GB1204052A - Improvements in or relating to soft-solder coated wire, strip or tape - Google Patents
Improvements in or relating to soft-solder coated wire, strip or tapeInfo
- Publication number
- GB1204052A GB1204052A GB09216/68A GB1921668A GB1204052A GB 1204052 A GB1204052 A GB 1204052A GB 09216/68 A GB09216/68 A GB 09216/68A GB 1921668 A GB1921668 A GB 1921668A GB 1204052 A GB1204052 A GB 1204052A
- Authority
- GB
- United Kingdom
- Prior art keywords
- tape
- strip
- layer
- hbf4
- soft
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910000679 solder Inorganic materials 0.000 title abstract 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 abstract 4
- 229910052718 tin Inorganic materials 0.000 abstract 4
- 229910004039 HBF4 Inorganic materials 0.000 abstract 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 abstract 3
- 229910052745 lead Inorganic materials 0.000 abstract 3
- 238000000151 deposition Methods 0.000 abstract 2
- 239000003792 electrolyte Substances 0.000 abstract 2
- 239000000203 mixture Substances 0.000 abstract 2
- 238000007747 plating Methods 0.000 abstract 2
- 229910020220 Pb—Sn Inorganic materials 0.000 abstract 1
- 229910020816 Sn Pb Inorganic materials 0.000 abstract 1
- 229910009195 Sn(BF4)2 Inorganic materials 0.000 abstract 1
- 229910020922 Sn-Pb Inorganic materials 0.000 abstract 1
- 229910008783 Sn—Pb Inorganic materials 0.000 abstract 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract 1
- 239000007864 aqueous solution Substances 0.000 abstract 1
- 239000008199 coating composition Substances 0.000 abstract 1
- 239000000243 solution Substances 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
- B23K35/007—Interlayers, transition pieces for metallurgical bonding of workpieces at least one of the workpieces being of copper or another noble metal
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
- H01B1/026—Alloys based on copper
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3473—Plating of solder
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Electroplating Methods And Accessories (AREA)
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB09216/68A GB1204052A (en) | 1968-04-23 | 1968-04-23 | Improvements in or relating to soft-solder coated wire, strip or tape |
| FR6911742A FR2006737A1 (enExample) | 1968-04-23 | 1969-04-16 | |
| SE05622/69A SE348231B (enExample) | 1968-04-23 | 1969-04-21 | |
| NL6906281A NL6906281A (enExample) | 1968-04-23 | 1969-04-23 | |
| DE19691920585 DE1920585A1 (de) | 1968-04-23 | 1969-04-23 | Verfahren zum Herstellen eines mit Loetmittel ueberzogenen,elektrisch leitenden Elementes |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB09216/68A GB1204052A (en) | 1968-04-23 | 1968-04-23 | Improvements in or relating to soft-solder coated wire, strip or tape |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1204052A true GB1204052A (en) | 1970-09-03 |
Family
ID=10125665
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB09216/68A Expired GB1204052A (en) | 1968-04-23 | 1968-04-23 | Improvements in or relating to soft-solder coated wire, strip or tape |
Country Status (5)
| Country | Link |
|---|---|
| DE (1) | DE1920585A1 (enExample) |
| FR (1) | FR2006737A1 (enExample) |
| GB (1) | GB1204052A (enExample) |
| NL (1) | NL6906281A (enExample) |
| SE (1) | SE348231B (enExample) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2189256A (en) * | 1986-04-16 | 1987-10-21 | Neumayer Karl | Strip or wire material |
| US5038996A (en) * | 1988-10-12 | 1991-08-13 | International Business Machines Corporation | Bonding of metallic surfaces |
| EP0365807B1 (en) * | 1988-10-12 | 1993-12-22 | International Business Machines Corporation | Bonding of metallic surfaces |
| US5280414A (en) * | 1990-06-11 | 1994-01-18 | International Business Machines Corp. | Au-Sn transient liquid bonding in high performance laminates |
| US7040804B2 (en) * | 2002-12-18 | 2006-05-09 | The Institute Of Space And Astronautical Science | Method for measuring diffusion coefficient in conductive melts, and apparatus for measuring the same |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3639218A (en) * | 1969-10-08 | 1972-02-01 | Ibm | Shelf life improvement of electroplated solder |
| FR2472252A1 (fr) * | 1979-12-18 | 1981-06-26 | Thomson Brandt | Cable electrique multifilaire isole, a conducteurs proteges, soudables et non thermo collants |
| FR2515999B1 (fr) * | 1981-11-09 | 1986-09-05 | Stephanois Rech Mec | Procede de brasage s'effectuant a basse temperature, pour permettre d'obtenir des assemblages a caracteristiques mecaniques elevees, et pieces assemblees par ce procede |
| DE3440668A1 (de) * | 1984-11-07 | 1986-05-07 | Dr.-Ing. Max Schlötter GmbH & Co KG, 7340 Geislingen | Verfahren zur erhaltung der loetbarkeit von bleizinn-ueberzuegen |
-
1968
- 1968-04-23 GB GB09216/68A patent/GB1204052A/en not_active Expired
-
1969
- 1969-04-16 FR FR6911742A patent/FR2006737A1/fr not_active Withdrawn
- 1969-04-21 SE SE05622/69A patent/SE348231B/xx unknown
- 1969-04-23 NL NL6906281A patent/NL6906281A/xx unknown
- 1969-04-23 DE DE19691920585 patent/DE1920585A1/de active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2189256A (en) * | 1986-04-16 | 1987-10-21 | Neumayer Karl | Strip or wire material |
| GB2189256B (en) * | 1986-04-16 | 1989-11-22 | Neumayer Karl | Strip or wire material |
| US5038996A (en) * | 1988-10-12 | 1991-08-13 | International Business Machines Corporation | Bonding of metallic surfaces |
| EP0365807B1 (en) * | 1988-10-12 | 1993-12-22 | International Business Machines Corporation | Bonding of metallic surfaces |
| US5280414A (en) * | 1990-06-11 | 1994-01-18 | International Business Machines Corp. | Au-Sn transient liquid bonding in high performance laminates |
| US7040804B2 (en) * | 2002-12-18 | 2006-05-09 | The Institute Of Space And Astronautical Science | Method for measuring diffusion coefficient in conductive melts, and apparatus for measuring the same |
Also Published As
| Publication number | Publication date |
|---|---|
| DE1920585A1 (de) | 1969-11-13 |
| SE348231B (enExample) | 1972-08-28 |
| NL6906281A (enExample) | 1969-10-27 |
| FR2006737A1 (enExample) | 1970-01-02 |
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| SU134737A1 (ru) | Токопровод ща паста | |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PS | Patent sealed [section 19, patents act 1949] | ||
| PLNP | Patent lapsed through nonpayment of renewal fees |