JP2001502433A - 座標測定機の測定誤差の補正方法 - Google Patents

座標測定機の測定誤差の補正方法

Info

Publication number
JP2001502433A
JP2001502433A JP11511495A JP51149599A JP2001502433A JP 2001502433 A JP2001502433 A JP 2001502433A JP 11511495 A JP11511495 A JP 11511495A JP 51149599 A JP51149599 A JP 51149599A JP 2001502433 A JP2001502433 A JP 2001502433A
Authority
JP
Japan
Prior art keywords
rotation
reference object
coordinates
calibration
correction function
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
JP11511495A
Other languages
English (en)
Japanese (ja)
Other versions
JP2001502433A5 (enExample
Inventor
リン、クラオス
Original Assignee
ライカ ミクロジュステムス ヴェツラー ゲーエムベーハー
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ライカ ミクロジュステムス ヴェツラー ゲーエムベーハー filed Critical ライカ ミクロジュステムス ヴェツラー ゲーエムベーハー
Publication of JP2001502433A publication Critical patent/JP2001502433A/ja
Publication of JP2001502433A5 publication Critical patent/JP2001502433A5/ja
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
    • G01B21/02—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness
    • G01B21/04—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness by measuring coordinates of points
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G03F7/70725—Stages control
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
    • G01B21/02—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness
    • G01B21/04—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness by measuring coordinates of points
    • G01B21/042—Calibration or calibration artifacts
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/70516—Calibration of components of the microlithographic apparatus, e.g. light sources, addressable masks or detectors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Length Measuring Devices With Unspecified Measuring Means (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Image Processing (AREA)
JP11511495A 1997-08-11 1998-06-25 座標測定機の測定誤差の補正方法 Ceased JP2001502433A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19734695A DE19734695C1 (de) 1997-08-11 1997-08-11 Verfahren zur Korrektur der Messfehler einer Koodinaten-Messmaschine
DE19734695.2 1997-08-11
PCT/DE1998/001744 WO1999008070A1 (de) 1997-08-11 1998-06-25 Verfahren zur korrektur der messfehler einer koordinaten-messmaschine

Publications (2)

Publication Number Publication Date
JP2001502433A true JP2001502433A (ja) 2001-02-20
JP2001502433A5 JP2001502433A5 (enExample) 2005-07-14

Family

ID=7838600

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11511495A Ceased JP2001502433A (ja) 1997-08-11 1998-06-25 座標測定機の測定誤差の補正方法

Country Status (7)

Country Link
US (1) US6317991B1 (enExample)
EP (1) EP0931241B1 (enExample)
JP (1) JP2001502433A (enExample)
KR (1) KR20000068713A (enExample)
DE (2) DE19734695C1 (enExample)
TW (1) TW393564B (enExample)
WO (1) WO1999008070A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008292259A (ja) * 2007-05-23 2008-12-04 Mitsutoyo Corp 二次元格子校正装置、二次元格子校正方法、二次元格子校正プログラム、記録媒体
CN112414352A (zh) * 2020-11-10 2021-02-26 重庆市计量质量检测研究院 凸轮轴上被测对象的采样位姿修正与轮廓形貌测量方法

Families Citing this family (28)

* Cited by examiner, † Cited by third party
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US20020085761A1 (en) * 2000-12-30 2002-07-04 Gary Cao Enhanced uniqueness for pattern recognition
US6598306B2 (en) * 2001-04-17 2003-07-29 Homer L. Eaton Self-loading spatial reference point array
US7519493B2 (en) 2002-02-14 2009-04-14 Faro Technologies, Inc. Portable coordinate measurement machine with integrated line laser scanner
US7881896B2 (en) 2002-02-14 2011-02-01 Faro Technologies, Inc. Portable coordinate measurement machine with integrated line laser scanner
US7246030B2 (en) * 2002-02-14 2007-07-17 Faro Technologies, Inc. Portable coordinate measurement machine with integrated line laser scanner
JP3821739B2 (ja) * 2002-03-22 2006-09-13 株式会社ミツトヨ 測定データ整形方法
DE10224993C1 (de) * 2002-06-05 2003-08-21 Siemens Ag Verfahren zur Vermessung der Verzerrung einer Flächen-Positioniervorrichtung
US6948254B2 (en) * 2003-10-27 2005-09-27 Micronic Laser Systems Ab Method for calibration of a metrology stage
US8825444B1 (en) 2005-05-19 2014-09-02 Nanometrics Incorporated Automated system check for metrology unit
US8091003B2 (en) * 2005-11-28 2012-01-03 Mitsubishi Electric Corporation Position detection error correcting method
US7916284B2 (en) * 2006-07-18 2011-03-29 Asml Netherlands B.V. Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method
US8416412B2 (en) 2006-11-09 2013-04-09 Carl Zeiss Sms Gmbh Method for determination of residual errors
US7853038B2 (en) * 2007-01-04 2010-12-14 Industrial Technology Research Institute Systems and methods for object dimension estimation
DE102007000999B4 (de) 2007-02-26 2012-06-28 Vistec Semiconductor Systems Gmbh Verfahren zur Beseitigung von Fehlerquellen der Systemkorrektur einer Koordinaten-Messmaschine
DE102007030390B4 (de) * 2007-06-29 2010-05-12 Vistec Semiconductor Systems Gmbh Koordinaten-Messmaschine und Verfahren zur Kalibrierung der Koordinaten-Messmaschine
DE102007033345B4 (de) 2007-07-16 2009-07-16 Vistec Semiconductor Systems Gmbh Verfahren zur Korrektur von Abbildungsfehlern einer Messoptik einer Koordinaten-Messmaschine
DE102007039983A1 (de) * 2007-08-23 2009-02-26 Vistec Semiconductor Systems Gmbh Verfahren zum Messen von Positionen von Strukturen auf einem Substrat mit einer Koordinaten Messmaschine
DE102007000973B4 (de) * 2007-11-05 2013-10-02 Vistec Semiconductor Systems Gmbh Maske, Verwendung der Maske in einer Koordinaten-Messmaschine und Verfahren zur Bestimmung der Drehlage der Maske
DE102008044515B4 (de) * 2008-09-10 2015-08-13 Vistec Semiconductor Systems Gmbh Verfahren zur Kompensation der Tool induced shift bei einer Koordinaten-Messmaschine
JP5438988B2 (ja) * 2009-02-17 2014-03-12 株式会社ミツトヨ 測定システムおよび干渉計
DE102009003503A1 (de) 2009-02-18 2010-08-19 Vistec Semiconductor Systems Gmbh Verfahren zur Kalibrierung eines Messtisches einer Koordinaten-Messmaschine
US8453337B2 (en) * 2009-06-02 2013-06-04 James Richard Lacy System and method for workpiece coordinate measurements
DE102009025895A1 (de) * 2009-06-02 2010-12-09 Kla-Tencor Mie Gmbh Koordinaten-Messmaschine und Verfahren zur Überwachung und Korrektur von systembedingten Fehlern
NL2005412A (en) * 2009-10-28 2011-05-02 Asml Netherlands Bv Calibration method and lithographic apparatus using such a calibration method.
US9393694B2 (en) 2010-05-14 2016-07-19 Cognex Corporation System and method for robust calibration between a machine vision system and a robot
KR101616366B1 (ko) * 2014-11-27 2016-04-29 삼성중공업(주) 계측기 보상 장치 및 방법
CN107014331B (zh) * 2017-05-31 2023-01-20 中国计量大学 一种关节臂测量力误差辨识装置及误差辨识校正方法
CN114184151B (zh) * 2021-12-15 2024-01-02 上海无线电设备研究所 一种单轴坐标外推方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4583298A (en) * 1984-03-07 1986-04-22 Hewlett-Packard Company Auto calibration method suitable for use in electron beam lithography
JPH0814484B2 (ja) 1985-04-09 1996-02-14 株式会社ニコン パタ−ン位置測定装置
DE3637410A1 (de) * 1986-11-03 1988-05-11 Zeiss Carl Fa Verfahren zur messung von drehtischabweichungen
DE4006835A1 (de) * 1990-03-05 1991-09-12 Eugen Dr Ing Trapet Verfahren zur kalibrierung von zweidimensionalen pruefkoerpern mit elimination systematischer fehler des messgeraets
DE19523885A1 (de) * 1995-06-30 1997-01-02 Zeiss Carl Fa Verfahren zur Filterung von Meßwertkurven

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008292259A (ja) * 2007-05-23 2008-12-04 Mitsutoyo Corp 二次元格子校正装置、二次元格子校正方法、二次元格子校正プログラム、記録媒体
CN112414352A (zh) * 2020-11-10 2021-02-26 重庆市计量质量检测研究院 凸轮轴上被测对象的采样位姿修正与轮廓形貌测量方法

Also Published As

Publication number Publication date
US6317991B1 (en) 2001-11-20
DE19734695C1 (de) 1998-11-05
EP0931241B1 (de) 2003-08-13
KR20000068713A (ko) 2000-11-25
TW393564B (en) 2000-06-11
DE59809276D1 (de) 2003-09-18
EP0931241A1 (de) 1999-07-28
WO1999008070A1 (de) 1999-02-18

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