DE1812942C3 - Halbleiteranordnung und Schaltungsanordnung mit einer solchen Halbleiteranordnung - Google Patents

Halbleiteranordnung und Schaltungsanordnung mit einer solchen Halbleiteranordnung

Info

Publication number
DE1812942C3
DE1812942C3 DE1812942A DE1812942A DE1812942C3 DE 1812942 C3 DE1812942 C3 DE 1812942C3 DE 1812942 A DE1812942 A DE 1812942A DE 1812942 A DE1812942 A DE 1812942A DE 1812942 C3 DE1812942 C3 DE 1812942C3
Authority
DE
Germany
Prior art keywords
electrode
semiconductor
extend
conductor
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE1812942A
Other languages
German (de)
English (en)
Other versions
DE1812942B2 (de
DE1812942A1 (de
Inventor
Anonius Hubertus Eindhoven Hilbers (Niederlande)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Publication of DE1812942A1 publication Critical patent/DE1812942A1/de
Publication of DE1812942B2 publication Critical patent/DE1812942B2/de
Application granted granted Critical
Publication of DE1812942C3 publication Critical patent/DE1812942C3/de
Expired legal-status Critical Current

Links

Classifications

    • H10W99/00
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0216Reduction of cross-talk, noise or electromagnetic interference
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits
    • H05K1/115Via connections; Lands around holes or via connections
    • H05K1/116Lands, clearance holes or other lay-out details concerning the surrounding of a via
    • H10W44/20
    • H10W70/481
    • H10W72/20
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07Electric details
    • H05K2201/0776Resistance and impedance
    • H05K2201/0792Means against parasitic impedance; Means against eddy currents
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09654Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09772Conductors directly under a component but not electrically connected to the component
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10166Transistor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447Lead-in-hole components
    • H10W72/5522
    • H10W72/5524
    • H10W90/756

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Junction Field-Effect Transistors (AREA)
  • Wire Bonding (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Bipolar Transistors (AREA)
  • Amplifiers (AREA)
DE1812942A 1967-12-22 1968-12-05 Halbleiteranordnung und Schaltungsanordnung mit einer solchen Halbleiteranordnung Expired DE1812942C3 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL6717634A NL6717634A (enExample) 1967-12-22 1967-12-22

Publications (3)

Publication Number Publication Date
DE1812942A1 DE1812942A1 (de) 1969-07-03
DE1812942B2 DE1812942B2 (de) 1980-04-24
DE1812942C3 true DE1812942C3 (de) 1981-01-08

Family

ID=19802087

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1812942A Expired DE1812942C3 (de) 1967-12-22 1968-12-05 Halbleiteranordnung und Schaltungsanordnung mit einer solchen Halbleiteranordnung

Country Status (8)

Country Link
US (1) US3555375A (enExample)
AT (1) AT302418B (enExample)
BE (1) BE725859A (enExample)
CH (1) CH485322A (enExample)
DE (1) DE1812942C3 (enExample)
FR (1) FR1595201A (enExample)
GB (1) GB1245610A (enExample)
NL (1) NL6717634A (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3671793A (en) * 1969-09-16 1972-06-20 Itt High frequency transistor structure having an impedance transforming network incorporated on the semiconductor chip
US3649872A (en) * 1970-07-15 1972-03-14 Trw Inc Packaging structure for high-frequency semiconductor devices
DE2203892C3 (de) * 1971-02-08 1982-05-27 TRW Inc., Los Angeles, Calif. Transistoranordnung mit mehreren zur Leistungserhöhung bei hohen Frequenzen parallel geschalteten Transistorelementen
JPS52120768A (en) * 1976-04-05 1977-10-11 Nec Corp Semiconductor device
US4193083A (en) * 1977-01-07 1980-03-11 Varian Associates, Inc. Package for push-pull semiconductor devices
US4107728A (en) * 1977-01-07 1978-08-15 Varian Associates, Inc. Package for push-pull semiconductor devices
EP1237189A1 (en) 2001-02-28 2002-09-04 Motorola, Inc. Arrangement and method for impedance matching
US8034666B2 (en) * 2009-11-15 2011-10-11 Microsemi Corporation Multi-layer thick-film RF package
US8410601B2 (en) * 2009-11-15 2013-04-02 Microsemi Corporation RF package
US10137789B2 (en) * 2016-07-20 2018-11-27 Ford Global Technologies, Llc Signal pin arrangement for multi-device power module
JP6541859B1 (ja) * 2018-11-01 2019-07-10 三菱電機株式会社 電力変換装置

Also Published As

Publication number Publication date
BE725859A (enExample) 1969-06-20
AT302418B (de) 1972-10-10
NL6717634A (enExample) 1969-06-24
CH485322A (de) 1970-01-31
FR1595201A (enExample) 1970-06-08
DE1812942B2 (de) 1980-04-24
US3555375A (en) 1971-01-12
GB1245610A (en) 1971-09-08
DE1812942A1 (de) 1969-07-03

Similar Documents

Publication Publication Date Title
DE69935182T2 (de) Halbleiteranordnung
DE69637165T2 (de) Mehrschichtige gedruckte Schaltungsplatte und ihre Verwendung als Kontaktgitterpackung
EP0277546B1 (de) Halbleiteranordnung mit mindestens einem Halbleiterkörper
DE1539863C3 (de) Hochfrequenz-Hochleistungstransistor
DE2352357A1 (de) Halbleitergehaeuse
DE102006024174A1 (de) Spulenkomponente und elektronische Einrichtung
DE112016007370B4 (de) Hochfrequenzverstärker
DE1812942C3 (de) Halbleiteranordnung und Schaltungsanordnung mit einer solchen Halbleiteranordnung
DE102011082986A1 (de) Integrierte schaltkreisbaugruppe mit reduzierter parasitärerschleifeninduktivität
DE60308148T2 (de) Leistungsmodul mit geteiltem gatter und methode zur unterdrückung von schwingungen darin
DE69716081T2 (de) Rf leistungsbauteil mit einem doppelten erdschluss
DE1914442C3 (de) Halbleiteranordnung
DE10103337B4 (de) Leistungs-Halbleiterelement mit Diodeneinrichtungen zur Temperaturerfassung und zum Absorbieren von statischer Elektrizität sowie Leistungs-Halbleitervorrichtung mit einem derartigen Leistungs-Halbleiterelement
DE3309223A1 (de) Halbleiterelement mit integrierter schaltung
DE102013101266A1 (de) Schaltungsanordnung
DE3626151A1 (de) Spannungszufuehrung fuer eine integrierte halbleiterschaltung
DE2624567A1 (de) Transistorinverter
DE3033516A1 (de) Halbleiteranordnung in einem kunstharzgehaeuse
DE3326958C2 (de) Integrierte Schaltung zum Verstärken
WO2003049185A2 (de) Halbleiterbauelementanordnung mit verminderter oszillationsneigung
DE102014107271B4 (de) Halbleitermodul
DE10308556B4 (de) Feldeffekttransistorvorrichtung
DE1614236B2 (de) Halbleiteranordnung
DE602004012235T2 (de) Halbleiterbauelement, halbleiterkörper und verfahren zu seiner herstellung
DE4222785C2 (de) Halbleitervorrichtung und Verfahren zu ihrer Herstellung

Legal Events

Date Code Title Description
C3 Grant after two publication steps (3rd publication)
8339 Ceased/non-payment of the annual fee