREA)
DE19734695A 1997-08-11 1997-08-11 Verfahren zur Korrektur der Messfehler einer Koodinaten-Messmaschine Expired - Fee Related DE19734695C1 (de)

Priority Applications (8)

Application Number Priority Date Filing Date Title
DE19734695A DE19734695C1 (de) 1997-08-11 1997-08-11 Verfahren zur Korrektur der Messfehler einer Koodinaten-Messmaschine
US09/269,768 US6317991B1 (en) 1997-08-11 1998-06-25 Method for correcting measurement errors in a machine measuring co-ordinates
EP98936250A EP0931241B1 (de) 1997-08-11 1998-06-25 Verfahren zur korrektur der messfehler einer koordinaten-messmaschine
JP11511495A JP2001502433A (ja) 1997-08-11 1998-06-25 座標測定機の測定誤差の補正方法
PCT/DE1998/001744 WO1999008070A1 (de) 1997-08-11 1998-06-25 Verfahren zur korrektur der messfehler einer koordinaten-messmaschine
KR1019997002954A KR20000068713A (ko) 1997-08-11 1998-06-25 좌표 측정기의 측정 오차 보정 방법
DE59809276T DE59809276D1 (de) 1997-08-11 1998-06-25 Verfahren zur korrektur der messfehler einer koordinaten-messmaschine
TW087111708A TW393564B (en) 1997-08-11 1998-07-17 Method to correct the measure-error of a coordinate measure-machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19734695A DE19734695C1 (de) 1997-08-11 1997-08-11 Verfahren zur Korrektur der Messfehler einer Koodinaten-Messmaschine

Publications (1)

Publication Number Publication Date
DE19734695C1 true DE19734695C1 (de) 1998-11-05

Family

ID=7838600

Family Applications (2)

Application Number Title Priority Date Filing Date
DE19734695A Expired - Fee Related DE19734695C1 (de) 1997-08-11 1997-08-11 Verfahren zur Korrektur der Messfehler einer Koodinaten-Messmaschine
DE59809276T Expired - Fee Related DE59809276D1 (de) 1997-08-11 1998-06-25 Verfahren zur korrektur der messfehler einer koordinaten-messmaschine

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE59809276T Expired - Fee Related DE59809276D1 (de) 1997-08-11 1998-06-25 Verfahren zur korrektur der messfehler einer koordinaten-messmaschine

Country Status (7)

Country Link
US (1) US6317991B1 (enExample)
EP (1) EP0931241B1 (enExample)
JP (1) JP2001502433A (enExample)
KR (1) KR20000068713A (enExample)
DE (2) DE19734695C1 (enExample)
TW (1) TW393564B (enExample)
WO (1) WO1999008070A1 (enExample)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10224993C1 (de) * 2002-06-05 2003-08-21 Siemens Ag Verfahren zur Vermessung der Verzerrung einer Flächen-Positioniervorrichtung
DE102007000999A1 (de) 2007-02-26 2008-08-28 Vistec Semiconductor Systems Gmbh Verfahren zur Beseitigung von Fehlerquellen der Systemkorrektur einer Koordinaten-Messmaschine
WO2008055589A3 (en) * 2006-11-09 2008-10-02 Zeiss Carl Sms Gmbh Method for determination of residual errors
DE102007030390A1 (de) * 2007-06-29 2009-01-02 Vistec Semiconductor Systems Gmbh Koordinaten-Messmaschine und Verfahren zur Kalibrierung der Koordinaten-Messmaschine
DE102007033345A1 (de) * 2007-07-16 2009-02-05 Vistec Semiconductor Systems Gmbh Verfahren zur Korrektur eines Fehlers des Abbildungssystems einer Koordinaten-Messmaschine
DE102007039983A1 (de) * 2007-08-23 2009-02-26 Vistec Semiconductor Systems Gmbh Verfahren zum Messen von Positionen von Strukturen auf einem Substrat mit einer Koordinaten Messmaschine
DE102007000973A1 (de) * 2007-11-05 2009-05-14 Vistec Semiconductor Systems Gmbh Maske und Verfahren zur Bestimmung der Drehlage der Maske
DE102009003503A1 (de) 2009-02-18 2010-08-19 Vistec Semiconductor Systems Gmbh Verfahren zur Kalibrierung eines Messtisches einer Koordinaten-Messmaschine
DE102008044515B4 (de) * 2008-09-10 2015-08-13 Vistec Semiconductor Systems Gmbh Verfahren zur Kompensation der Tool induced shift bei einer Koordinaten-Messmaschine
CN114184151A (zh) * 2021-12-15 2022-03-15 上海无线电设备研究所 一种单轴坐标外推方法

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020085761A1 (en) * 2000-12-30 2002-07-04 Gary Cao Enhanced uniqueness for pattern recognition
US6598306B2 (en) * 2001-04-17 2003-07-29 Homer L. Eaton Self-loading spatial reference point array
US7519493B2 (en) 2002-02-14 2009-04-14 Faro Technologies, Inc. Portable coordinate measurement machine with integrated line laser scanner
US7881896B2 (en) 2002-02-14 2011-02-01 Faro Technologies, Inc. Portable coordinate measurement machine with integrated line laser scanner
US7246030B2 (en) * 2002-02-14 2007-07-17 Faro Technologies, Inc. Portable coordinate measurement machine with integrated line laser scanner
JP3821739B2 (ja) * 2002-03-22 2006-09-13 株式会社ミツトヨ 測定データ整形方法
US6948254B2 (en) * 2003-10-27 2005-09-27 Micronic Laser Systems Ab Method for calibration of a metrology stage
US8825444B1 (en) 2005-05-19 2014-09-02 Nanometrics Incorporated Automated system check for metrology unit
US8091003B2 (en) * 2005-11-28 2012-01-03 Mitsubishi Electric Corporation Position detection error correcting method
US7916284B2 (en) * 2006-07-18 2011-03-29 Asml Netherlands B.V. Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method
US7853038B2 (en) * 2007-01-04 2010-12-14 Industrial Technology Research Institute Systems and methods for object dimension estimation
JP5468726B2 (ja) * 2007-05-23 2014-04-09 株式会社ミツトヨ 二次元格子校正装置、二次元格子校正プログラム、記録媒体
JP5438988B2 (ja) * 2009-02-17 2014-03-12 株式会社ミツトヨ 測定システムおよび干渉計
US8453337B2 (en) * 2009-06-02 2013-06-04 James Richard Lacy System and method for workpiece coordinate measurements
DE102009025895A1 (de) * 2009-06-02 2010-12-09 Kla-Tencor Mie Gmbh Koordinaten-Messmaschine und Verfahren zur Überwachung und Korrektur von systembedingten Fehlern
NL2005412A (en) * 2009-10-28 2011-05-02 Asml Netherlands Bv Calibration method and lithographic apparatus using such a calibration method.
US9393694B2 (en) 2010-05-14 2016-07-19 Cognex Corporation System and method for robust calibration between a machine vision system and a robot
KR101616366B1 (ko) * 2014-11-27 2016-04-29 삼성중공업(주) 계측기 보상 장치 및 방법
CN107014331B (zh) * 2017-05-31 2023-01-20 中国计量大学 一种关节臂测量力误差辨识装置及误差辨识校正方法
CN112414352B (zh) * 2020-11-10 2022-04-01 重庆市计量质量检测研究院 凸轮轴上被测对象的采样位姿修正与轮廓形貌测量方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4583298A (en) * 1984-03-07 1986-04-22 Hewlett-Packard Company Auto calibration method suitable for use in electron beam lithography

Family Cites Families (4)

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Publication number Priority date Publication date Assignee Title
JPH0814484B2 (ja) 1985-04-09 1996-02-14 株式会社ニコン パタ−ン位置測定装置
DE3637410A1 (de) * 1986-11-03 1988-05-11 Zeiss Carl Fa Verfahren zur messung von drehtischabweichungen
DE4006835A1 (de) * 1990-03-05 1991-09-12 Eugen Dr Ing Trapet Verfahren zur kalibrierung von zweidimensionalen pruefkoerpern mit elimination systematischer fehler des messgeraets
DE19523885A1 (de) * 1995-06-30 1997-01-02 Zeiss Carl Fa Verfahren zur Filterung von Meßwertkurven

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4583298A (en) * 1984-03-07 1986-04-22 Hewlett-Packard Company Auto calibration method suitable for use in electron beam lithography

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10224993C1 (de) * 2002-06-05 2003-08-21 Siemens Ag Verfahren zur Vermessung der Verzerrung einer Flächen-Positioniervorrichtung
WO2008055589A3 (en) * 2006-11-09 2008-10-02 Zeiss Carl Sms Gmbh Method for determination of residual errors
US8416412B2 (en) 2006-11-09 2013-04-09 Carl Zeiss Sms Gmbh Method for determination of residual errors
DE102007000999A1 (de) 2007-02-26 2008-08-28 Vistec Semiconductor Systems Gmbh Verfahren zur Beseitigung von Fehlerquellen der Systemkorrektur einer Koordinaten-Messmaschine
DE102007000999B4 (de) * 2007-02-26 2012-06-28 Vistec Semiconductor Systems Gmbh Verfahren zur Beseitigung von Fehlerquellen der Systemkorrektur einer Koordinaten-Messmaschine
DE102007030390B4 (de) * 2007-06-29 2010-05-12 Vistec Semiconductor Systems Gmbh Koordinaten-Messmaschine und Verfahren zur Kalibrierung der Koordinaten-Messmaschine
DE102007030390A1 (de) * 2007-06-29 2009-01-02 Vistec Semiconductor Systems Gmbh Koordinaten-Messmaschine und Verfahren zur Kalibrierung der Koordinaten-Messmaschine
US8115808B2 (en) 2007-06-29 2012-02-14 Vistec Semiconductor Systems Gmbh Coordinate measuring machine and method for calibrating the coordinate measuring machine
DE102007033345A1 (de) * 2007-07-16 2009-02-05 Vistec Semiconductor Systems Gmbh Verfahren zur Korrektur eines Fehlers des Abbildungssystems einer Koordinaten-Messmaschine
US7680616B2 (en) 2007-07-16 2010-03-16 Vistec Semiconductor Systems Gmbh Method for correcting an error of the imaging system of a coordinate measuring machine
DE102007033345B4 (de) * 2007-07-16 2009-07-16 Vistec Semiconductor Systems Gmbh Verfahren zur Korrektur von Abbildungsfehlern einer Messoptik einer Koordinaten-Messmaschine
DE102007039983A1 (de) * 2007-08-23 2009-02-26 Vistec Semiconductor Systems Gmbh Verfahren zum Messen von Positionen von Strukturen auf einem Substrat mit einer Koordinaten Messmaschine
DE102007000973A1 (de) * 2007-11-05 2009-05-14 Vistec Semiconductor Systems Gmbh Maske und Verfahren zur Bestimmung der Drehlage der Maske
DE102007000973B4 (de) * 2007-11-05 2013-10-02 Vistec Semiconductor Systems Gmbh Maske, Verwendung der Maske in einer Koordinaten-Messmaschine und Verfahren zur Bestimmung der Drehlage der Maske
DE102008044515B4 (de) * 2008-09-10 2015-08-13 Vistec Semiconductor Systems Gmbh Verfahren zur Kompensation der Tool induced shift bei einer Koordinaten-Messmaschine
DE102009003503A1 (de) 2009-02-18 2010-08-19 Vistec Semiconductor Systems Gmbh Verfahren zur Kalibrierung eines Messtisches einer Koordinaten-Messmaschine
US7823295B2 (en) 2009-02-18 2010-11-02 Vistec Semiconductor Systems Gmbh Method for calibration of a measuring table of a coordinate measuring machine
CN114184151A (zh) * 2021-12-15 2022-03-15 上海无线电设备研究所 一种单轴坐标外推方法
CN114184151B (zh) * 2021-12-15 2024-01-02 上海无线电设备研究所 一种单轴坐标外推方法

Also Published As

Publication number Publication date
JP2001502433A (ja) 2001-02-20
US6317991B1 (en) 2001-11-20
EP0931241B1 (de) 2003-08-13
KR20000068713A (ko) 2000-11-25
TW393564B (en) 2000-06-11
DE59809276D1 (de) 2003-09-18
EP0931241A1 (de) 1999-07-28
WO1999008070A1 (de) 1999-02-18

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Legal Events

Date Code Title Description
8100 Publication of the examined application without publication of unexamined application
D1 Grant (no unexamined application published) patent law 81
8327 Change in the person/name/address of the patent owner

Owner name: LEICA MICROSYSTEMS WETZLAR GMBH, 35578 WETZLAR, DE

8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: LEICA MICROSYSTEMS SEMICONDUCTOR GMBH, 35578 WETZL

8327 Change in the person/name/address of the patent owner

Owner name: LEICA MICROSYSTEMS WETZLAR GMBH, 35578 WETZLAR, DE

R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee