DE1920585A1 - Verfahren zum Herstellen eines mit Loetmittel ueberzogenen,elektrisch leitenden Elementes - Google Patents
Verfahren zum Herstellen eines mit Loetmittel ueberzogenen,elektrisch leitenden ElementesInfo
- Publication number
- DE1920585A1 DE1920585A1 DE19691920585 DE1920585A DE1920585A1 DE 1920585 A1 DE1920585 A1 DE 1920585A1 DE 19691920585 DE19691920585 DE 19691920585 DE 1920585 A DE1920585 A DE 1920585A DE 1920585 A1 DE1920585 A1 DE 1920585A1
- Authority
- DE
- Germany
- Prior art keywords
- lead
- solder
- tin
- conductive element
- electrically conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims description 37
- 230000008569 process Effects 0.000 title description 14
- 238000004519 manufacturing process Methods 0.000 title description 9
- 238000005476 soldering Methods 0.000 title description 8
- 229910000679 solder Inorganic materials 0.000 claims description 34
- 150000001875 compounds Chemical class 0.000 claims description 3
- 241001122767 Theaceae Species 0.000 claims 1
- 108090000623 proteins and genes Proteins 0.000 claims 1
- 238000000576 coating method Methods 0.000 description 34
- 239000011248 coating agent Substances 0.000 description 31
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 29
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 22
- 239000000203 mixture Substances 0.000 description 21
- 239000003792 electrolyte Substances 0.000 description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 10
- 229910001128 Sn alloy Inorganic materials 0.000 description 10
- 238000009713 electroplating Methods 0.000 description 9
- 229910045601 alloy Inorganic materials 0.000 description 7
- 239000000956 alloy Substances 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 7
- 239000004020 conductor Substances 0.000 description 7
- 238000004070 electrodeposition Methods 0.000 description 6
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 230000032683 aging Effects 0.000 description 4
- 230000008901 benefit Effects 0.000 description 4
- 230000006866 deterioration Effects 0.000 description 4
- 230000005611 electricity Effects 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 150000002611 lead compounds Chemical class 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 150000003606 tin compounds Chemical class 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 239000010953 base metal Substances 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- JQJCSZOEVBFDKO-UHFFFAOYSA-N lead zinc Chemical compound [Zn].[Pb] JQJCSZOEVBFDKO-UHFFFAOYSA-N 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 238000011282 treatment Methods 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 101100400378 Mus musculus Marveld2 gene Proteins 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- MVIPDSDVSXKDLL-UHFFFAOYSA-N carbonic acid;phosphoric acid;hydrate Chemical compound O.OC(O)=O.OP(O)(O)=O MVIPDSDVSXKDLL-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 235000009508 confectionery Nutrition 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- QUQFTIVBFKLPCL-UHFFFAOYSA-L copper;2-amino-3-[(2-amino-2-carboxylatoethyl)disulfanyl]propanoate Chemical compound [Cu+2].[O-]C(=O)C(N)CSSCC(N)C([O-])=O QUQFTIVBFKLPCL-UHFFFAOYSA-L 0.000 description 1
- 239000002781 deodorant agent Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000008151 electrolyte solution Substances 0.000 description 1
- 230000004720 fertilization Effects 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000011872 intimate mixture Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
- B23K35/007—Interlayers, transition pieces for metallurgical bonding of workpieces at least one of the workpieces being of copper or another noble metal
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
- H01B1/026—Alloys based on copper
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3473—Plating of solder
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB09216/68A GB1204052A (en) | 1968-04-23 | 1968-04-23 | Improvements in or relating to soft-solder coated wire, strip or tape |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE1920585A1 true DE1920585A1 (de) | 1969-11-13 |
Family
ID=10125665
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19691920585 Pending DE1920585A1 (de) | 1968-04-23 | 1969-04-23 | Verfahren zum Herstellen eines mit Loetmittel ueberzogenen,elektrisch leitenden Elementes |
Country Status (5)
| Country | Link |
|---|---|
| DE (1) | DE1920585A1 (enExample) |
| FR (1) | FR2006737A1 (enExample) |
| GB (1) | GB1204052A (enExample) |
| NL (1) | NL6906281A (enExample) |
| SE (1) | SE348231B (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3440668A1 (de) * | 1984-11-07 | 1986-05-07 | Dr.-Ing. Max Schlötter GmbH & Co KG, 7340 Geislingen | Verfahren zur erhaltung der loetbarkeit von bleizinn-ueberzuegen |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3639218A (en) * | 1969-10-08 | 1972-02-01 | Ibm | Shelf life improvement of electroplated solder |
| FR2472252A1 (fr) * | 1979-12-18 | 1981-06-26 | Thomson Brandt | Cable electrique multifilaire isole, a conducteurs proteges, soudables et non thermo collants |
| FR2515999B1 (fr) * | 1981-11-09 | 1986-09-05 | Stephanois Rech Mec | Procede de brasage s'effectuant a basse temperature, pour permettre d'obtenir des assemblages a caracteristiques mecaniques elevees, et pieces assemblees par ce procede |
| AT386147B (de) * | 1986-04-16 | 1988-07-11 | Neumayer Karl | Verfahren zur herstellung von band- bzw. drahtfoermigem material |
| EP0365807B1 (en) * | 1988-10-12 | 1993-12-22 | International Business Machines Corporation | Bonding of metallic surfaces |
| US5038996A (en) * | 1988-10-12 | 1991-08-13 | International Business Machines Corporation | Bonding of metallic surfaces |
| US5280414A (en) * | 1990-06-11 | 1994-01-18 | International Business Machines Corp. | Au-Sn transient liquid bonding in high performance laminates |
| JP3731053B2 (ja) * | 2002-12-18 | 2006-01-05 | 独立行政法人 宇宙航空研究開発機構 | 導電性融液中の拡散係数計測方法及び導電性融液中の拡散係数計測装置 |
-
1968
- 1968-04-23 GB GB09216/68A patent/GB1204052A/en not_active Expired
-
1969
- 1969-04-16 FR FR6911742A patent/FR2006737A1/fr not_active Withdrawn
- 1969-04-21 SE SE05622/69A patent/SE348231B/xx unknown
- 1969-04-23 NL NL6906281A patent/NL6906281A/xx unknown
- 1969-04-23 DE DE19691920585 patent/DE1920585A1/de active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3440668A1 (de) * | 1984-11-07 | 1986-05-07 | Dr.-Ing. Max Schlötter GmbH & Co KG, 7340 Geislingen | Verfahren zur erhaltung der loetbarkeit von bleizinn-ueberzuegen |
| US4650548A (en) * | 1984-11-07 | 1987-03-17 | Dr.-Ing. Max Schlotter Gmbh & Co. Kg | Process for preserving the solderability of through hole plated printed circuit boards |
Also Published As
| Publication number | Publication date |
|---|---|
| SE348231B (enExample) | 1972-08-28 |
| NL6906281A (enExample) | 1969-10-27 |
| GB1204052A (en) | 1970-09-03 |
| FR2006737A1 (enExample) | 1970-01-02 |
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