DE19701337C2 - Gehäuse für Mehrchimpmodule - Google Patents

Gehäuse für Mehrchimpmodule

Info

Publication number
DE19701337C2
DE19701337C2 DE19701337A DE19701337A DE19701337C2 DE 19701337 C2 DE19701337 C2 DE 19701337C2 DE 19701337 A DE19701337 A DE 19701337A DE 19701337 A DE19701337 A DE 19701337A DE 19701337 C2 DE19701337 C2 DE 19701337C2
Authority
DE
Germany
Prior art keywords
housing
substrate
circuit board
base plate
pins
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE19701337A
Other languages
German (de)
English (en)
Other versions
DE19701337A1 (de
Inventor
Dean B Nicholson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Agilent Technologies Inc
Original Assignee
Agilent Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agilent Technologies Inc filed Critical Agilent Technologies Inc
Publication of DE19701337A1 publication Critical patent/DE19701337A1/de
Application granted granted Critical
Publication of DE19701337C2 publication Critical patent/DE19701337C2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H10W44/203—Electrical connections
    • H10W44/206—Wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H10W72/5475—Dispositions of multiple bond wires multiple bond wires connected to common bond pads at both ends of the wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/926—Multiple bond pads having different sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/934—Cross-sectional shape, i.e. in side view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
DE19701337A 1996-04-12 1997-01-16 Gehäuse für Mehrchimpmodule Expired - Fee Related DE19701337C2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/629,949 US5668408A (en) 1996-04-12 1996-04-12 Pin grid array solution for microwave multi-chip modules

Publications (2)

Publication Number Publication Date
DE19701337A1 DE19701337A1 (de) 1997-10-16
DE19701337C2 true DE19701337C2 (de) 2000-11-02

Family

ID=24525135

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19701337A Expired - Fee Related DE19701337C2 (de) 1996-04-12 1997-01-16 Gehäuse für Mehrchimpmodule

Country Status (4)

Country Link
US (1) US5668408A (https=)
JP (1) JPH1041421A (https=)
DE (1) DE19701337C2 (https=)
GB (1) GB2312091B (https=)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6028497A (en) * 1998-01-28 2000-02-22 Trw Inc. RF pin grid array
JP3129288B2 (ja) 1998-05-28 2001-01-29 日本電気株式会社 マイクロ波集積回路マルチチップモジュール、マイクロ波集積回路マルチチップモジュールの実装構造
JP3526788B2 (ja) * 1999-07-01 2004-05-17 沖電気工業株式会社 半導体装置の製造方法
US6323743B1 (en) 1999-08-24 2001-11-27 Tresness Irrevocable Patent Trust Electronic filter assembly
GB2371674A (en) * 2001-01-30 2002-07-31 Univ Sheffield Micro-element package
US6482038B2 (en) 2001-02-23 2002-11-19 Fci Americas Technology, Inc. Header assembly for mounting to a circuit substrate
US6498551B1 (en) * 2001-08-20 2002-12-24 Xytrans, Inc. Millimeter wave module (MMW) for microwave monolithic integrated circuit (MMIC)
US20030095014A1 (en) * 2001-11-21 2003-05-22 Lao Binneg Y. Connection package for high-speed integrated circuit
US6803252B2 (en) 2001-11-21 2004-10-12 Sierra Monolithics, Inc. Single and multiple layer packaging of high-speed/high-density ICs
US6791317B1 (en) 2002-12-02 2004-09-14 Cisco Technology, Inc. Load board for testing of RF chips
US7811100B2 (en) 2007-07-13 2010-10-12 Fci Americas Technology, Inc. Electrical connector system having a continuous ground at the mating interface thereof
US8764464B2 (en) 2008-02-29 2014-07-01 Fci Americas Technology Llc Cross talk reduction for high speed electrical connectors
EP2284881B1 (en) 2008-05-12 2021-02-17 Mitsubishi Electric Corporation High frequency module including a storing case and a plurality of high frequency circuits
US7772694B2 (en) * 2008-11-26 2010-08-10 Freescale Semiconductor, Inc. Integrated circuit module and method of packaging same
US9277649B2 (en) 2009-02-26 2016-03-01 Fci Americas Technology Llc Cross talk reduction for high-speed electrical connectors
US8267721B2 (en) 2009-10-28 2012-09-18 Fci Americas Technology Llc Electrical connector having ground plates and ground coupling bar
US8616919B2 (en) 2009-11-13 2013-12-31 Fci Americas Technology Llc Attachment system for electrical connector
DE102010030317B4 (de) * 2010-06-21 2016-09-01 Infineon Technologies Ag Schaltungsanordnung mit Shuntwiderstand
US9312817B2 (en) * 2012-07-20 2016-04-12 Freescale Semiconductor, Inc. Semiconductor package design providing reduced electromagnetic coupling between circuit components
US9240390B2 (en) 2013-06-27 2016-01-19 Freescale Semiconductor, Inc. Semiconductor packages having wire bond wall to reduce coupling
US9401342B2 (en) 2013-06-27 2016-07-26 Freescale Semiconductor, Inc. Semiconductor package having wire bond wall to reduce coupling
CN109148421B (zh) * 2018-08-31 2020-04-28 成都天箭科技股份有限公司 一种微波单片集成电路接地结构及其安装工艺
CN111707929B (zh) * 2020-06-29 2024-07-30 深圳赛西信息技术有限公司 一种pga封装微波测试夹具
FR3152928A1 (fr) * 2023-09-07 2025-03-14 Thales Interposeur coaxial hyperfréquences.

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3689804A (en) * 1971-09-30 1972-09-05 Nippon Denso Co Hybrid circuit device
GB2246470A (en) * 1990-06-22 1992-01-29 Watkins Johnson Co Microwave integrated circuit package to eliminate alumina substrate cracking and method
DE3527818C2 (https=) * 1985-08-02 1993-08-05 Technotron Elektrotechnische Geraete Und Komponenten Gmbh, 8450 Amberg, De
US5438481A (en) * 1987-11-17 1995-08-01 Advanced Interconnections Corporation Molded-in lead frames
WO1996013059A2 (en) * 1994-10-17 1996-05-02 Litton Systems, Inc. Hermetically sealed microwave integrated circuit package with ground plane fused to package frame

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4410902A (en) * 1981-03-23 1983-10-18 The United States Of America As Represented By The Secretary Of The Army Planar doped barrier semiconductor device
US5012213A (en) * 1989-12-19 1991-04-30 Motorola, Inc. Providing a PGA package with a low reflection line
US5198824A (en) * 1992-01-17 1993-03-30 Texas Instruments Incorporated High temperature co-fired ceramic integrated phased array packaging
US5235300A (en) * 1992-03-16 1993-08-10 Trw Inc. Millimeter module package
JPH05335432A (ja) * 1992-05-29 1993-12-17 Mitsubishi Materials Corp パッケージ構造体
US5481436A (en) * 1992-12-30 1996-01-02 Interconnect Systems, Inc. Multi-level assemblies and methods for interconnecting integrated circuits
US5479319A (en) * 1992-12-30 1995-12-26 Interconnect Systems, Inc. Multi-level assemblies for interconnecting integrated circuits
US5465008A (en) * 1993-10-08 1995-11-07 Stratedge Corporation Ceramic microelectronics package
US5451818A (en) * 1994-03-18 1995-09-19 Trw Inc. Millimeter wave ceramic package
JPH0846073A (ja) * 1994-07-28 1996-02-16 Mitsubishi Electric Corp 半導体装置
US5567984A (en) * 1994-12-08 1996-10-22 International Business Machines Corporation Process for fabricating an electronic circuit package
GB2298957A (en) * 1995-03-16 1996-09-18 Oxley Dev Co Ltd Microstrip microwave package

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3689804A (en) * 1971-09-30 1972-09-05 Nippon Denso Co Hybrid circuit device
DE3527818C2 (https=) * 1985-08-02 1993-08-05 Technotron Elektrotechnische Geraete Und Komponenten Gmbh, 8450 Amberg, De
US5438481A (en) * 1987-11-17 1995-08-01 Advanced Interconnections Corporation Molded-in lead frames
GB2246470A (en) * 1990-06-22 1992-01-29 Watkins Johnson Co Microwave integrated circuit package to eliminate alumina substrate cracking and method
WO1996013059A2 (en) * 1994-10-17 1996-05-02 Litton Systems, Inc. Hermetically sealed microwave integrated circuit package with ground plane fused to package frame

Also Published As

Publication number Publication date
GB2312091B (en) 2000-08-23
GB9705171D0 (en) 1997-04-30
US5668408A (en) 1997-09-16
JPH1041421A (ja) 1998-02-13
DE19701337A1 (de) 1997-10-16
GB2312091A (en) 1997-10-15

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Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
8127 New person/name/address of the applicant

Owner name: AGILENT TECHNOLOGIES, INC. (N.D.GES.D.STAATES DELA

D2 Grant after examination
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: AGILENT TECHNOLOGIES, INC. (N.D.GES.D. STAATES, US

8339 Ceased/non-payment of the annual fee