KR20000068713A - 좌표 측정기의 측정 오차 보정 방법 - Google Patents
좌표 측정기의 측정 오차 보정 방법 Download PDFInfo
- Publication number
- KR20000068713A KR20000068713A KR1019997002954A KR19997002954A KR20000068713A KR 20000068713 A KR20000068713 A KR 20000068713A KR 1019997002954 A KR1019997002954 A KR 1019997002954A KR 19997002954 A KR19997002954 A KR 19997002954A KR 20000068713 A KR20000068713 A KR 20000068713A
- Authority
- KR
- South Korea
- Prior art keywords
- function
- rotation
- coordinates
- reference sample
- fit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- 238000000034 method Methods 0.000 title claims abstract description 23
- 238000005259 measurement Methods 0.000 title claims description 28
- 238000012937 correction Methods 0.000 claims abstract description 78
- 239000013074 reference sample Substances 0.000 claims abstract description 78
- 239000000523 sample Substances 0.000 claims abstract description 19
- 238000012360 testing method Methods 0.000 claims description 21
- 230000008878 coupling Effects 0.000 claims description 18
- 238000010168 coupling process Methods 0.000 claims description 18
- 238000005859 coupling reaction Methods 0.000 claims description 18
- 230000001419 dependent effect Effects 0.000 claims description 2
- 238000003556 assay Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000018109 developmental process Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 238000004364 calculation method Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000012886 linear function Methods 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000009897 systematic effect Effects 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
- G01B21/02—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness
- G01B21/04—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness by measuring coordinates of points
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
- G03F7/70725—Stages control
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
- G01B21/02—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness
- G01B21/04—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness by measuring coordinates of points
- G01B21/042—Calibration or calibration artifacts
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
- G03F7/70516—Calibration of components of the microlithographic apparatus, e.g. light sources, addressable masks or detectors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70616—Monitoring the printed patterns
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Length Measuring Devices With Unspecified Measuring Means (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Image Processing (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19734695A DE19734695C1 (de) | 1997-08-11 | 1997-08-11 | Verfahren zur Korrektur der Messfehler einer Koodinaten-Messmaschine |
| DE19734695.2 | 1997-08-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20000068713A true KR20000068713A (ko) | 2000-11-25 |
Family
ID=7838600
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019997002954A Ceased KR20000068713A (ko) | 1997-08-11 | 1998-06-25 | 좌표 측정기의 측정 오차 보정 방법 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US6317991B1 (enExample) |
| EP (1) | EP0931241B1 (enExample) |
| JP (1) | JP2001502433A (enExample) |
| KR (1) | KR20000068713A (enExample) |
| DE (2) | DE19734695C1 (enExample) |
| TW (1) | TW393564B (enExample) |
| WO (1) | WO1999008070A1 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101616366B1 (ko) * | 2014-11-27 | 2016-04-29 | 삼성중공업(주) | 계측기 보상 장치 및 방법 |
Families Citing this family (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020085761A1 (en) * | 2000-12-30 | 2002-07-04 | Gary Cao | Enhanced uniqueness for pattern recognition |
| US6598306B2 (en) * | 2001-04-17 | 2003-07-29 | Homer L. Eaton | Self-loading spatial reference point array |
| US7519493B2 (en) | 2002-02-14 | 2009-04-14 | Faro Technologies, Inc. | Portable coordinate measurement machine with integrated line laser scanner |
| US7881896B2 (en) | 2002-02-14 | 2011-02-01 | Faro Technologies, Inc. | Portable coordinate measurement machine with integrated line laser scanner |
| US7246030B2 (en) * | 2002-02-14 | 2007-07-17 | Faro Technologies, Inc. | Portable coordinate measurement machine with integrated line laser scanner |
| JP3821739B2 (ja) * | 2002-03-22 | 2006-09-13 | 株式会社ミツトヨ | 測定データ整形方法 |
| DE10224993C1 (de) * | 2002-06-05 | 2003-08-21 | Siemens Ag | Verfahren zur Vermessung der Verzerrung einer Flächen-Positioniervorrichtung |
| US6948254B2 (en) * | 2003-10-27 | 2005-09-27 | Micronic Laser Systems Ab | Method for calibration of a metrology stage |
| US8825444B1 (en) | 2005-05-19 | 2014-09-02 | Nanometrics Incorporated | Automated system check for metrology unit |
| US8091003B2 (en) * | 2005-11-28 | 2012-01-03 | Mitsubishi Electric Corporation | Position detection error correcting method |
| US7916284B2 (en) * | 2006-07-18 | 2011-03-29 | Asml Netherlands B.V. | Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method |
| US8416412B2 (en) | 2006-11-09 | 2013-04-09 | Carl Zeiss Sms Gmbh | Method for determination of residual errors |
| US7853038B2 (en) * | 2007-01-04 | 2010-12-14 | Industrial Technology Research Institute | Systems and methods for object dimension estimation |
| DE102007000999B4 (de) | 2007-02-26 | 2012-06-28 | Vistec Semiconductor Systems Gmbh | Verfahren zur Beseitigung von Fehlerquellen der Systemkorrektur einer Koordinaten-Messmaschine |
| JP5468726B2 (ja) * | 2007-05-23 | 2014-04-09 | 株式会社ミツトヨ | 二次元格子校正装置、二次元格子校正プログラム、記録媒体 |
| DE102007030390B4 (de) * | 2007-06-29 | 2010-05-12 | Vistec Semiconductor Systems Gmbh | Koordinaten-Messmaschine und Verfahren zur Kalibrierung der Koordinaten-Messmaschine |
| DE102007033345B4 (de) | 2007-07-16 | 2009-07-16 | Vistec Semiconductor Systems Gmbh | Verfahren zur Korrektur von Abbildungsfehlern einer Messoptik einer Koordinaten-Messmaschine |
| DE102007039983A1 (de) * | 2007-08-23 | 2009-02-26 | Vistec Semiconductor Systems Gmbh | Verfahren zum Messen von Positionen von Strukturen auf einem Substrat mit einer Koordinaten Messmaschine |
| DE102007000973B4 (de) * | 2007-11-05 | 2013-10-02 | Vistec Semiconductor Systems Gmbh | Maske, Verwendung der Maske in einer Koordinaten-Messmaschine und Verfahren zur Bestimmung der Drehlage der Maske |
| DE102008044515B4 (de) * | 2008-09-10 | 2015-08-13 | Vistec Semiconductor Systems Gmbh | Verfahren zur Kompensation der Tool induced shift bei einer Koordinaten-Messmaschine |
| JP5438988B2 (ja) * | 2009-02-17 | 2014-03-12 | 株式会社ミツトヨ | 測定システムおよび干渉計 |
| DE102009003503A1 (de) | 2009-02-18 | 2010-08-19 | Vistec Semiconductor Systems Gmbh | Verfahren zur Kalibrierung eines Messtisches einer Koordinaten-Messmaschine |
| US8453337B2 (en) * | 2009-06-02 | 2013-06-04 | James Richard Lacy | System and method for workpiece coordinate measurements |
| DE102009025895A1 (de) * | 2009-06-02 | 2010-12-09 | Kla-Tencor Mie Gmbh | Koordinaten-Messmaschine und Verfahren zur Überwachung und Korrektur von systembedingten Fehlern |
| NL2005412A (en) * | 2009-10-28 | 2011-05-02 | Asml Netherlands Bv | Calibration method and lithographic apparatus using such a calibration method. |
| US9393694B2 (en) | 2010-05-14 | 2016-07-19 | Cognex Corporation | System and method for robust calibration between a machine vision system and a robot |
| CN107014331B (zh) * | 2017-05-31 | 2023-01-20 | 中国计量大学 | 一种关节臂测量力误差辨识装置及误差辨识校正方法 |
| CN112414352B (zh) * | 2020-11-10 | 2022-04-01 | 重庆市计量质量检测研究院 | 凸轮轴上被测对象的采样位姿修正与轮廓形貌测量方法 |
| CN114184151B (zh) * | 2021-12-15 | 2024-01-02 | 上海无线电设备研究所 | 一种单轴坐标外推方法 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4583298A (en) * | 1984-03-07 | 1986-04-22 | Hewlett-Packard Company | Auto calibration method suitable for use in electron beam lithography |
| JPH0814484B2 (ja) | 1985-04-09 | 1996-02-14 | 株式会社ニコン | パタ−ン位置測定装置 |
| DE3637410A1 (de) * | 1986-11-03 | 1988-05-11 | Zeiss Carl Fa | Verfahren zur messung von drehtischabweichungen |
| DE4006835A1 (de) * | 1990-03-05 | 1991-09-12 | Eugen Dr Ing Trapet | Verfahren zur kalibrierung von zweidimensionalen pruefkoerpern mit elimination systematischer fehler des messgeraets |
| DE19523885A1 (de) * | 1995-06-30 | 1997-01-02 | Zeiss Carl Fa | Verfahren zur Filterung von Meßwertkurven |
-
1997
- 1997-08-11 DE DE19734695A patent/DE19734695C1/de not_active Expired - Fee Related
-
1998
- 1998-06-25 DE DE59809276T patent/DE59809276D1/de not_active Expired - Fee Related
- 1998-06-25 JP JP11511495A patent/JP2001502433A/ja not_active Ceased
- 1998-06-25 WO PCT/DE1998/001744 patent/WO1999008070A1/de not_active Ceased
- 1998-06-25 US US09/269,768 patent/US6317991B1/en not_active Expired - Lifetime
- 1998-06-25 EP EP98936250A patent/EP0931241B1/de not_active Expired - Lifetime
- 1998-06-25 KR KR1019997002954A patent/KR20000068713A/ko not_active Ceased
- 1998-07-17 TW TW087111708A patent/TW393564B/zh not_active IP Right Cessation
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101616366B1 (ko) * | 2014-11-27 | 2016-04-29 | 삼성중공업(주) | 계측기 보상 장치 및 방법 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2001502433A (ja) | 2001-02-20 |
| US6317991B1 (en) | 2001-11-20 |
| DE19734695C1 (de) | 1998-11-05 |
| EP0931241B1 (de) | 2003-08-13 |
| TW393564B (en) | 2000-06-11 |
| DE59809276D1 (de) | 2003-09-18 |
| EP0931241A1 (de) | 1999-07-28 |
| WO1999008070A1 (de) | 1999-02-18 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0105 | International application |
Patent event date: 19990406 Patent event code: PA01051R01D Comment text: International Patent Application |
|
| PG1501 | Laying open of application | ||
| A201 | Request for examination | ||
| PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 20030514 Comment text: Request for Examination of Application |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20050228 Patent event code: PE09021S01D |
|
| E601 | Decision to refuse application | ||
| PE0601 | Decision on rejection of patent |
Patent event date: 20050601 Comment text: Decision to Refuse Application Patent event code: PE06012S01D Patent event date: 20050228 Comment text: Notification of reason for refusal Patent event code: PE06011S01I |