DE1959667A1 - Verfahren zur Herstellung einer Halbleitervorrichtung - Google Patents
Verfahren zur Herstellung einer HalbleitervorrichtungInfo
- Publication number
- DE1959667A1 DE1959667A1 DE19691959667 DE1959667A DE1959667A1 DE 1959667 A1 DE1959667 A1 DE 1959667A1 DE 19691959667 DE19691959667 DE 19691959667 DE 1959667 A DE1959667 A DE 1959667A DE 1959667 A1 DE1959667 A1 DE 1959667A1
- Authority
- DE
- Germany
- Prior art keywords
- layer
- base body
- dopants
- silicon
- reaction vessel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/291—Oxides or nitrides or carbides, e.g. ceramics, glass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/01—Manufacture or treatment
- H10D84/0123—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs
- H10D84/0126—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/01—Manufacture or treatment
- H10D84/02—Manufacture or treatment characterised by using material-based technologies
- H10D84/03—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology
- H10D84/038—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology using silicon technology, e.g. SiGe
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D99/00—Subject matter not provided for in other groups of this subclass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Weting (AREA)
- Formation Of Insulating Films (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US78775268A | 1968-12-30 | 1968-12-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE1959667A1 true DE1959667A1 (de) | 1970-07-02 |
Family
ID=25142422
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19691959667 Pending DE1959667A1 (de) | 1968-12-30 | 1969-11-28 | Verfahren zur Herstellung einer Halbleitervorrichtung |
Country Status (4)
| Country | Link |
|---|---|
| DE (1) | DE1959667A1 (enExample) |
| FR (1) | FR2027311B1 (enExample) |
| GB (1) | GB1265037A (enExample) |
| NL (1) | NL6918929A (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS495573A (enExample) * | 1972-05-04 | 1974-01-18 | ||
| JPS4940872A (enExample) * | 1972-08-25 | 1974-04-17 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR1198099A (fr) * | 1958-04-21 | 1959-12-04 | Silec Liaisons Elec | Procédé d'obtention de jonctions par diffusion solide dans des corps semi-conducteurs |
-
1969
- 1969-11-21 GB GB1265037D patent/GB1265037A/en not_active Expired
- 1969-11-28 DE DE19691959667 patent/DE1959667A1/de active Pending
- 1969-12-12 FR FR6943146A patent/FR2027311B1/fr not_active Expired
- 1969-12-17 NL NL6918929A patent/NL6918929A/xx unknown
Also Published As
| Publication number | Publication date |
|---|---|
| FR2027311A1 (enExample) | 1970-09-25 |
| FR2027311B1 (enExample) | 1973-10-19 |
| GB1265037A (enExample) | 1972-03-01 |
| NL6918929A (enExample) | 1970-07-02 |
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