GB1204052A - Improvements in or relating to soft-solder coated wire, strip or tape - Google Patents

Improvements in or relating to soft-solder coated wire, strip or tape

Info

Publication number
GB1204052A
GB1204052A GB09216/68A GB1921668A GB1204052A GB 1204052 A GB1204052 A GB 1204052A GB 09216/68 A GB09216/68 A GB 09216/68A GB 1921668 A GB1921668 A GB 1921668A GB 1204052 A GB1204052 A GB 1204052A
Authority
GB
United Kingdom
Prior art keywords
tape
strip
layer
hbf4
soft
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB09216/68A
Inventor
James Richard Knight
Peter Steel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BASF Catalysts UK Holdings Ltd
Original Assignee
Engelhard Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Engelhard Industries Ltd filed Critical Engelhard Industries Ltd
Priority to GB09216/68A priority Critical patent/GB1204052A/en
Priority to FR6911742A priority patent/FR2006737A1/fr
Priority to SE05622/69A priority patent/SE348231B/xx
Priority to DE19691920585 priority patent/DE1920585A1/en
Priority to NL6906281A priority patent/NL6906281A/xx
Publication of GB1204052A publication Critical patent/GB1204052A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
    • B23K35/007—Interlayers, transition pieces for metallurgical bonding of workpieces at least one of the workpieces being of copper or another noble metal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3473—Plating of solder

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

1,204,052. Electro-depositing lead, tin. ENGLEHARD INDUSTRIES Ltd. April 22, 1969 [April 23, 1968], No.19216/68. Heading C7B. Soft-solder coated conductive wire, strip or tape, e.g. a lead of an electrical device such as a resistor or printed circuit, is prepared by successively electro-depositing on to the surface of the wire, strip or tape at least one layer of Pb or Pb-Sn mixture, and at least one layer of Sn or Sn-Pb mixture, preferably a Pb layer than a Sn layer. E.g., a length of Cu wire, electrolytically cleaned in an aqueous solution containing 7g/l each of NaOH and Na3 PO4 and 14g/l of Na2 CO3, rinsed, pickled in 25% HBF4 solution, and again rinsed, was passed through a first plating tank having pure Pb anodes and containing an electrolyte comprising 200g/l each of Pb (BF4)2 and HBF4 and 12g/l resorcinol, then a second plating tank having pure Sn anodes and containing an electrolyte comprising 200g/l of Sn(BF4)2, 150g/l of HBF4 and 12g/l resorcinol; the overall coating composition varied from 95%Pb: 5%Sn to 40%Pb: 60%Sn depending on the C.D. used in each tank.
GB09216/68A 1968-04-23 1968-04-23 Improvements in or relating to soft-solder coated wire, strip or tape Expired GB1204052A (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
GB09216/68A GB1204052A (en) 1968-04-23 1968-04-23 Improvements in or relating to soft-solder coated wire, strip or tape
FR6911742A FR2006737A1 (en) 1968-04-23 1969-04-16
SE05622/69A SE348231B (en) 1968-04-23 1969-04-21
DE19691920585 DE1920585A1 (en) 1968-04-23 1969-04-23 Process for the production of an electrically conductive element coated with soldering agent
NL6906281A NL6906281A (en) 1968-04-23 1969-04-23

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB09216/68A GB1204052A (en) 1968-04-23 1968-04-23 Improvements in or relating to soft-solder coated wire, strip or tape

Publications (1)

Publication Number Publication Date
GB1204052A true GB1204052A (en) 1970-09-03

Family

ID=10125665

Family Applications (1)

Application Number Title Priority Date Filing Date
GB09216/68A Expired GB1204052A (en) 1968-04-23 1968-04-23 Improvements in or relating to soft-solder coated wire, strip or tape

Country Status (5)

Country Link
DE (1) DE1920585A1 (en)
FR (1) FR2006737A1 (en)
GB (1) GB1204052A (en)
NL (1) NL6906281A (en)
SE (1) SE348231B (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2189256A (en) * 1986-04-16 1987-10-21 Neumayer Karl Strip or wire material
US5038996A (en) * 1988-10-12 1991-08-13 International Business Machines Corporation Bonding of metallic surfaces
EP0365807B1 (en) * 1988-10-12 1993-12-22 International Business Machines Corporation Bonding of metallic surfaces
US5280414A (en) * 1990-06-11 1994-01-18 International Business Machines Corp. Au-Sn transient liquid bonding in high performance laminates
US7040804B2 (en) * 2002-12-18 2006-05-09 The Institute Of Space And Astronautical Science Method for measuring diffusion coefficient in conductive melts, and apparatus for measuring the same

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3639218A (en) * 1969-10-08 1972-02-01 Ibm Shelf life improvement of electroplated solder
FR2472252A1 (en) * 1979-12-18 1981-06-26 Thomson Brandt ISOLATED MULTIFILARY ELECTRICAL CABLE WITH PROTECTIVE CONDUCTORS, WELDING AND NON THERMO TIGHTENING
FR2515999B1 (en) * 1981-11-09 1986-09-05 Stephanois Rech Mec LOW TEMPERATURE BRAZING PROCESS, TO OBTAIN ASSEMBLIES WITH HIGH MECHANICAL CHARACTERISTICS, AND PARTS ASSEMBLED BY THIS PROCESS
DE3440668A1 (en) * 1984-11-07 1986-05-07 Dr.-Ing. Max Schlötter GmbH & Co KG, 7340 Geislingen METHOD FOR PRESERVING THE SOLUTABILITY OF LEAD TIN

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2189256A (en) * 1986-04-16 1987-10-21 Neumayer Karl Strip or wire material
GB2189256B (en) * 1986-04-16 1989-11-22 Neumayer Karl Strip or wire material
US5038996A (en) * 1988-10-12 1991-08-13 International Business Machines Corporation Bonding of metallic surfaces
EP0365807B1 (en) * 1988-10-12 1993-12-22 International Business Machines Corporation Bonding of metallic surfaces
US5280414A (en) * 1990-06-11 1994-01-18 International Business Machines Corp. Au-Sn transient liquid bonding in high performance laminates
US7040804B2 (en) * 2002-12-18 2006-05-09 The Institute Of Space And Astronautical Science Method for measuring diffusion coefficient in conductive melts, and apparatus for measuring the same

Also Published As

Publication number Publication date
FR2006737A1 (en) 1970-01-02
SE348231B (en) 1972-08-28
NL6906281A (en) 1969-10-27
DE1920585A1 (en) 1969-11-13

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PLNP Patent lapsed through nonpayment of renewal fees